-
公开(公告)号：US20210032464A1
公开(公告)日：2021-02-04
申请号：US16956564
申请日：2018-12-06
申请人： EMS-PATENT AG
发明人： Georg STÖPPELMANN
摘要： The invention relates to polyamide moulding compounds containing the following components (A) to (D) or consisting of these components: (A) between 50 and 98 wt. % of at least one polyamide selected from the group consisting of PA 516, PA 616, PA 1016 and mixtures thereof; (B) between 0 and 30 wt. % of at least one polyamide selected from the group consisting of PA 11, PA 12, PA 416, PA 516, PA 69, PA 610, PA 612, PA 614, PA 616, PA 618, PA 816, PA 1010, PA 1012, PA 1014, PA 1016, PA 1018, PA 1212, PA 1216, PA 1218 and mixtures thereof; (C) between 2 and 25 wt. % of at least one specific impact modifier; and (D) between 0 and 20 wt. % of at least one additive; the sum of the constituent amounts of the components (A) to (D) amounting to 100 wt. %.
-
2.发明申请公开(公告)号：US20170137608A1
公开(公告)日：2017-05-18
申请号：US15349636
申请日：2016-11-11
申请人： EMS-PATENT AG
发明人： Georg STÖPPELMANN
IPC分类号： C08K7/14 , C08K5/5313 , C08K5/5393
CPC分类号： C08K7/14 , C08G67/00 , C08G67/02 , C08K5/13 , C08K5/524 , C08K5/5313 , C08K5/5317 , C08K5/5393 , C08L73/00
摘要： The present invention relates to polyketone moulding compounds based on partially crystalline, aliphatic polyketones. In particular, it relates to halogen-free, flameproof moulding compounds based on aliphatic polyketones which preferably comprise salts of phosphinic acids as flame retardant. The moulding compounds fulfil the fire protection classification V0 according to UL94 and display good mechanical properties. These moulding compounds are suitable for the production of in particular thin-walled moulded articles for the electrical and electronics industry, such as for example housings, housing components or connectors.
-
公开(公告)号：US20210086491A1
公开(公告)日：2021-03-25
申请号：US16956002
申请日：2018-12-20
申请人： EMS-PATENT AG
发明人： Georg STÖPPELMANN
IPC分类号： B32B27/32 , B32B1/08 , B32B27/08 , B32B27/22 , B32B27/20 , B32B27/30 , B32B27/34 , F16L9/12 , F16L11/04
摘要： A plastics line (1) is described with at least one layer (5) consisting of the following components:
(A) 70-94 weight percent of a polyamide selected from the following group: polyamide 516, polyamide 616, polyamide 1016 or mixtures thereof; (B) 4-20 weight percent impact modifier; (C) 2-15 weight percent of plasticiser; (D) 0-5 weight percent of additives different from (B) and (C), wherein the sum of (A)-(D) is 100 weight percent, and with the proviso that layer (5) does not contain polyamide 6, as well as a method of manufacturing such a plastic pipe and uses of such a plastic pipe.-
公开(公告)号：US20210032466A1
公开(公告)日：2021-02-04
申请号：US16956579
申请日：2018-12-17
申请人： EMS-PATENT AG
发明人： Georg STÖPPELMANN
IPC分类号： C08L77/06
摘要： The invention relates to the use of thermoplastic polyamide molding compounds to reduce the formation of solid deposits and/or coatings on tools used in thermoplastic shaping to form useful objects in discontinuous processes, in particular in injection molding, and used in continuous processes such as extrusion to form films, fibers, tubes and casings. The molding compounds used are based on polyamides which are largely based on the polyamide units (616, 516) or (916). By virtue of the use of the polyamide molding compounds according to the invention, the solid deposits and/or coatings that otherwise commonly occur in the further processing of polyamide (12) during injection molding or during extrusion, are greatly reduced or prevented.
-
公开(公告)号：US20170137609A1
公开(公告)日：2017-05-18
申请号：US15349729
申请日：2016-11-11
申请人： EMS-PATENT AG
发明人： Georg STÖPPELMANN
IPC分类号： C08K7/14 , C08K5/5313 , C08K5/5393
CPC分类号： C08K7/14 , C08G67/00 , C08G67/02 , C08K5/13 , C08K5/524 , C08K5/5313 , C08K5/5317 , C08K5/5393 , C08L73/00
摘要： The present invention relates to polyketone moulding compounds based on partially crystalline, aliphatic polyketones. In particular, it relates to fibre-reinforced moulding compounds based on aliphatic polyketones which preferably comprise small quantities of phosphinic acid or the salts thereof. The moulding compounds are distinguished by improved mechanical properties and good processability in injection moulding. These moulding compounds are suitable for the production of in particular thin-walled moulded articles for the electrical and electronics industry, such as for example housings, housing components or connectors.
-
公开(公告)号：US20210032465A1
公开(公告)日：2021-02-04
申请号：US16956576
申请日：2018-12-06
申请人： EMS-PATENT AG
IPC分类号： C08L77/06
摘要： The present invention relates to polyamide molding compounds which contain the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one amorphous or microcrystalline specific polyamide; (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 616, PA 516, PA 1016 and mixtures thereof; and (C) 0 to 16% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The present invention also relates to molded articles made of these polyamide molding compounds and the use thereof.
-
公开(公告)号：US20180155545A1
公开(公告)日：2018-06-07
申请号：US15826177
申请日：2017-11-29
申请人： EMS-PATENT AG
发明人： Georg STÖPPELMANN , Philipp HARDER , Etienne AEPLI , Ronny EBLING
CPC分类号： C08L77/02 , C08L77/06 , C08L2203/20 , C08L2205/02 , C08K5/17 , C08K5/20 , C08K5/5393 , C08K7/14
摘要： Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.
-
公开(公告)号：US20170058123A1
公开(公告)日：2017-03-02
申请号：US15253506
申请日：2016-08-31
申请人： EMS-PATENT AG
发明人： Martin SÜTTERLIN , Georg STÖPPELMANN , Ralf HALA , Ulrich PRESENZ
IPC分类号： C08L77/06
摘要： The invention relates to a polyamide moulding compound consisting of an amorphous, microcrystalline or partially crystalline polyamide or mixtures hereof, at least one impact modifier, hollow glass balls and also further additives. The invention likewise relates to moulded articles produced from this polyamide moulding compound.
摘要翻译： 本发明涉及由无定形，微晶或部分结晶的聚酰胺或其混合物组成的聚酰胺模塑料，至少一种抗冲改性剂，中空玻璃球以及其它添加剂。 本发明同样涉及由该聚酰胺模塑料生产的模塑制品。
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.014 秒)
