公开(公告)号：US09337408B2

公开(公告)日：2016-05-10

申请号：US14422673

申请日：2013-07-22

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Sebastian Brunner ,  Oliver Dernovsek ,  Klaus-Dieter Aichholzer ,  Georg Krenn ,  Axel Pecina ,  Christian Faistauer

IPC: H01L33/64

CPC classification number: H01L33/644 ,  H01L33/642 ,  H01L33/647

Abstract: A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.

Abstract translation: 发光二极管装置具有第一载体和布置在第一载体上的至少一个发光二极管芯片。 第一载体具有至少一个第一和第二载体部分，其中发光二极管芯片仅在第一载体部分上。 此外，第一和第二载体部分各自具有导热性。 第一载体部分的热导率为第二载体部分的热导率的至少1.5倍。 第一载体部分被第二载体部分横向包围。

公开(公告)号：US20150243865A1

公开(公告)日：2015-08-27

申请号：US14422673

申请日：2013-07-22

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Sebastian Brunner ,  Oliver Dernovsek ,  Klaus-Dieter Aichholzer ,  Georg Krenn ,  Axel Pecina ,  Christian Faistauer

IPC: H01L33/64

CPC classification number: H01L33/644 ,  H01L33/642 ,  H01L33/647

Abstract: A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.

Abstract translation: 发光二极管装置具有第一载体和布置在第一载体上的至少一个发光二极管芯片。 第一载体具有至少一个第一和第二载体部分，其中发光二极管芯片仅在第一载体部分上。 此外，第一和第二载体部分各自具有导热性。 第一载体部分的热导率为第二载体部分的热导率的至少1.5倍。 第一载体部分被第二载体部分横向包围。