公开(公告)号：US20240158634A1

公开(公告)日：2024-05-16

申请号：US18080885

申请日：2022-12-14

Applicant: Elite Material Co., Ltd.

Inventor： Chih-Wei LIN

IPC: C08L79/08 ,  C08J5/24

CPC classification number: C08L79/08 ,  C08J5/244 ,  C08J2379/08 ,  C08J2479/08 ,  C08J2483/04 ,  C08L2205/025 ,  C08L2205/03

Abstract: A resin composition includes a prepolymer which is prepared from a mixture subjected to a prepolymerization reaction, the mixture including 100 parts by weight of a first maleimide resin, 40 to 60 parts by weight of a siloxane compound and 10 to 30 parts by weight of a diamine compound, wherein: the first maleimide resin includes bisphenol A diphenyl ether bismaleimide; the siloxane compound includes a compound of Formula (I), having a molecular weight of 2200 to 2600 g/mol; and the diamine compound includes 4-aminophenyl-4-aminobenzoate. The resin composition may be used to make various articles, such as a varnish, a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including resin compatibility and X-axis coefficient of thermal expansion.

公开(公告)号：US20230062178A1

公开(公告)日：2023-03-02

申请号：US17513979

申请日：2021-10-29

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu HSIEH ,  Chih-Wei LIN ,  Ching LO

IPC: C08L71/00 ,  C08J5/24 ,  C09J7/30 ,  C09J171/00 ,  B32B5/02 ,  B32B15/14 ,  B32B5/26 ,  B32B15/20

Abstract: A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.