-
公开(公告)号：US20210291504A1
公开(公告)日：2021-09-23
申请号：US17341509
申请日：2021-06-08
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
-
公开(公告)号：US11059280B2
公开(公告)日：2021-07-13
申请号：US16356325
申请日：2019-03-18
IPC分类号： B32B38/18 , H01L21/18 , B32B37/00 , B32B37/18 , B32B37/10 , B29C65/78 , H01L21/67 , H01L21/683 , B29C65/00
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
-
公开(公告)号：US20190019678A1
公开(公告)日：2019-01-17
申请号：US16080156
申请日：2016-03-22
IPC分类号： H01L21/20 , H01L21/67 , H01L21/683 , H01L23/32
摘要： A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.
-
公开(公告)号：US20180076037A1
公开(公告)日：2018-03-15
申请号：US15514182
申请日：2016-02-16
CPC分类号： H01L21/187 , H01L21/2007 , H01L21/67092 , H01L21/67253 , H01L22/12 , H01L22/20 , H01L25/50
摘要： A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.
-
公开(公告)号：US20170047203A1
公开(公告)日：2017-02-16
申请号：US15306132
申请日：2014-05-09
发明人： Thomas Glinsner , Christoph Flotgen , Johann Bernauer , Thomas Wagenleitner , Thomas Wieser , Florian Schmid , Thomas Plach , Roman Anzengruber , Alexander Nones , Uwe Kriebisch
IPC分类号： H01J37/32 , H01L21/3065 , H01L21/67
摘要： A device for bombarding at least one substrate with a plasma with a first electrode fiend a second electrode that can be arranged opposite thereto, which electrodes are formed together producing the plasma between the electrodes wherein at least one of the electrodes is formed from at least two electrode units. In addition, this invention relates to a corresponding method.
摘要翻译： 一种用于用具有第一电极的等离子体轰击至少一个衬底的装置，可以与其相对布置的第二电极，这些电极一起形成在电极之间产生等离子体，其中至少一个电极由至少两个 电极单元。 此外，本发明涉及相应的方法。
-
公开(公告)号：US11955339B2
公开(公告)日：2024-04-09
申请号：US17550008
申请日：2021-12-14
IPC分类号： H01L21/20 , H01L21/67 , H01L21/683 , H01L23/32
CPC分类号： H01L21/2007 , H01L21/67092 , H01L21/67288 , H01L21/6838 , H01L23/32
摘要： A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.
-
公开(公告)号：US11315901B2
公开(公告)日：2022-04-26
申请号：US16632643
申请日：2017-09-21
IPC分类号： H01L21/67 , H01L23/00 , H01L21/683
摘要： A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.
-
公开(公告)号：US11315813B2
公开(公告)日：2022-04-26
申请号：US15551733
申请日：2015-04-10
IPC分类号： H01L21/68 , H01L21/673 , H01L21/67 , H01L23/00
摘要： A substrate holder having a fixing surface for holding a substrate, a system having such a substrate holder, a use of such a substrate holder, a method for bonding two substrates and a product, particularly a substrate stack, produced using such a method and also a use of such a substrate holder for such a method.
-
公开(公告)号：US11020953B2
公开(公告)日：2021-06-01
申请号：US16359157
申请日：2019-03-20
IPC分类号： B32B38/18 , H01L21/18 , B32B37/00 , B32B37/18 , B32B37/10 , B29C65/78 , H01L21/67 , H01L21/683 , B29C65/00
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
-
公开(公告)号：US11020952B2
公开(公告)日：2021-06-01
申请号：US16358844
申请日：2019-03-20
IPC分类号： B32B38/18 , H01L21/18 , B32B37/00 , B32B37/18 , B32B37/10 , B29C65/78 , H01L21/67 , H01L21/683 , B29C65/00
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
-
-
-
-
-
-
-
-
-
搜索结果
47 条记录 (耗时 0.033 秒)
