COMPOSITIONS AND METHODS FOR SELECTIVELY ETCHING SILICON NITRIDE FILMS

    公开(公告)号:US20220389314A1

    公开(公告)日:2022-12-08

    申请号:US17749868

    申请日:2022-05-20

    申请人: ENTEGRIS, INC.

    IPC分类号: C09K13/06 H01L21/306

    摘要: The invention relates to compositions and methods for the selective wet etching of a surface of a microelectronic device that contains both silicon nitride (SiN) and polysilicon. An etching composition as described comprises phosphoric acid, certain polysilicon corrosion inhibitors, along with certain silanes. The combination of the two components was found to greatly improve the selectivity of the silicon nitride etching composition in the presence of polysilicon.