公开(公告)号：US09610653B2

公开(公告)日：2017-04-04

申请号：US14032829

申请日：2013-09-20

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Haibin Zhang ,  Fang Shan ,  Mathew Rekow ,  Min Zhang ,  Glenn Simenson ,  Qian Xu ,  James Brookhyser ,  Joe Frankel ,  Michael Darwin ,  Jack Rundel ,  Matthew Pysher

IPC: B23K26/00 ,  B23K26/16 ,  B23K26/36 ,  B23K26/364 ,  B23K103/00

CPC classification number: B23K26/364 ,  B23K26/0006 ,  B23K26/57 ,  B23K2103/50

Abstract: The present invention is a method for separating a workpiece from a common substrate. It includes the steps of providing the workpiece, generating, within a beam source, a beam of laser pulses configured to modify a portion of the workpiece, determining a depth for creating a modified region based upon a characteristic of the workpiece and modifying a plurality of regions within the workpiece to form a plurality of modified regions. Modifying the plurality of regions includes directing the beam of laser pulses from an output of the beam source onto the workpiece, causing relative motion between the workpiece and the output of the beam source while directing the beam of laser pulses onto workpiece, and modifying a characteristic of the pulses of the beam upon generating a number of pulses which generally correspond to creating the modified regions to the determined depth.

公开(公告)号：US20210362277A1

公开(公告)日：2021-11-25

申请号：US17047254

申请日：2019-06-04

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Patrick Riechel ,  Mark Unrath ,  Jake Roberts ,  Joseph Hasty ,  James Brookhyser ,  Zachary Dunn ,  Christopher Hamner ,  Geoffrey Lott ,  Jacob Magers ,  Jack Rundel ,  Jeffrey Howerton ,  Jan Kleinert ,  Doug Hall ,  Gary Larsen ,  Julie Wilson ,  Lee Petersen ,  Mark Wegner ,  Kurt Eaton

IPC: B23K26/70 ,  B23K26/08 ,  B23K26/03 ,  B23K26/067 ,  B23K26/082 ,  B65H18/10 ,  G02F1/33 ,  G02B27/10

Abstract: Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to use of beam characterization tools to facilitate adaptive processing, process control and other desirable features. Other embodiments relate to laser power sensors incorporating integrating spheres. Still other embodiments relate to workpiece handling systems capable of simultaneously providing different workpieces to a common laser-processing apparatus. A great number of other embodiments and arrangements are also detailed.

公开(公告)号：US20140083983A1

公开(公告)日：2014-03-27

申请号：US14032829

申请日：2013-09-20

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Haibin Zhang ,  Fang SHAN ,  Mathew Rekow ,  Min Zhang ,  Glenn Simenson ,  Qian XU ,  James Brookhyser ,  Joe Frankel ,  Michael Darwin ,  Jack Rundel ,  Matthew Pysher

IPC: B23K26/36

CPC classification number: B23K26/364 ,  B23K26/0006 ,  B23K26/57 ,  B23K2103/50

Abstract: The present invention is a method for separating a workpiece from a common substrate. It includes the steps of providing the workpiece, generating, within a beam source, a beam of laser pulses configured to modify a portion of the workpiece, determining a depth for creating a modified region based upon a characteristic of the workpiece and modifying a plurality of regions within the workpiece to form a plurality of modified regions. Modifying the plurality of regions includes directing the beam of laser pulses from an output of the beam source onto the workpiece, causing relative motion between the workpiece and the output of the beam source while directing the beam of laser pulses onto workpiece, and modifying a characteristic of the pulses of the beam upon generating a number of pulses which generally correspond to creating the modified regions to the determined depth.

Abstract translation: 本发明是用于从共用基板分离工件的方法。 其包括以下步骤：提供工件，在光束源内产生构造成修改工件的一部分的激光脉冲束，基于工件的特性确定用于产生修改区域的深度，并修改多个 区域，以形成多个修改区域。 修改多个区域包括将激光脉冲束从射束源的输出引导到工件上，引起工件和光束源的输出之间的相对运动，同时将激光脉冲束引导到工件上，并修改特性 产生多个脉冲的波束的脉冲，这些脉冲通常对应于将修改的区域创建到确定的深度。