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公开(公告)号：US20170047203A1
公开(公告)日：2017-02-16
申请号：US15306132
申请日：2014-05-09
发明人： Thomas Glinsner , Christoph Flotgen , Johann Bernauer , Thomas Wagenleitner , Thomas Wieser , Florian Schmid , Thomas Plach , Roman Anzengruber , Alexander Nones , Uwe Kriebisch
IPC分类号： H01J37/32 , H01L21/3065 , H01L21/67
摘要： A device for bombarding at least one substrate with a plasma with a first electrode fiend a second electrode that can be arranged opposite thereto, which electrodes are formed together producing the plasma between the electrodes wherein at least one of the electrodes is formed from at least two electrode units. In addition, this invention relates to a corresponding method.
摘要翻译： 一种用于用具有第一电极的等离子体轰击至少一个衬底的装置，可以与其相对布置的第二电极，这些电极一起形成在电极之间产生等离子体，其中至少一个电极由至少两个 电极单元。 此外，本发明涉及相应的方法。
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公开(公告)号：US20190176500A1
公开(公告)日：2019-06-13
申请号：US16325918
申请日：2016-09-05
发明人： Friedrich Paul Lindner , Harald Zaglmayr , Christian Schon , Thomas Glinsner , Evelyn Reisinger , Peter Fischer , Othmar Luksch
摘要： An apparatus and a method for embossing micro- and/or nanostructures in an embossing material.
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公开(公告)号：US11472212B2
公开(公告)日：2022-10-18
申请号：US16325918
申请日：2016-09-05
发明人： Friedrich Paul Lindner , Harald Zaglmayr , Christian Schon , Thomas Glinsner , Evelyn Reisinger , Peter Fischer , Othmar Luksch
摘要： An apparatus and a method for embossing micro- and/or nanostructures in an embossing material.
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公开(公告)号：US20200055729A1
公开(公告)日：2020-02-20
申请号：US16487147
申请日：2017-03-16
摘要： A method for bonding at least three substrates to form a substrate stack, wherein the substrate stack has at least one lowermost substrate a middle substrate, and an upper substrate. The method includes the following steps: aligning the middle substrate to the lowermost substrate and bonding the middle substrate to the lowermost substrate, then aligning the upper substrate and bonding the upper substrate to the middle substrate, wherein the upper substrate is aligned to the lowermost substrate.
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公开(公告)号：US20150251349A1
公开(公告)日：2015-09-10
申请号：US14717003
申请日：2015-05-20
CPC分类号： B29C59/026 , B29C59/022 , B29C71/04 , B29C2059/023 , B29K2105/24 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： A method for embossing a structure material on a substrate disposed within a device having side walls, a base plate and a cover that define a working space that is isolated from a surrounding environment. The method includes the steps of: a) moving the substrate using a first calibration means and aligning the substrate with an application means, b) applying the structure material to the substrate, c) moving the substrate using a second calibration means that is located at least partially in the working space wherein the substrate is disposed within the working space and is aligned with an embossing means that is located at least partially in the working space, and d) embossing the structure material on the substrate while the substrate is in the working space using the embossing means, wherein the working space has a defined atmosphere, before and during the step of embossing, without interruption.
摘要翻译： 一种用于在布置在具有侧壁的装置中的基板上压花结构材料的方法，基板和盖，其限定与周围环境隔离的工作空间。 该方法包括以下步骤：a）使用第一校准装置移动衬底并使衬底与施加装置对准，b）将结构材料施加到衬底上，c）使用第二校准装置移动衬底，所述第二校准装置位于 至少部分地在所述工作空间中，其中所述基板设置在所述工作空间内并且与至少部分地位于所述工作空间中的压花装置对准，以及d）在所述基板处于工作状态的状态下对所述基板上的所述结构材料进行压花 使用压花装置的空间，其中在压花步骤之前和期间，工作空间具有限定的气氛，而不中断。
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公开(公告)号：US20230001723A1
公开(公告)日：2023-01-05
申请号：US17942513
申请日：2022-09-12
发明人： Friedrich Paul Lindner , Harald Zaglmayr , Christian Schon , Thomas Glinsner , Evelyn Reisinger , Peter Fischer , Othmar Luksch
摘要： An apparatus and a method for embossing micro- and/or nanostructures include the embossing of the micro- and/or nanostructures in an embossing material.
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公开(公告)号：US10954122B2
公开(公告)日：2021-03-23
申请号：US16487147
申请日：2017-03-16
IPC分类号： H01L21/67 , B81C1/00 , H01L21/68 , H01L23/544
摘要： A method for bonding at least three substrates to form a substrate stack, wherein the substrate stack has at least one lowermost substrate a middle substrate, and an upper substrate. The method includes the following steps: aligning the middle substrate to the lowermost substrate and bonding the middle substrate to the lowermost substrate, then aligning the upper substrate and bonding the upper substrate to the middle substrate, wherein the upper substrate is aligned to the lowermost substrate.
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公开(公告)号：US10707059B2
公开(公告)日：2020-07-07
申请号：US15306132
申请日：2014-05-09
发明人： Thomas Glinsner , Christoph Flotgen , Johann Bernauer , Thomas Wagenleitner , Thomas Wieser , Florian Schmid , Thomas Plach , Roman Anzengruber , Alexander Nones , Uwe Kriebisch
IPC分类号： H01L21/00 , H01J37/32 , H01L21/687 , H01L21/3065 , H01L21/67
摘要： A device for bombarding at least one substrate with a plasma with a first electrode and a second electrode that can be arranged opposite thereto, which electrodes are formed together producing the plasma between the electrodes wherein at least one of the electrodes is formed from at least two electrode units. In addition, this invention relates to a corresponding method.
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公开(公告)号：US10239253B2
公开(公告)日：2019-03-26
申请号：US14717003
申请日：2015-05-20
摘要： A method for embossing a structure material on a substrate disposed within a device having side walls, a base plate and a cover that define a working space that is isolated from a surrounding environment. The method includes the steps of: a) moving the substrate using a first calibration means and aligning the substrate with an application means, b) applying the structure material to the substrate, c) moving the substrate using a second calibration means that is located at least partially in the working space wherein the substrate is disposed within the working space and is aligned with an embossing means that is located at least partially in the working space, and d) embossing the structure material on the substrate while the substrate is in the working space using the embossing means, wherein the working space has a defined atmosphere, before and during the step of embossing, without interruption.
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