公开(公告)号：US20240222929A1

公开(公告)日：2024-07-04

申请号：US18496613

申请日：2023-10-27

Applicant: Electronics and Telecommunications Research Institute

Inventor： Young-Tak HAN ,  Seok Jun YUN ,  Seo Young LEE ,  Sang Ho PARK ,  Yongsoon BAEK ,  Jang Uk SHIN ,  Dong-Hun LEE

IPC: H01S5/0233 ,  H01S5/02315 ,  H01S5/026

CPC classification number: H01S5/0233 ,  H01S5/02315 ,  H01S5/0265 ,  H01S5/12

Abstract: Provided is an optical communication device according to an embodiment of the inventive including a carrier substrate, a printed circuit board provided on one side of the carrier substrate in a first direction, electro-absorption modulator-integrated laser chips provided on the other side of the carrier substrate, an interposer provided on the electro-absorption modulator-integrated laser chips and the printed circuit board, and capacitors, which are provided on the interposer and each of which is shorter than each of the electro-absorption modulator-integrated laser chips and is thicker than the electro-absorption modulator-integrated laser chip.

公开(公告)号：US20210234615A1

公开(公告)日：2021-07-29

申请号：US17156073

申请日：2021-01-22

Applicant: Electronics and Telecommunications Research Institute

Inventor： Young-Tak HAN ,  Seok Jun YUN ,  Seoktae KIM ,  Sang Ho PARK ,  Yongsoon BAEK ,  Jang Uk SHIN ,  Seo Young LEE

IPC: H04B10/50 ,  H01S3/00 ,  H01S3/23 ,  G02B6/12 ,  H04J14/02 ,  H04Q11/00

Abstract: Disclosed is an optical transmitter module including a directly modulated laser transmitter based on a directly modulated laser (DML) and an arrayed waveguide grating (AWG) chip that is vertically polished. The directly modulated laser transmitter includes a directly modulated laser chip array including one or more directly modulated laser chips, an impedance matching circuit that allows each of the one or more directly modulated laser chips to operate at a critical speed of 100 Gbps per channel or higher, and a radio frequency-flexible printed circuit board (RF-FPCB) that transmits a radio frequency (RF) modulating signal to the directly modulated laser chip array. The arrayed waveguide grating chip includes an optical waveguides that transfer multi-channel optical signals and a wavelength multiplexer that multiplexes the multi-channel optical signals. The directly modulated laser transmitter and the arrayed waveguide grating chip are spaced apart from each other and are optically coupled in chip-to-chip.

公开(公告)号：US20220236618A1

公开(公告)日：2022-07-28

申请号：US17519424

申请日：2021-11-04

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Young-Tak HAN ,  Seoktae KIM ,  Sang Ho PARK ,  Yongsoon BAEK ,  Jang Uk SHIN ,  Seok Jun YUN ,  Seo Young LEE

IPC: G02F1/21 ,  G02F1/225

Abstract: Disclosed are a heterogeneously integrated optical modulator and a manufacturing method thereof. The modulator includes a substrate having a trench, an input waveguide disposed at one side of the trench, an output waveguide disposed at the other side of the trench, a first Mach-Zehnder interferometer including first branch waveguides disposed between the input waveguide and the output waveguide and a heater disposed on one of the first branch waveguides, and second Mach-Zehnder interferometers connected to each of the first branch waveguides.