-
公开(公告)号：US11851562B2
公开(公告)日：2023-12-26
申请号：US17697112
申请日：2022-03-17
发明人： Rongtao Wang , Zhenfang Shang , Ningning Jia , Chen-Yu Hsieh
CPC分类号： C08L71/12 , C08J5/18 , C08J5/249 , C08J2371/12 , C08J2379/08 , C08L2203/16
摘要： A resin composition includes a polyphenylene ether resin of Formula (1) and an additive. The additive may include maleimide resin, unsaturated C═C double bond-containing crosslinking agent, polyolefin, flame retardant, filler, curing accelerator, or a combination thereof. An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including comparative tracking index, breakdown voltage, dissipation factor and copper foil peeling strength.
-
公开(公告)号：US11549014B2
公开(公告)日：2023-01-10
申请号：US16942405
申请日：2020-07-29
发明人： Rongtao Wang , Ningning Jia , Zhenfang Shang , Weimiao Yu
摘要： A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations.
-
搜索结果
2 条记录 (耗时 0.014 秒)
