公开(公告)号：US11085011B2

公开(公告)日：2021-08-10

申请号：US16527809

申请日：2019-07-31

Applicant: ENTEGRIS, INC.

Inventor： Elizabeth Thomas ,  Michael White ,  Daniela White ,  Atanu Kumar Das

IPC: C11D7/32 ,  C11D11/00 ,  C11D3/30 ,  C11D3/39 ,  C11D3/395 ,  C11D3/20 ,  H01L21/02 ,  C11D3/37 ,  C11D3/22

Abstract: The invention provides a removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The composition achieves highly efficacious removal of the ceria particles and CMP by-product contaminant material from the surface of the microelectronic device.