Cast Net Mouth Grip
    1.
    发明申请
    Cast Net Mouth Grip 审中-公开
    铸网嘴手柄

    公开(公告)号:US20160219851A1

    公开(公告)日:2016-08-04

    申请号:US14613444

    申请日:2015-02-04

    Applicant: Eric Lane

    Inventor: Eric Lane

    CPC classification number: A01K75/00 A01K74/00 A01K97/00

    Abstract: A flexible flap is secured to the perimeter of a conventional cast net and is configured to be grasped by a human user's mouth and teeth. The device includes mating jaw portions configured to accept and be secured to a perimeter cord of a cast net.

    Abstract translation: 柔性翼片固定到常规铸网的周边上,并且构造成由人类用户的嘴和牙齿抓住。 该装置包括被配置成接受和固定到铸网的周线的配合钳口部分。

    Method for fabricating an isolation region in a semiconductor substrate
    2.
    发明授权
    Method for fabricating an isolation region in a semiconductor substrate 失效
    在半导体衬底中制造隔离区域的方法

    公开(公告)号:US4876214A

    公开(公告)日:1989-10-24

    申请号:US201491

    申请日:1988-06-02

    CPC classification number: H01L21/32137 H01L21/763

    Abstract: An isolation region is fabricated in a silicon substrate by first forming a silicon dioxide insulating layer on the substrate. A silicon nitride mask layer and an oxide layer are then deposited on the insulating layer. The oxide, mask and insulating layers and the substrate are etched to form a trench in the substrate. A channel stopper is implanted in substrate below the trench and the oxide layer is then stripped. Thereafter, the trench surface is oxidized to extend the insulating layer into the trench. Next, the trench is partially filled with polysilicon material, the surface of which is initially oxidized to extend the insulating layer over the trench. The mask layer is etched back to expose portions of the insulating layer adjacent the trench. The upper surface of the polysilicon material in the trench and portions of the substrate beneath exposed portions of the insulating layer are further oxidized to thicken the insulating layer over the trench.

    Abstract translation: 通过首先在衬底上形成二氧化硅绝缘层,在硅衬底中制造隔离区。 然后在绝缘层上沉积氮化硅掩模层和氧化物层。 蚀刻氧化物,掩模和绝缘层以及衬底,以在衬底中形成沟槽。 通道阻挡件植入在沟槽下方的衬底中,然后剥离氧化物层。 此后,沟槽表面被氧化以将绝缘层延伸到沟槽中。 接下来,沟槽部分地填充有多晶硅材料,其表面最初被氧化以在沟槽上延伸绝缘层。 掩模层被回蚀以暴露与沟槽相邻的绝缘层的部分。 沟槽中的多晶硅材料的上表面和绝缘层暴露部分下方的衬底部分被进一步氧化,以使沟槽上的绝缘层变厚。

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