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公开(公告)号：US10954322B2
公开(公告)日：2021-03-23
申请号：US16228099
申请日：2018-12-20
发明人： Rongtao Wang , Yan Zhang , Bingbing Li
IPC分类号： C08F12/34 , C08K5/3492 , C08L55/00 , C08K5/14 , C08K5/37 , C08K5/38 , C08K5/01 , C08K5/06 , C08K5/08 , C08K5/13 , C08K5/18 , C08K5/46 , C08F16/32 , C08L71/12 , C08L63/00 , C08L67/00 , C08L33/08 , C08L79/08
摘要： A prepolymer, which is prepared by subjecting an unsaturated bond-containing compound and a bis(vinylphenyl) compound monomer or a polymer thereof to a prepolymerization reaction, is provided. The bis(vinylphenyl) compound contains between 80% and 99% of para-para vinyl groups and has a monomer content of between 80% and 100%. Moreover, a resin composition comprising the prepolymer and an additive, a method of preparing the prepolymer, and an article made from the resin composition are also provided.
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公开(公告)号：US12037490B2
公开(公告)日：2024-07-16
申请号：US17526191
申请日：2021-11-15
发明人： Rongtao Wang , Chenyu Shen , Yan Zhang , Xing He
IPC分类号： C08L71/00 , C08J5/24 , C08L25/02 , C09J7/30 , C09J125/02 , C09J171/00
CPC分类号： C08L71/00 , C08J5/244 , C08L25/02 , C09J7/30 , C09J125/02 , C09J171/00 , C08J2309/06 , C08J2325/02 , C08J2371/12 , C08J2425/02 , C08J2471/12 , C08L2205/035 , C09J2400/14 , C09J2400/163 , C09J2409/00 , C09J2423/00 , C09J2471/00
摘要： A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.
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公开(公告)号：US11180653B2
公开(公告)日：2021-11-23
申请号：US16852126
申请日：2020-04-17
发明人： Yan Zhang , Jue Tan , Rongtao Wang , Shu-Hao Chang
摘要： A resin composition includes a vinyl-containing polyphenylene ether resin and a prepolymer, wherein the prepolymer is prepared by prepolymerization of a mixture which at least includes a divinylbenzene, a triallyl compound and a diallyl isophthalate. An article made from the resin composition is also provided, which includes a prepreg, a resin film, a laminate or a printed circuit board. The article achieves improvements in at least one properties of glass transition temperature, copper foil peeling strength, dissipation factor, inner resin flow, melt viscosity, minimum dynamic viscosity, resin filling property in open area, and water resistance.
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公开(公告)号：US09469757B2
公开(公告)日：2016-10-18
申请号：US14730956
申请日：2015-06-04
发明人： Rongtao Wang , Chen-Yu Hsieh , Wenfeng Lv , Wenjun Tian , Yu Gao , Ningning Jia , Ziqian Ma
IPC分类号： C08L25/10 , C08L29/10 , C08K5/5397 , C08K5/14 , C08J5/18 , C08L25/14 , C08J5/24 , C08F12/34 , C08L25/08
CPC分类号： C08L25/14 , C08F12/34 , C08J5/18 , C08J5/24 , C08J2325/10 , C08J2325/14 , C08J2347/00 , C08J2425/08 , C08J2425/10 , C08J2425/14 , C08K5/14 , C08K5/5397 , C08L25/08 , C08L25/10 , C08L2201/02 , C08L2203/16 , C08L2203/20 , C08L2205/025
摘要： A low dissipation factor resin composition comprises: (A) 100 to 150 parts by weight of a vinyl-containing compound or a polymer thereof; (B) 0 to 75 parts by weight of styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, vinyl functional polybutadiene urethane oligomer or a combination thereof; (C) 30 to 150 parts by weight of flame retardant; and (D) 0.1 to 10 parts by weight of peroxide. The resin composition and a product made thereby are applicable to a copper-clad laminate and a printed circuit board, characterized by having low dissipation factor at high frequency and satisfactory thermal resistance and thermal expansion.
摘要翻译： 低耗散因子树脂组合物包含：（A）100至150重量份的含乙烯基化合物或其聚合物; （B）0〜75重量份苯乙烯 - 丁二烯 - 二乙烯基苯三元共聚物，苯乙烯 - 丁二烯 - 马来酸酐三元共聚物，乙烯基官能聚丁二烯氨基甲酸酯低聚物或其组合; （C）30〜150重量份的阻燃剂; 和（D）0.1〜10重量份的过氧化物。 树脂组合物及其制成的产品可应用于覆铜层压板和印刷电路板，其特征在于在高频下具有低损耗因数和令人满意的耐热性和热膨胀性。
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公开(公告)号：US11787935B2
公开(公告)日：2023-10-17
申请号：US17557893
申请日：2021-12-21
发明人： Yan Zhang , Rongtao Wang , Ningning Jia
摘要： A filler includes a first precursor and a second precursor; the first precursor is a hollow filler with a surface covered by a first silane coupling agent; the second precursor is a non-hollow filler with a surface covered by a second silane coupling agent; the first precursor and the second precursor are connected by a covalent bond formed by a chemical reaction between the first silane coupling agent and the second silane coupling agent. Also included are a preparation method of the filler and a resin composition containing the filler. A prepreg, a resin film, a laminate, or a printed circuit board made from the resin composition has excellent thermal resistance after moisture absorption, low Df variation rate under moisture and heat, low water absorption rate, high copper foil peeling strength, the prepreg having a smooth appearance and even color, and absence of branch-like pattern on laminate.
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公开(公告)号：US11753543B2
公开(公告)日：2023-09-12
申请号：US16863415
申请日：2020-04-30
发明人： Xingxing Yao , Rongtao Wang , Ningning Jia
IPC分类号： C08L79/08 , C08L83/04 , C08L33/10 , C08J5/18 , H05K1/09 , C08L37/00 , C08J5/24 , C08K5/00 , C08K3/013 , H05K1/18
CPC分类号： C08L79/08 , C08J5/18 , C08J5/244 , C08J5/246 , C08L33/10 , C08L37/00 , C08L83/04 , H05K1/095 , C08J2333/10 , C08J2337/00 , C08J2363/00 , C08J2383/04 , C08K3/013 , C08K5/0025 , C08K5/0066 , C08L2207/53 , H05K1/188
摘要： A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 μm copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.
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公开(公告)号：US10676590B2
公开(公告)日：2020-06-09
申请号：US15857486
申请日：2017-12-28
发明人： Yan Zhang , Mingsheng Yuan , Ningning Jia , Rongtao Wang
摘要： Disclosed herein is a resin composition, comprising: a crosslinking agent, its prepolymer, or a combination thereof; and a first unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board and achieve improvement in at least one, more or all properties including volatile content of prepreg, stickiness of prepreg, resin filling property of prepreg, glass transition temperature, dimensional stability under heat, T288 thermal resistance, thermal resistance after moisture absorption, dielectric constant and dissipation factor.
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公开(公告)号：US10414916B2
公开(公告)日：2019-09-17
申请号：US15434794
申请日：2017-02-16
发明人： Xingxing Yao , Rongtao Wang , Chuanfei Xu
摘要： Disclosed is a resin composition, comprising the following components: (A) 100 parts by weight of an epoxy resin; (B) 10 to 60 parts by weight of a diamino diphenyl ether type benzoxazine resin having a softening point of 40° C. to 140° C.; (C) 10 to 40 parts by weight of a co-hardener; and (D) 10 to 40 parts by weight of a flame retardant which comprises (d1) a high melting point flame retardant with a melting point of greater than 260° C. or (d2) a metal phosphinate flame retardant, wherein the metal is selected from Group IIIA elements. Also disclosed is an article of manufacture obtained from the resin composition and a use thereof. Accordingly, the demands of high frequency application can be met, and a balance of low thermal expansion, high thermal resistance and low warpage in the system can be struck.
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9.发明授权公开(公告)号：US09574070B2
公开(公告)日：2017-02-21
申请号：US14731008
申请日：2015-06-04
发明人： Rongtao Wang , Chen-Yu Hsieh , Wenfeng Lv , Wenjun Tian , Yu Gao , Ningning Jia , Ziqian Ma
IPC分类号： C08K5/5397 , C08J5/24 , C08K5/14 , C08J5/18 , H05K1/03
CPC分类号： C08K5/5397 , C08J5/18 , C08J5/24 , C08J2325/08 , C08K5/14 , H05K1/0326 , H05K2201/012
摘要： A low dissipation factor resin composition comprises the following components: (A) an aromatic tetrafunctional vinylbenzyl monomer, its prepolymer or a combination thereof, the aromatic tetrafunctional vinylbenzyl monomer having a structure shown below; (B) flame retardant; and (C) peroxide. The resin composition is applicable to laminates and printed circuit boards featuring low dissipation factor at high frequency and thermal resistance and thermal expansion meeting the demands.
摘要翻译： 低耗散因子树脂组合物包含以下组分：（A）芳族四官能乙烯基苄基单体，其预聚物或其组合，具有如下结构的芳族四官能乙烯基苄基单体; （B）阻燃剂; 和（C）过氧化物。
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10.发明授权Polyphenylene oxide resin, method of preparing polyphenylene oxide resin, polyphenylene oxide prepolymer and resin composition 有权聚苯醚树脂，聚苯醚树脂的制备方法，聚苯醚预聚物和树脂组合物公开(公告)号：US09447238B2
公开(公告)日：2016-09-20
申请号：US14643627
申请日：2015-03-10
发明人： Yu Gao , Chen-Yu Hsieh , Ziqian Ma , Rongtao Wang , Wenjun Tian
IPC分类号： C08G61/00 , C08G65/48 , C08L71/12 , C08K5/5397 , C08K7/18
CPC分类号： C08G65/485 , C08G65/40 , C08K5/5397 , C08K7/18 , C08L71/126 , C08L2201/02 , C08L25/10
摘要： A polyphenylene oxide resin belongs to a polymerized and/or modified thermosetting polyphenylene oxide resin, having a structure represented by formula (I): The polymerized and/or modified thermosetting polyphenylene oxide resin has better flame retardancy, thermal resistance, dielectric constant, dissipation factor, toughness, reactivity, viscosity and solubility. Therefore, the polyphenylene oxide resin is suitable for producing prepregs, resin films, laminates, printed circuit boards and other articles. A method of preparing polyphenylene oxide resins, a prepolymer thereof and a resin composition containing the polyphenylene oxide resin are also provided.
摘要翻译： 聚合和/或改性的热固性聚苯醚树脂具有更好的阻燃性，耐热性，介电常数，耗散因子，韧性，反应性，粘度和溶解性。 因此，聚苯醚树脂适用于制备预浸料，树脂膜，层压板，印刷电路板等制品。 还提供了制备聚苯醚树脂的方法，其预聚物和含有聚苯醚树脂的树脂组合物。
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