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公开(公告)号：US09418980B2
公开(公告)日：2016-08-16
申请号：US14403143
申请日：2013-04-17
Applicant: EPCOS AG
Inventor： Thomas Feichtinger , Oliver Dernovsek , Klaus-Dieter Aichholzer , Sebastian Brunner
Abstract: A light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip is arranged in a manner at least partly recessed in the at least one cavity, and an ESD protection element, which is formed by a partial region of the carrier. Furthermore, a light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip arranged on the carrier, and an electrical component arranged at least partly recessed in the at least one cavity. Furthermore, the light-emitting diode device includes an ESD protection element, which is formed by a partial region of the carrier.
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2.发明授权公开(公告)号：US09825212B2
公开(公告)日：2017-11-21
申请号：US15132805
申请日：2016-04-19
Applicant: EPCOS AG
Inventor： Alexander Glazunov , Oliver Dernovsek
IPC: H01L41/08 , H01L41/083 , H01L41/047 , H01L41/187 , H01L41/273 , H01L41/297
CPC classification number: H01L41/0838 , H01L41/0471 , H01L41/0805 , H01L41/1876 , H01L41/273 , H01L41/297
Abstract: A piezoelectric multilayer component having a stack of sintered piezoelectric layers and inner electrodes arranged between the piezoelectric layers. A region which has poling cracks is present on the surface of at least one electrode, and the poling cracks are separated from a surface of at least one of the inner electrodes by the region having the poling cracks.
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公开(公告)号：US20150243865A1
公开(公告)日：2015-08-27
申请号：US14422673
申请日：2013-07-22
Applicant: EPCOS AG
Inventor： Thomas Feichtinger , Sebastian Brunner , Oliver Dernovsek , Klaus-Dieter Aichholzer , Georg Krenn , Axel Pecina , Christian Faistauer
IPC: H01L33/64
CPC classification number: H01L33/644 , H01L33/642 , H01L33/647
Abstract: A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.
Abstract translation: 发光二极管装置具有第一载体和布置在第一载体上的至少一个发光二极管芯片。 第一载体具有至少一个第一和第二载体部分，其中发光二极管芯片仅在第一载体部分上。 此外，第一和第二载体部分各自具有导热性。 第一载体部分的热导率为第二载体部分的热导率的至少1.5倍。 第一载体部分被第二载体部分横向包围。
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公开(公告)号：US10225965B2
公开(公告)日：2019-03-05
申请号：US15100283
申请日：2014-11-25
Applicant: EPCOS AG
Inventor： Oliver Dernovsek , Thomas Feichtinger
IPC: H01L33/60 , H01L23/552 , H01L25/16 , H01L41/053 , H05K9/00 , H01C1/06 , H01G2/22 , H01G4/224 , H01G4/30 , H01C7/18 , H01C7/02 , H01C7/04 , H01C7/10
Abstract: What is specified is an electronic component (100) comprising a functional body (1) provided with a reflection structure (2) wherein the reflection structure (2) is arranged and designed to reflect radiation that impinges on the electronic component (100) from outside away from the functional body (1) and wherein the electronic component (100) is radiation-passive.
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公开(公告)号：US10014459B2
公开(公告)日：2018-07-03
申请号：US15508361
申请日：2015-08-05
Applicant: EPCOS AG
Inventor： Thomas Feichtinger , Oliver Dernovsek
CPC classification number: H01L33/62 , H01L21/0254 , H01L23/34 , H01L23/60 , H01L25/0753 , H01L25/167 , H01L33/48 , H01L33/486 , H01L2924/0002 , H01L2924/00
Abstract: A light-emitting diode device is specified, comprising at least one carrier and a light-emitting diode arranged thereon. The carrier comprises a plurality of polymer layers arranged one above another. At least one polymer layer has a cutout, in which an electrical component is embedded.
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Patent Agency Ranking
公开(公告)号：US09449958B2
公开(公告)日：2016-09-20
申请号：US14403143
申请日：2013-04-17
Applicant: EPCOS AG
Inventor： Thomas Feichtinger , Oliver Dernovsek , Klaus-Dieter Aichholzer , Sebastian Brunner
CPC classification number: H01L27/0248 , H01L25/167 , H01L33/48 , H01L33/486 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2924/0002 , H01L2924/00
Abstract: A light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip is arranged in a manner at least partly recessed in the at least one cavity, and an ESD protection element, which is formed by a partial region of the carrier. Furthermore, a light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip arranged on the carrier, and an electrical component arranged at least partly recessed in the at least one cavity. Furthermore, the light-emitting diode device includes an ESD protection element, which is formed by a partial region of the carrier.
Abstract translation: 一种发光二极管器件包括具有至少一个空腔的载体，发光二极管芯片以至少部分地凹入至少一个空腔中的方式布置，并且ESD保护元件由部分区域 的承运人。 此外，发光二极管装置包括具有至少一个空腔的载体，布置在载体上的发光二极管芯片以及至少部分地凹入至少一个空腔中的电气部件。 此外，发光二极管装置包括由载体的部分区域形成的ESD保护元件。
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7.发明授权公开(公告)号：US09875831B2
公开(公告)日：2018-01-23
申请号：US14901694
申请日：2014-05-20
Applicant: EPCOS AG
Inventor： Oliver Dernovsek , Jutta Koholka
CPC classification number: H01C7/18 , H01C1/148 , H01C7/1006 , H01C17/281 , H01C17/283 , H01G4/2325
Abstract: A method for producing a multi-layer varistor component is specified. A main body for the multi-layer varistor component includes a plurality of internal electrodes. The method further includes providing the main body with a starting material for a copper electrode layer in such a way that the starting material is directly connected to at least one internal electrode. A thermal treatment of the starting material is performed under a protective gas atmosphere in order to form the copper electrode layer.
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公开(公告)号：US20170309802A1
公开(公告)日：2017-10-26
申请号：US15508361
申请日：2015-08-05
Applicant: EPCOS AG
Inventor： Thomas Feichtinger , Oliver Dernovsek
IPC: H01L33/62 , H01L25/075 , H01L23/60 , H01L25/16 , H01L23/34
CPC classification number: H01L33/62 , H01L21/0254 , H01L23/34 , H01L23/60 , H01L25/0753 , H01L25/167 , H01L33/48 , H01L33/486 , H01L2924/0002 , H01L2924/00
Abstract: A light-emitting diode device is specified, comprising at least one carrier and a light-emitting diode arranged thereon. The carrier comprises a plurality of polymer layers arranged one above another. At least one polymer layer has a cutout, in which an electrical component is embedded.
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公开(公告)号：US09734948B2
公开(公告)日：2017-08-15
申请号：US14785753
申请日：2014-04-04
Applicant: EPCOS AG
Inventor： Oliver Dernovsek , Michael Stahl
IPC: H01G4/12 , H01G4/30 , H01L21/50 , H01L41/053 , H01L41/23 , H01C7/102 , H01G4/06 , H01G4/22 , H01L41/083 , C04B41/00 , C04B41/45 , C04B41/81 , C25D3/56 , H01C1/14 , H01C7/10 , H01G4/005 , H01G4/248
CPC classification number: H01G4/12 , C04B41/009 , C04B41/45 , C04B41/81 , C25D3/56 , H01C1/14 , H01C7/10 , H01C7/102 , H01G4/005 , H01G4/06 , H01G4/22 , H01G4/248 , H01G4/30 , H01L21/50 , H01L41/0533 , H01L41/083 , H01L41/23
Abstract: An electronic component has a main body. The main body includes a porous material having surface pores at a surface of the main body. A passivation liquid is arranged in the surface pores. A method of forming an electronic component is also disclosed as is a method of passivating a body.
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10.发明申请公开(公告)号：US20160233409A1
公开(公告)日：2016-08-11
申请号：US15132805
申请日：2016-04-19
Applicant: EPCOS AG
Inventor： Alexander Glazunov , Oliver Dernovsek
IPC: H01L41/083 , H01L41/273 , H01L41/187 , H01L41/047 , H01L41/08
CPC classification number: H01L41/0838 , H01L41/0471 , H01L41/0805 , H01L41/1876 , H01L41/273 , H01L41/297
Abstract: A method for producing a piezoelectric multilayer component is disclosed. Piezoelectric green films and electrode material are provided, arranged alternately on top of one another and sintered. The electrode material is provided with a PbO-containing coating and/or PbO is mixed into the electrode material.
Abstract translation: 公开了制造压电叠层部件的方法。 提供压电绿色膜和电极材料，交替地彼此排列并烧结。 电极材料设置有含PbO的涂层和/或PbO混入电极材料中。
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