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1.发明申请RESIN COMPOSITION, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME 有权树脂组合物，铜层压板和印刷电路板使用相同公开(公告)号：US20160222204A1
公开(公告)日：2016-08-04
申请号：US14411166
申请日：2013-08-23
发明人： Rongtao WANG , Yu-Te Lin , Wenjun Tian , Ziqian Ma , Wenfeng Lv , Ningning Jia
IPC分类号： C08L63/00 , C08G59/50 , C08J5/24 , H05K1/03 , B32B15/14 , B32B15/092 , B32B15/20 , H05K1/09 , C08G59/54 , B32B5/02
CPC分类号： C08L63/00 , B32B5/02 , B32B15/092 , B32B15/14 , B32B15/20 , B32B2260/021 , B32B2262/101 , B32B2307/3065 , B32B2457/08 , C08G59/245 , C08G59/50 , C08G59/504 , C08G59/54 , C08G59/56 , C08G59/621 , C08J5/24 , C08J2363/00 , C08J2363/02 , C08J2363/10 , C08J2471/10 , C08J2479/02 , C08L2201/02 , C08L2203/206 , C08L2205/03 , H05K1/0353 , H05K1/09 , H05K2201/012 , C08L79/04
摘要： The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).
摘要翻译： 本发明提供一种树脂组合物，其包含：（A）100重量份环氧树脂; （B）10〜80重量份苯并恶嗪树脂; （C）10〜50重量份的二环戊二烯酚树脂; 和（D）0.5〜5重量份的胺硬化剂; 其中所述树脂组合物不含二烯丙基双酚A（DABPA）。
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公开(公告)号：US09469757B2
公开(公告)日：2016-10-18
申请号：US14730956
申请日：2015-06-04
发明人： Rongtao Wang , Chen-Yu Hsieh , Wenfeng Lv , Wenjun Tian , Yu Gao , Ningning Jia , Ziqian Ma
IPC分类号： C08L25/10 , C08L29/10 , C08K5/5397 , C08K5/14 , C08J5/18 , C08L25/14 , C08J5/24 , C08F12/34 , C08L25/08
CPC分类号： C08L25/14 , C08F12/34 , C08J5/18 , C08J5/24 , C08J2325/10 , C08J2325/14 , C08J2347/00 , C08J2425/08 , C08J2425/10 , C08J2425/14 , C08K5/14 , C08K5/5397 , C08L25/08 , C08L25/10 , C08L2201/02 , C08L2203/16 , C08L2203/20 , C08L2205/025
摘要： A low dissipation factor resin composition comprises: (A) 100 to 150 parts by weight of a vinyl-containing compound or a polymer thereof; (B) 0 to 75 parts by weight of styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, vinyl functional polybutadiene urethane oligomer or a combination thereof; (C) 30 to 150 parts by weight of flame retardant; and (D) 0.1 to 10 parts by weight of peroxide. The resin composition and a product made thereby are applicable to a copper-clad laminate and a printed circuit board, characterized by having low dissipation factor at high frequency and satisfactory thermal resistance and thermal expansion.
摘要翻译： 低耗散因子树脂组合物包含：（A）100至150重量份的含乙烯基化合物或其聚合物; （B）0〜75重量份苯乙烯 - 丁二烯 - 二乙烯基苯三元共聚物，苯乙烯 - 丁二烯 - 马来酸酐三元共聚物，乙烯基官能聚丁二烯氨基甲酸酯低聚物或其组合; （C）30〜150重量份的阻燃剂; 和（D）0.1〜10重量份的过氧化物。 树脂组合物及其制成的产品可应用于覆铜层压板和印刷电路板，其特征在于在高频下具有低损耗因数和令人满意的耐热性和热膨胀性。
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公开(公告)号：US11787935B2
公开(公告)日：2023-10-17
申请号：US17557893
申请日：2021-12-21
发明人： Yan Zhang , Rongtao Wang , Ningning Jia
摘要： A filler includes a first precursor and a second precursor; the first precursor is a hollow filler with a surface covered by a first silane coupling agent; the second precursor is a non-hollow filler with a surface covered by a second silane coupling agent; the first precursor and the second precursor are connected by a covalent bond formed by a chemical reaction between the first silane coupling agent and the second silane coupling agent. Also included are a preparation method of the filler and a resin composition containing the filler. A prepreg, a resin film, a laminate, or a printed circuit board made from the resin composition has excellent thermal resistance after moisture absorption, low Df variation rate under moisture and heat, low water absorption rate, high copper foil peeling strength, the prepreg having a smooth appearance and even color, and absence of branch-like pattern on laminate.
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公开(公告)号：US11753543B2
公开(公告)日：2023-09-12
申请号：US16863415
申请日：2020-04-30
发明人： Xingxing Yao , Rongtao Wang , Ningning Jia
IPC分类号： C08L79/08 , C08L83/04 , C08L33/10 , C08J5/18 , H05K1/09 , C08L37/00 , C08J5/24 , C08K5/00 , C08K3/013 , H05K1/18
CPC分类号： C08L79/08 , C08J5/18 , C08J5/244 , C08J5/246 , C08L33/10 , C08L37/00 , C08L83/04 , H05K1/095 , C08J2333/10 , C08J2337/00 , C08J2363/00 , C08J2383/04 , C08K3/013 , C08K5/0025 , C08K5/0066 , C08L2207/53 , H05K1/188
摘要： A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 μm copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.
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公开(公告)号：US10676590B2
公开(公告)日：2020-06-09
申请号：US15857486
申请日：2017-12-28
发明人： Yan Zhang , Mingsheng Yuan , Ningning Jia , Rongtao Wang
摘要： Disclosed herein is a resin composition, comprising: a crosslinking agent, its prepolymer, or a combination thereof; and a first unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board and achieve improvement in at least one, more or all properties including volatile content of prepreg, stickiness of prepreg, resin filling property of prepreg, glass transition temperature, dimensional stability under heat, T288 thermal resistance, thermal resistance after moisture absorption, dielectric constant and dissipation factor.
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6.发明授权公开(公告)号：US09574070B2
公开(公告)日：2017-02-21
申请号：US14731008
申请日：2015-06-04
发明人： Rongtao Wang , Chen-Yu Hsieh , Wenfeng Lv , Wenjun Tian , Yu Gao , Ningning Jia , Ziqian Ma
IPC分类号： C08K5/5397 , C08J5/24 , C08K5/14 , C08J5/18 , H05K1/03
CPC分类号： C08K5/5397 , C08J5/18 , C08J5/24 , C08J2325/08 , C08K5/14 , H05K1/0326 , H05K2201/012
摘要： A low dissipation factor resin composition comprises the following components: (A) an aromatic tetrafunctional vinylbenzyl monomer, its prepolymer or a combination thereof, the aromatic tetrafunctional vinylbenzyl monomer having a structure shown below; (B) flame retardant; and (C) peroxide. The resin composition is applicable to laminates and printed circuit boards featuring low dissipation factor at high frequency and thermal resistance and thermal expansion meeting the demands.
摘要翻译： 低耗散因子树脂组合物包含以下组分：（A）芳族四官能乙烯基苄基单体，其预聚物或其组合，具有如下结构的芳族四官能乙烯基苄基单体; （B）阻燃剂; 和（C）过氧化物。
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公开(公告)号：US11851562B2
公开(公告)日：2023-12-26
申请号：US17697112
申请日：2022-03-17
发明人： Rongtao Wang , Zhenfang Shang , Ningning Jia , Chen-Yu Hsieh
CPC分类号： C08L71/12 , C08J5/18 , C08J5/249 , C08J2371/12 , C08J2379/08 , C08L2203/16
摘要： A resin composition includes a polyphenylene ether resin of Formula (1) and an additive. The additive may include maleimide resin, unsaturated C═C double bond-containing crosslinking agent, polyolefin, flame retardant, filler, curing accelerator, or a combination thereof. An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including comparative tracking index, breakdown voltage, dissipation factor and copper foil peeling strength.
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公开(公告)号：US11718752B2
公开(公告)日：2023-08-08
申请号：US17362525
申请日：2021-06-29
发明人： Rongtao Wang , Ningning Jia
CPC分类号： C08L71/126 , B32B5/02 , B32B5/26 , B32B15/14 , B32B15/20 , C08J5/244 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/204 , C08J2371/12 , C08J2447/00 , C08J2453/02
摘要： A resin composition includes an unsaturated C═C double bond-containing polyphenylene ether resin, a polyolefin and silica; in an X-ray diffraction analysis pattern of the silica as measured by reference to JY/T 009-1996, only one diffraction peak exists in a 2θ ranging from 10° to 30°, and the diffraction peak has a full width at half maximum of 5.0° to 7.7°. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dissipation factor, resin filling property in open area, hole drilling limit value, and precision of hole position Cpk.
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公开(公告)号：US10676493B2
公开(公告)日：2020-06-09
申请号：US16158082
申请日：2018-10-11
发明人： Yan Zhang , Rongtao Wang , Mingsheng Yuan , Ningning Jia
IPC分类号： C07F9/6571 , C09K21/12 , C08K5/5313 , C08J5/24 , C08L71/12
摘要： A phosphorus-containing compound, a phosphorus-containing flame retardant, and a preparation method thereof are provided. Also provided is a resin composition which comprises the phosphorus-containing flame retardant and an unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvement in at least one, more or all properties including resin filling property of prepreg, flame retardancy, alkali resistance, glass transition temperature, thermal dimensional stability (ratio of dimensional change under heat), thermal resistance after moisture absorption, peeling strength, dielectric constant and dissipation factor.
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公开(公告)号：US10072148B2
公开(公告)日：2018-09-11
申请号：US15813165
申请日：2017-11-15
发明人： Rongtao Wang , Yu-Te Lin , Wenjun Tian , Ziqian Ma , Wenfeng Lv , Ningning Jia
IPC分类号： C08L63/00 , B32B15/092 , B32B15/20 , B32B5/02 , B32B15/08 , B32B37/06 , B32B37/12 , C08G59/50 , C08G59/54 , C08G59/56 , C08G59/62 , C08L79/02 , C08J5/24 , H05K1/03 , H05K1/09 , C09D163/00 , C09D179/02 , C08K3/32 , C08K5/03 , C08K5/3415 , C08K5/3492 , C08K5/49 , B32B15/14 , C08G59/24
CPC分类号： C08L63/00 , B32B5/02 , B32B15/092 , B32B15/14 , B32B15/20 , B32B2260/021 , B32B2262/101 , B32B2307/3065 , B32B2457/08 , C08G59/245 , C08G59/50 , C08G59/504 , C08G59/54 , C08G59/56 , C08G59/621 , C08J5/24 , C08J2363/00 , C08J2363/02 , C08J2363/10 , C08J2471/10 , C08J2479/02 , C08L2201/02 , C08L2203/206 , C08L2205/03 , H05K1/0353 , H05K1/09 , H05K2201/012 , C08L79/04
摘要： The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).
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