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    CMP PAD CONDITIONING ASSEMBLY
    2.
    发明申请
    CMP PAD CONDITIONING ASSEMBLY 审中-公开

    公开(公告)号：US20180071891A1

    公开(公告)日：2018-03-15

    申请号：US15266696

    申请日：2016-09-15

    申请人： Entegris, Inc.

    发明人： Patrick Doering ,  Rajesh Tiwari ,  Andrew Galpin

    IPC分类号： B24B53/017 ,  B24B37/34 ,  B24B37/20

    CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B37/20 ,  B24B37/34 ,  B24B53/12 ,  B24D7/04 ,  B24D7/08

    摘要： A chemical mechanical planarization (CMP) pad conditioning assembly that includes one or more support structures positioned between one or more abrasive regions of the pad conditioning assembly is disclosed. The support structures and abrasive regions can be separated by one or more channels. A top surface of the one or more support structures is not co-planar with the top surface of the abrasive regions of the pad conditioning assembly, and the height of the top surface of the one or more support structures when measured to the pad facing surface of the pad conditioning assembly backing plate is less than the height of the top surfaces of the abrasive regions when measured to the pad facing surface of the pad conditioning assembly.

    CMP pad conditioning assembly
    3.
    发明授权
    CMP pad conditioning assembly 有权

    公开(公告)号：US10471567B2

    公开(公告)日：2019-11-12

    申请号：US15266696

    申请日：2016-09-15

    申请人： Entegris, Inc.

    发明人： Patrick Doering ,  Rajesh Tiwari ,  Andrew Galpin

    IPC分类号： B24B37/04 ,  B24B53/017 ,  B24B53/12 ,  B24D7/04 ,  B24B37/20 ,  B24B37/34 ,  B24D7/08

    摘要： A chemical mechanical planarization (CMP) pad conditioning assembly that includes one or more support structures positioned between one or more abrasive regions of the pad conditioning assembly is disclosed. The support structures and abrasive regions can be separated by one or more channels. A top surface of the one or more support structures is not co-planar with the top surface of the abrasive regions of the pad conditioning assembly, and the height of the top surface of the one or more support structures when measured to the pad facing surface of the pad conditioning assembly backing plate is less than the height of the top surfaces of the abrasive regions when measured to the pad facing surface of the pad conditioning assembly.

    CMP BRUSH PACKAGING
    4.
    发明申请
    CMP BRUSH PACKAGING 有权
    CMP BRUSH包装

    公开(公告)号：US20150251834A1

    公开(公告)日：2015-09-10

    申请号：US14432457

    申请日：2013-09-28

    申请人： ENTEGRIS, INC.

    发明人： Patrick Doering ,  David Trio ,  Chintan Patel ,  Chester L. Bejtlich ,  Christopher Vroman ,  Bradley H. Wood ,  Matthew B. Nicolas

    IPC分类号： B65D77/04 ,  B65B55/00 ,  B65D85/00 ,  B65B5/04

    CPC分类号： B65D77/0426 ,  B65B5/04 ,  B65B55/00 ,  B65B2220/16 ,  B65B2220/18 ,  B65D85/00

    摘要： A method of packaging a CMP brush having a cylindrical brush portion and a pair of end connection portions. The method includes saturating the brush with a liquid; covering the cylindrical brush portion with a flexible sheet that extends around and engages the surface of the cylindrical portion; engaging each of the end connection portions with a respective end support; inserting the dampened brush into a rigid polymer tubular shipping container and supporting the end connection portions within the polymer tube; and providing an additional exterior self-supporting packaging.

    摘要翻译： 一种包括具有圆柱形刷部分和一对端连接部分的CMP刷的方法。 该方法包括用液体使刷子饱和; 用圆柱形部分的表面延伸并与其接合的柔性片覆盖圆柱形刷部分; 使每个端部连接部分与相应的端部支撑件接合; 将润湿的刷子插入刚性聚合物管状运输容器中，并支撑聚合物管内的端部连接部分; 并提供额外的外部自支撑包装。

    CMP CONDITIONER PADS WITH SUPERABRASIVE GRIT ENHANCEMENT
    5.
    发明申请
    CMP CONDITIONER PADS WITH SUPERABRASIVE GRIT ENHANCEMENT 审中-公开
    具有超级磁铁增强的CMP调节器垫

    公开(公告)号：US20150087212A1

    公开(公告)日：2015-03-26

    申请号：US14398960

    申请日：2013-05-06

    申请人： ENTEGRIS, INC.

    发明人： Patrick Doering ,  Andrew Galpin

    IPC分类号： B24B53/017

    CPC分类号： B24B53/017

    摘要： A pad conditioner for a CMP polishing pad. The pad conditioner includes a features having textured or roughened surfaces, with superabrasive grit seeds such as diamond interspersed on the roughened surface. A coating such as polycrystalline diamond can be applied over the surfaces and the grit seeds. In one embodiment, the coating has a thickness that is in the range of 50% to 100% of the larger superabrasive grit.

    摘要翻译： 一种用于CMP抛光垫的垫式调节器。 垫调节剂包括具有纹理或粗糙表面的特征，超磨料砂粒种子例如散布在粗糙表面上的金刚石。 可以在表面和砂砾种子上施加诸如多晶金刚石的涂层。 在一个实施例中，涂层的厚度在较大的超级磨料砂粒的50％至100％的范围内。