公开(公告)号：US06899798B2

公开(公告)日：2005-05-31

申请号：US10027683

申请日：2001-12-21

申请人： Edwin Charles Weldon ,  Yongxiang He ,  Hong Wang ,  Clifford C. Stow

发明人： Edwin Charles Weldon ,  Yongxiang He ,  Hong Wang ,  Clifford C. Stow

IPC分类号： B23K26/40 ,  C04B41/00 ,  C04B41/51 ,  C04B41/52 ,  C04B41/53 ,  C04B41/80 ,  C04B41/88 ,  C04B41/89 ,  C04B41/91 ,  C23C14/56 ,  H01L21/203 ,  H05K3/00 ,  H05K3/38 ,  C23C14/35 ,  C23C16/00

CPC分类号： C04B41/009 ,  B23K26/40 ,  B23K2103/52 ,  C04B41/0072 ,  C04B41/51 ,  C04B41/5155 ,  C04B41/52 ,  C04B41/5353 ,  C04B41/80 ,  C04B41/88 ,  C04B41/89 ,  C04B41/91 ,  C23C14/564 ,  C04B41/53 ,  C04B41/5133 ,  C04B35/10 ,  C04B35/00

摘要： Disclosed herein is a method of roughening a ceramic surface by forming mechanical interlocks in the ceramic surface by a chemical etching process, a thermal etching process, or a laser micromachining process. Also disclosed herein are components for use in semiconductor processing chambers (in particular, a deposition ring for use in a PVD chamber) which have at least one ceramic surface having mechanical interlocks formed therein by chemical etching, thermal etching, or laser micromachining. Ceramic surfaces which have been roughened according to the chemical etching, thermal etching, or laser micromachining process of the invention are less brittle and damaged than ceramic surfaces which are roughened using conventional grit blasting techniques. The method of the invention results in a roughened ceramic surface which provides good adherence to an overlying sacrificial layer (such as aluminum).

摘要翻译： 本文公开了通过在化学蚀刻工艺，热蚀刻工艺或激光微加工工艺中在陶瓷表面中形成机械互锁来使陶瓷表面粗糙化的方法。 本文还公开了用于半导体处理室（特别是用于PVD室中的沉积环）的组件，其具有通过化学蚀刻，热蚀刻或激光微加工在其中形成有机械互锁的至少一个陶瓷表面。 根据本发明的化学蚀刻，热蚀刻或激光微加工方法已经被粗糙化的陶瓷表面比使用常规喷砂技术粗糙化的陶瓷表面不那么脆弱和损坏。 本发明的方法产生了对上覆的牺牲层（例如铝）具有良好粘合性的粗糙陶瓷表面。