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公开(公告)号：US11239010B2
公开(公告)日：2022-02-01
申请号：US16061801
申请日：2016-10-18
Applicant: EPCOS AG
Inventor： Christian Faistauer , Klaus-Dieter Aichholzer , Sebastian Brunner , Edmund Payr , Günter Pudmich
Abstract: A mechanically stable main body having a cutout, into which an ESD protection element is at least partly embedded and mechanically fixed by means of a connection means. Electrical terminals of the protection element are connected to terminal pads on the top side of the main body by way of a structured metallic layer bearing on main body and protection element.
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公开(公告)号：US20150243865A1
公开(公告)日：2015-08-27
申请号：US14422673
申请日：2013-07-22
Applicant: EPCOS AG
Inventor： Thomas Feichtinger , Sebastian Brunner , Oliver Dernovsek , Klaus-Dieter Aichholzer , Georg Krenn , Axel Pecina , Christian Faistauer
IPC: H01L33/64
CPC classification number: H01L33/644 , H01L33/642 , H01L33/647
Abstract: A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.
Abstract translation: 发光二极管装置具有第一载体和布置在第一载体上的至少一个发光二极管芯片。 第一载体具有至少一个第一和第二载体部分，其中发光二极管芯片仅在第一载体部分上。 此外，第一和第二载体部分各自具有导热性。 第一载体部分的热导率为第二载体部分的热导率的至少1.5倍。 第一载体部分被第二载体部分横向包围。
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公开(公告)号：US20190013120A1
公开(公告)日：2019-01-10
申请号：US16061801
申请日：2016-10-18
Applicant: EPCOS AG
Inventor： Christian Faistauer , Klaus-Dieter Aichholzer , Sebastian Brunner , Edmund Payr , Günter Pudmich
Abstract: A mechanically stable main body having a cutout, into which an ESD protection element is at least partly embedded and mechanically fixed by means of a connection means. Electrical terminals of the protection element are connected to terminal pads on the top side of the main body by way of a structured metallic layer bearing on main body and protection element.
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公开(公告)号：US09865381B2
公开(公告)日：2018-01-09
申请号：US15113397
申请日：2015-01-02
Applicant: EPCOS AG
Inventor： Yasuharu Miyauchi , Pavol Dudesek , Christian Faistauer , Gerhard Fuchs , Stefan Obermair , Klaus-Dieter Aichholzer , Christian Block , Sebastian Brunner
CPC classification number: H01C7/12 , C03C3/089 , H01C7/1006 , H01C7/112 , H01C7/18 , H01C17/285 , H01L25/167 , H01L2924/0002 , H01L2924/00
Abstract: A chip and a method for manufacturing a chip are disclosed. In an embodiment, the chip includes a varistor layer composed of zinc oxide, a multilayered electrode structure which realizes a varistor function in the varistor layer and at least two solderable or bondable external contacts on a first main surface of the varistor layer. The chip further includes a glass layer disposed on the first main surface leaving only the external contacts uncovered, wherein the glass layer includes, as main constituents, oxides of Si and/or Ge, B and K, which in total have at least 70% by weight of the constituents of the glass layer, and wherein the glass layer is substantially free of Al, Ga, Cr and Ti.
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Patent Agency Ranking
公开(公告)号：US09337408B2
公开(公告)日：2016-05-10
申请号：US14422673
申请日：2013-07-22
Applicant: EPCOS AG
Inventor： Thomas Feichtinger , Sebastian Brunner , Oliver Dernovsek , Klaus-Dieter Aichholzer , Georg Krenn , Axel Pecina , Christian Faistauer
IPC: H01L33/64
CPC classification number: H01L33/644 , H01L33/642 , H01L33/647
Abstract: A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.
Abstract translation: 发光二极管装置具有第一载体和布置在第一载体上的至少一个发光二极管芯片。 第一载体具有至少一个第一和第二载体部分，其中发光二极管芯片仅在第一载体部分上。 此外，第一和第二载体部分各自具有导热性。 第一载体部分的热导率为第二载体部分的热导率的至少1.5倍。 第一载体部分被第二载体部分横向包围。
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公开(公告)号：US20190019604A1
公开(公告)日：2019-01-17
申请号：US16064809
申请日：2017-01-10
Applicant: EPCOS AG
Inventor： Sebastian Brunner , Christian Faistauer , Günter Pudmich , Edmund Payr , Kurt Wiesbauer
IPC: H01C7/10 , H01C1/144 , H01C17/065 , H01C17/28 , H01C7/102
Abstract: A green film composed of varistor material is laminated on a ceramic main body (GK), which is provided with metallizations (EP1, AF) on both sides, and is sintered to form a varistor layer (VS). A terminating electrode pair (EP1, EP2) completes the arrangement and allows the varistor layer to be operated as a varistor. The upper second electrode pair (EP2) can serve directly as a terminal contact for mounting an electrical component.
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公开(公告)号：US20170011827A1
公开(公告)日：2017-01-12
申请号：US15113397
申请日：2015-01-02
Applicant: EPCOS AG
Inventor： Yasuharu Miyauchi , Pavol Dudesek , Christian Faistauer , Gerhard Fuchs , Stefan Obermair , Klaus-Dieter Aichholzer , Christian Block , Sebastian Brunner
CPC classification number: H01C7/12 , C03C3/089 , H01C7/1006 , H01C7/112 , H01C7/18 , H01C17/285 , H01L25/167 , H01L2924/0002 , H01L2924/00
Abstract: A chip and a method for manufacturing a chip are disclosed. In an embodiment, the chip includes a varistor layer composed of zinc oxide, a multilayered electrode structure which realizes a varistor function in the varistor layer and at least two solderable or bondable external contacts on a first main surface of the varistor layer. The chip further includes a glass layer disposed on the first main surface leaving only the external contacts uncovered, wherein the glass layer includes, as main constituents, oxides of Si and/or Ge, B and K, which in total have at least 70% by weight of the constituents of the glass layer, and wherein the glass layer is substantially free of Al, Ga, Cr and Ti.
Abstract translation: 公开了一种芯片和芯片的制造方法。 在一个实施例中，芯片包括由氧化锌组成的可变电阻层，在压敏电阻层中实现变阻器功能的多层电极结构以及可变阻抗层的第一主表面上的至少两个可焊接或可接合的外部触点。 芯片还包括设置在第一主表面上的玻璃层，仅留下未覆盖的外部触点，其中玻璃层主要包括Si和/或Ge，B和K的氧化物，其总共具有至少70％ 的玻璃层的成分，并且其中玻璃层基本上不含Al，Ga，Cr和Ti。
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8.发明授权Light-emitting diode arrangement, module, and method for producing a light-emitting diode arrangement 有权发光二极管布置，模块和用于制造发光二极管装置的方法公开(公告)号：US09287247B2
公开(公告)日：2016-03-15
申请号：US14437785
申请日：2013-09-25
Applicant: EPCOS AG
Inventor： Christian Faistauer , Stefan Leopold Hatzl , Sebastian Brunner
CPC classification number: H01L25/167 , H01L33/483 , H01L2924/0002 , H01L2933/0033 , H05B33/086 , H05K1/0268 , H05K1/167 , H05K3/4629 , H05K2201/10106 , H05K2203/175 , H01L2924/00
Abstract: A light-emitting diode arrangement includes a light-emitting diode and a coding resistor for coding the light-emitting diode. The coding resistor is embodied as a star connection of a number of resistors. Furthermore, a module includes a plurality of light-emitting diode arrangements. Furthermore, a method for producing a light-emitting diode arrangement is specified, wherein the coding of a coding resistor is carried out depending on a determined characteristic of the light-emitting diode.
Abstract translation: 发光二极管装置包括用于对发光二极管进行编码的发光二极管和编码电阻器。 编码电阻器被实现为多个电阻器的星形连接。 此外，模块包括多个发光二极管装置。 此外，规定了一种制造发光二极管装置的方法，其中编码电阻器的编码根据确定的发光二极管的特性进行。
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9.发明申请Light-Emitting Diode Arrangement, Module, and Method for Producing a Light-Emitting Diode Arrangement 有权发光二极管布置，模块和产生发光二极管布置的方法公开(公告)号：US20150287703A1
公开(公告)日：2015-10-08
申请号：US14437785
申请日：2013-09-25
Applicant: EPCOS AG
Inventor： Christian Faistauer , Stefan Leopold Hatzl , Sebastian Brunner
CPC classification number: H01L25/167 , H01L33/483 , H01L2924/0002 , H01L2933/0033 , H05B33/086 , H05K1/0268 , H05K1/167 , H05K3/4629 , H05K2201/10106 , H05K2203/175 , H01L2924/00
Abstract: A light-emitting diode arrangement includes a light-emitting diode and a coding resistor for coding the light-emitting diode. The coding resistor is embodied as a star connection of a number of resistors. Furthermore, a module includes a plurality of light-emitting diode arrangements. Furthermore, a method for producing a light-emitting diode arrangement is specified, wherein the coding of a coding resistor is carried out depending on a determined characteristic of the light-emitting diode.
Abstract translation: 发光二极管装置包括用于对发光二极管进行编码的发光二极管和编码电阻器。 编码电阻器被实现为多个电阻器的星形连接。 此外，模块包括多个发光二极管装置。 此外，规定了一种制造发光二极管装置的方法，其中编码电阻器的编码根据确定的发光二极管的特性进行。
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