摘要:
A high-frequency switch circuit arrangement. A plurality of stages (for example, two stages) of capacitative elements connected in series (C11 and C12, C21 and C22) are used in a shunt path of a high-frequency component. If a surge voltage is applied, the voltage that each capacitative element should bear decreases in inverse proportion to the number of the connection stages. Consequently, the surge resistance of the capacitative element is improved. The capacitative elements connected in series can be manufactured using the usual manufacturing process of compound semiconductor devices and if the structure of the invention is adopted, a protective diode need not be provided. As the capacity is made common and the device structure is designed, the high-frequency switch circuit arrangement can be further made compact, etc.
摘要:
When a low level voltage is inputted to an input terminal IN, a transistor EF1 enters a blocked state, a first switch circuit SW1 enters a conduction state, and a second switch circuit SW2 enters the blocked state. Accordingly, a boosted voltage outputted from a voltage booster circuit CP is applied to a load R. When a high level voltage is inputted to the input terminal IN, the transistor EF1 enters the conduction state, the first switch circuit SW1 enters the blocked state, and the second switch circuit SW2 enters the conduction state. Accordingly, a voltage equivalent to that at the external power supply terminal VDD is applied to the load R. Therefore, although a current constantly flows through the transistor EF1 when the boosted voltage is not required, such situation does not affect a current supplied from the voltage booster circuit CP.
摘要:
A diode logic circuit which can select a high voltage from among the voltages of a number of control voltage input terminals using a number of diodes made of Schottky junctions is integrally formed on a compound semiconductor substrate on which MESFET stages for switching and for securing isolations have been formed. In addition, the MESFET stages for switching are controlled by the voltages of the number of control voltage input terminals and the MESFET stages for securing isolations are controlled by the OR voltage that is outputted from the diode logic circuit.
摘要:
A high-frequency switch circuit arrangement. A plurality of stages (for example, two stages) of capacitative elements connected in series (C11 and C12, C21 and C22) are used in a shunt path of a high-frequency component. If a surge voltage is applied, the voltage that each capacitative element should bear decreases in inverse proportion to the number of the connection stages. Consequently, the surge resistance of the capacitative element is improved. The capacitative elements connected in series can be manufactured using the usual manufacturing process of compound semiconductor devices and if the structure of the invention is adopted, a protective diode need not be provided. As the capacity is made common and the device structure is designed, the high-frequency switch circuit arrangement can be further made compact, etc.
摘要:
In a high-frequency switch circuit having a booster circuit and a voltage switch circuit for ON/OFF control of the booster circuit, the voltage switch circuit has a means for gradually dropping the gate input voltage and the drain/source input voltage of a series of FETs over a voltage drop time of 10 μsec or more at the time of switching from a boosted voltage to a non-boosted voltage.
摘要:
In a circuit in which a protected element 42 is connected between an input terminal 61 and an output terminal 62, and a protected element 41 is connected between the input terminal 61 and a reference potential terminal 71, the protected element 41 and a protection circuit 51 are connected in parallel with each other. The protection circuit 51 includes: a field-effect transistor (FET) 11 having a drain connected to the input terminal 61 and a source connected to the reference potential terminal 71; a resistance 31 having one end connected to a gate of the FET 11; a resistance 32 for connecting the other end of the resistance 31 to the source of the FET 11; and a capacitor 21 for connecting the other end of the resistance 31 to the drain of the FET 11.
摘要:
When a low level voltage is inputted to an input terminal IN, a transistor EF1 enters a blocked state, a first switch circuit SW1 enters a conduction state, and a second switch circuit SW2 enters the blocked state. Accordingly, a boosted voltage outputted from a voltage booster circuit CP is applied to a load R. When a high level voltage is inputted to the input terminal IN, the transistor EF1 enters the conduction state, the first switch circuit SW1 enters the blocked state, and the second switch circuit SW2 enters the conduction state. Accordingly, a voltage equivalent to that at the external power supply terminal VDD is applied to the load R. Therefore, although a current constantly flows through the transistor EF1 when the boosted voltage is not required, such situation does not affect a current supplied from the voltage booster circuit CP.
摘要:
A diode logic circuit which can select a high voltage from among the voltages of a number of control voltage input terminals using a number of diodes made of Schottky junctions is integrally formed on a compound semiconductor substrate on which MESFET stages for switching and for securing isolations have been formed. In addition, the MESFET stages for switching are controlled by the voltages of the number of control voltage input terminals and the MESFET stages for securing isolations are controlled by the OR voltage that is outputted from the diode logic circuit.
摘要:
A common terminal 500 is connected to drains of FETs 101 and 102 via a capacitor 400. FETs 111 to 114 are serially connected, and inserted between a source of the FET 101 and a terminal 501 via a capacitor 401. Similarly, each of: FETs 121 to 124; FETs 131 to 133; FETs 141 to 143; FETs 151 to 153; and FETs 161 to 163 is inserted between the source of the FET 101 or an FET 102 and a corresponding one of terminals 502 to 506. This configuration allows a stray capacitance value of a transmission/reception path to be reduced at the time of transmission/reception, thereby obtaining a favorable radio-frequency characteristic.
摘要翻译:公共端子500经由电容器400连接到FET 101和102的漏极.FET 111至114串联连接,并且经由电容器401插入FET 101的源极和端子501之间。类似地,每个FET 121至124; FET 131〜133; FET 141〜143; FET 151〜153; 并且FET161〜163插入在FET101的源极或FET102与端子502〜506中的对应的一个之间。这种结构允许发送/接收路径的杂散电容值减小, 接收,从而获得有利的射频特性。
摘要:
The first terminals of a plurality of resistor elements are connected to the intermediate connection points of a plurality of FETs connected in series, and a voltage, having a phase opposite to that of the voltage applied to the gate terminals of the plurality of FETs, is applied to the second terminals of the plurality of resistor elements. With this configuration, the potentials at the intermediate connection points of the plurality of FETs connected in series can be prevented from lowering. As a result, the power that can be handled can be increased. Furthermore, since the potentials at the intermediate connection points of the plurality of FETs connected in series can be prevented from lowering, the deterioration of the distortion characteristic and the isolation characteristic owing to the lowering of the potentials at the intermediate connection points of the plurality of field-effect transistors connected in series is prevented, and excellent high-frequency characteristics are obtained.