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公开(公告)号：US10678005B2
公开(公告)日：2020-06-09
申请号：US16248963
申请日：2019-01-16
发明人： David Henry Kinghorn , Ari Jason Novack , Holger N. Klein , Nathan A. Nuttall , Kishor V. Desai , Daniel J. Blumenthal , Michael J. Hochberg , Ruizhi Shi
摘要： Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.
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公开(公告)号：US20200057216A1
公开(公告)日：2020-02-20
申请号：US16664985
申请日：2019-10-28
摘要： A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.
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公开(公告)号：US10222565B2
公开(公告)日：2019-03-05
申请号：US15783263
申请日：2017-10-13
发明人： David Henry Kinghorn , Ari Jason Novack , Holger N. Klein , Nathan A. Nuttall , Kishor V. Desai , Daniel J. Blumenthal , Michael J. Hochberg , Ruizhi Shi
IPC分类号： G02B6/42 , G02B6/14 , G02B6/13 , G02B6/12 , G02B6/136 , H01L31/12 , H01L31/18 , H01L25/00 , H01L25/16
摘要： Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.
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公开(公告)号：US20190179091A1
公开(公告)日：2019-06-13
申请号：US16248963
申请日：2019-01-16
发明人： David Henry Kinghorn , Ari Jason Novack , Holger N. Klein , Nathan A. Nuttall , Kishor V. Desai , Daniel J. Blumenthal , Michael J. Hochberg , Ruizhi Shi
CPC分类号： G02B6/423 , G02B6/131 , G02B6/136 , G02B6/4232 , G02B6/4238 , G02B6/4251 , G02B6/4268 , G02B6/4274 , G02B2006/12061 , G02B2006/12097 , G02B2006/121 , H01L25/16 , H01L25/162 , H01L25/167 , H01L25/50 , H01L31/125 , H01L31/18 , Y02P70/521
摘要： Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.
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公开(公告)号：US20180052290A1
公开(公告)日：2018-02-22
申请号：US15783263
申请日：2017-10-13
发明人： David Henry Kinghorn , Ari Jason Novack , Holger N. Klein , Nathan A. Nuttall , Kishor V. Desai , Daniel J. Blumenthal , Michael J. Hochberg , Ruizhi Shi
CPC分类号： G02B6/423 , G02B6/131 , G02B6/136 , G02B6/4232 , G02B6/4238 , G02B6/4251 , G02B6/4268 , G02B6/4274 , G02B2006/12061 , G02B2006/12097 , G02B2006/121 , H01L25/16 , H01L25/162 , H01L25/167 , H01L25/50 , H01L31/125 , H01L31/18 , Y02P70/521
摘要： Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.
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公开(公告)号：US10025045B2
公开(公告)日：2018-07-17
申请号：US15467061
申请日：2017-03-23
IPC分类号： G02B6/42
摘要： A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.
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公开(公告)号：US20170205594A1
公开(公告)日：2017-07-20
申请号：US15467061
申请日：2017-03-23
IPC分类号： G02B6/42
CPC分类号： G02B6/4242 , G02B6/30 , G02B6/423 , G02B6/4239 , G02B6/4243 , G02B6/4245 , G02B6/4249 , G02B6/4253 , G02B6/4274 , G02B6/428
摘要： A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.
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