公开(公告)号：US09392683B2

公开(公告)日：2016-07-12

申请号：US14554923

申请日：2014-11-26

Applicant: Elite Material Co., Ltd.

Inventor： Ming-Chuan Chang ,  Li-Chih Yu ,  Yu-Te Lin

IPC: H05K1/02 ,  H01P3/08 ,  H05K1/03

CPC classification number: H05K1/024 ,  H01P3/082 ,  H05K1/0242 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/029

Abstract: A multi-layer printed circuit board comprises: at least two insulation layers, respectively having glass fiber cloth and cured resin covering thereon, the insulation layers being stacked on each other; an internal trace layer formed between two neighboring insulation layers; and an external trace layer formed on an outer surface of the outermost insulation layer; wherein the insulation layers have a dielectric constant of 3.4 or less, and the internal and external trace layers have a trace width between 40 and 75 micrometers, such that the multi-layer printed circuit board has a characteristic impedance between 45 and 55Ω in single-ended signaling and between 90 and 110Ω in differential signaling.

Abstract translation: 多层印刷电路板包括：分别具有玻璃纤维布和覆盖在其上的固化树脂的至少两个绝缘层，所述绝缘层彼此堆叠; 在两个相邻绝缘层之间形成的内部迹线层; 以及形成在最外绝缘层的外表面上的外部迹线层; 其中所述绝缘层具有3.4或更小的介电常数，并且所述内部和外部迹线层具有介于40和75微米之间的迹线宽度，使得所述多层印刷电路板具有在45和55之间的特征阻抗; 在单端信令和90和110之间和OHgr; 差分信号。

公开(公告)号：US10717807B1

公开(公告)日：2020-07-21

申请号：US16383913

申请日：2019-04-15

Applicant: Elite Material Co., Ltd.

Inventor： Yu-Te Lin

IPC: C08G59/42 ,  C08G59/40 ,  C08L63/00 ,  C08J5/24

Abstract: Disclosed are an epoxy resin composition and an article made therefrom, the epoxy resin composition comprising an epoxy resin and a co-hardener, wherein: relative to the epoxy resin having a total equivalent of epoxy group of 1, the co-hardener comprises: (A) an acid anhydride having a total equivalent of acid anhydride group of 0.044-0.183; (B) a polyester having a total equivalent of ester group of 0.120-0.550; (C) a first phenolic resin having an equivalent of hydroxyl group of 0.092-0.550; and (D) a second phenolic resin having an equivalent of hydroxyl group of 0.143-0.592; and a sum of equivalent of functional groups of the co-hardener is 0.84-1.11.

公开(公告)号：US11840630B2

公开(公告)日：2023-12-12

申请号：US17746727

申请日：2022-05-17

Applicant: Elite Material Co., Ltd.

Inventor： Yu-Te Lin ,  Chien-Cheng Wang

IPC: C08L71/12 ,  C08L53/02 ,  C08J5/24

CPC classification number: C08L71/12 ,  C08J5/24 ,  C08L53/02 ,  C08J2353/02 ,  C08J2371/12

Abstract: A resin composition includes 50 parts by weight of a vinyl-containing polyphenylene ether resin, 1 part by weight to 30 parts by weight of a styrene-butadiene-styrene block copolymer and 0.5 part by weight to 30 parts by weight of a zinc molybdate-covered silica, wherein the zinc molybdate-covered silica has a mass ratio of zinc molybdate to silica of between 1:9 and 2:8. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including gel time stability, copper foil peeling strength, difference rate of dissipation factor and conductive anodic filament test.