Multi-layer printed circuit boards having properties suitable for layer reduction design
    1.
    发明授权
    Multi-layer printed circuit boards having properties suitable for layer reduction design 有权
    多层印刷电路板,具有适合层压设计的特性

    公开(公告)号:US09392683B2

    公开(公告)日:2016-07-12

    申请号:US14554923

    申请日:2014-11-26

    Abstract: A multi-layer printed circuit board comprises: at least two insulation layers, respectively having glass fiber cloth and cured resin covering thereon, the insulation layers being stacked on each other; an internal trace layer formed between two neighboring insulation layers; and an external trace layer formed on an outer surface of the outermost insulation layer; wherein the insulation layers have a dielectric constant of 3.4 or less, and the internal and external trace layers have a trace width between 40 and 75 micrometers, such that the multi-layer printed circuit board has a characteristic impedance between 45 and 55Ω in single-ended signaling and between 90 and 110Ω in differential signaling.

    Abstract translation: 多层印刷电路板包括:分别具有玻璃纤维布和覆盖在其上的固化树脂的至少两个绝缘层,所述绝缘层彼此堆叠; 在两个相邻绝缘层之间形成的内部迹线层; 以及形成在最外绝缘层的外表面上的外部迹线层; 其中所述绝缘层具有3.4或更小的介电常数,并且所述内部和外部迹线层具有介于40和75微米之间的迹线宽度,使得所述多层印刷电路板具有在45和55之间的特征阻抗; 在单端信令和90和110之间和OHgr; 差分信号。

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