公开(公告)号：US10304710B2

公开(公告)日：2019-05-28

申请号：US14899423

申请日：2014-06-18

Applicant: ENTEGRIS, INC.

Inventor： Eric A. Kirkland ,  Barry Gregerson ,  Eric S. Olson ,  Christian Andersen ,  Jason Todd Steffens ,  Ryan Mushel ,  Karen Anderson

IPC: H01L21/673

Abstract: Apparatuses and methods providing a ballast system for adjusting the center of gravity of a standardized front opening wafer container. Various embodiments of the disclosure present ballast systems that are low profile, do not require modifications to the shell of the wafer container, and can be retrofit to existing wafer carriers. In some embodiments, these capabilities are accomplished by a ballast that mounts to a kinematic coupling plate of the wafer container. In one embodiment, the ballasting can also provide sufficient counter force to the lifting forces associated with purging of the wafer container, thereby preventing “lift off” of the wafer container during purging operations. The ballasts can be removed for shipping of the wafer container, thereby decreasing shipping costs.

公开(公告)号：USD783922S1

公开(公告)日：2017-04-11

申请号：US29511213

申请日：2014-12-08

Applicant: ENTEGRIS, INC.

Designer： Eric A. Kirkland

公开(公告)号：US20220404696A1

公开(公告)日：2022-12-22

申请号：US17842109

申请日：2022-06-16

Applicant: ENTEGRIS, INC.

Inventor： Huaping Wang ,  Eric A. Kirkland ,  Russ V. Raschke

IPC: G03F1/66 ,  H01L21/673

Abstract: An apparatus includes a reticle pod. The reticle pod includes a baseplate having a first surface, a cover having a second surface, and at least one layer. The first surface includes a first mating surface. The second surface includes a second mating surface. The at least one layer is bonded to one or more of at least a part of the first mating surface and at least a part of the second mating surface. The first surface and the second surface overlap at the first mating surface and the second mating surface when the cover is attached to the baseplate.

公开(公告)号：US10896834B2

公开(公告)日：2021-01-19

申请号：US15120973

申请日：2015-02-24

Applicant: ENTEGRIS, INC.

Inventor： Eric A. Kirkland ,  Russell V. Raschke

IPC: H01L21/673 ,  H01L21/683

Abstract: A wafer shipper utilizing wafer support rings for supporting individual wafers therein. The wafer support rings can support wafers of various thicknesses without affecting the height of the stack, and provide containment of the resident wafers within the rings during an impact event. The wafers and the rings cooperate to define voids between the wafers that act as cushions in an impact event for dampening the shock imparted on the wafers during an impact event. Likewise, some embodiments include structure that defines enclosed gas pockets between the uppermost and the lowermost wafers of the stack for dampening the effects of an impact. Various embodiments include structure that prevents wafers from “jumping” out of the wafer support rings during an impact event. Some embodiments include structure for supporting wafer flats.

公开(公告)号：USD767234S1

公开(公告)日：2016-09-20

申请号：US29519122

申请日：2015-03-02

Applicant: ENTEGRIS, INC.

Designer： Eric A. Kirkland ,  Russ V. Raschke ,  Jason T. Steffens