-
1.
公开(公告)号:US4876214A
公开(公告)日:1989-10-24
申请号:US201491
申请日:1988-06-02
申请人: Tadanori Yamaguchi , Evan Patton , Eric Lane , Simon Yu
发明人: Tadanori Yamaguchi , Evan Patton , Eric Lane , Simon Yu
IPC分类号: H01L21/3213 , H01L21/763
CPC分类号: H01L21/32137 , H01L21/763
摘要: An isolation region is fabricated in a silicon substrate by first forming a silicon dioxide insulating layer on the substrate. A silicon nitride mask layer and an oxide layer are then deposited on the insulating layer. The oxide, mask and insulating layers and the substrate are etched to form a trench in the substrate. A channel stopper is implanted in substrate below the trench and the oxide layer is then stripped. Thereafter, the trench surface is oxidized to extend the insulating layer into the trench. Next, the trench is partially filled with polysilicon material, the surface of which is initially oxidized to extend the insulating layer over the trench. The mask layer is etched back to expose portions of the insulating layer adjacent the trench. The upper surface of the polysilicon material in the trench and portions of the substrate beneath exposed portions of the insulating layer are further oxidized to thicken the insulating layer over the trench.
摘要翻译: 通过首先在衬底上形成二氧化硅绝缘层,在硅衬底中制造隔离区。 然后在绝缘层上沉积氮化硅掩模层和氧化物层。 蚀刻氧化物,掩模和绝缘层以及衬底,以在衬底中形成沟槽。 通道阻挡件植入在沟槽下方的衬底中,然后剥离氧化物层。 此后,沟槽表面被氧化以将绝缘层延伸到沟槽中。 接下来,沟槽部分地填充有多晶硅材料,其表面最初被氧化以在沟槽上延伸绝缘层。 掩模层被回蚀以暴露与沟槽相邻的绝缘层的部分。 沟槽中的多晶硅材料的上表面和绝缘层暴露部分下方的衬底部分被进一步氧化,以使沟槽上的绝缘层变厚。
-
公开(公告)号:USD590763S1
公开(公告)日:2009-04-21
申请号:US29319926
申请日:2008-06-17
申请人: Simon Yu , Masaya Kikuchi
设计人: Simon Yu , Masaya Kikuchi
-
公开(公告)号:USD586279S1
公开(公告)日:2009-02-10
申请号:US29319934
申请日:2008-06-17
申请人: Yuichi Yamazaki , Simon Yu , Walter Ma , Masaya Kikuchi
设计人: Yuichi Yamazaki , Simon Yu , Walter Ma , Masaya Kikuchi
-
公开(公告)号:US20080047072A1
公开(公告)日:2008-02-28
申请号:US11507133
申请日:2006-08-22
申请人: Hsien-Wen Chang , Simon Yu
发明人: Hsien-Wen Chang , Simon Yu
IPC分类号: A47C27/08
CPC分类号: A47C27/081 , A47C27/084
摘要: An inflatable item includes a hollow body and a valve is connected to the hollow body. The valve is a bladder which has an inlet from which air is introduced in the bladder, and an outlet through which the air is introduced into the hollow body. A tubular insertion is engaged with the inlet and has a passage defined therethrough. A bouncing member is mounted to the tubular insertion so that the user compresses the bladder to push the air in the bladder into the hollow body and the bouncing member bounces the bladder back to original status. The hollow body can be inflated by repeatedly compressing the bladder. A cap removably seals the inlet after the inflatable item is inflated.
摘要翻译: 充气物品包括中空体,阀连接到中空体。 阀是具有入口的气囊,空气从气体引入到气囊中,以及出口,空气通过该出口引入中空体。 管状插入件与入口接合并具有通过其限定的通道。 弹性构件安装到管状插入件上,使得使用者压缩膀胱以将膀胱中的空气推入中空体并且弹跳构件使膀胱反弹回到原始状态。 中空体可以通过反复压缩膀胱而膨胀。 在充气物品充气之后,帽可移除地密封入口。
-
-
公开(公告)号:USD530660S1
公开(公告)日:2006-10-24
申请号:US29251633
申请日:2006-01-10
申请人: Johnathan Norman , Patrick J. Hebert , Simon Yu
设计人: Johnathan Norman , Patrick J. Hebert , Simon Yu
-
公开(公告)号:USD529850S1
公开(公告)日:2006-10-10
申请号:US29251631
申请日:2006-01-10
申请人: Simon Yu , Jesse Lessard
设计人: Simon Yu , Jesse Lessard
-
公开(公告)号:US5861602A
公开(公告)日:1999-01-19
申请号:US506240
申请日:1995-07-24
申请人: Wilton Louis Cox , Charles David Fieselman , Leonard Douglas Hobgood , Paul Gilbert Watson, Jr. , Simon Yu
发明人: Wilton Louis Cox , Charles David Fieselman , Leonard Douglas Hobgood , Paul Gilbert Watson, Jr. , Simon Yu
CPC分类号: H05K5/0269 , B23K26/10 , B23K26/12 , B23K26/123 , B23K26/127 , B23K26/24 , B23K26/244
摘要: The present invention features an improvement in the construction and manufacturing of small peripheral cartridges which plug into exterior slots of computer systems such as PCMCIA cards. The metal cover of a snap-together PCMCIA card is typically tack welded at its seams An inexpensive and highly accurate welding technique is presented for performing this welding operation. The inventive welding technique may be used without risk of damage to highly sensitive electronic components. The lap joint seam formed using the techniques exhibits the strength and stiffness characteristics that allow the size of welded seams to be minimized thereby also reducing the risk of burn-through or other damage to the cards during manufacturing.
摘要翻译: 本发明的特征在于,在诸如PCMCIA卡之类的计算机系统的外部插槽中的小外围盒的结构和制造方面的改进。 卡扣式PCMCIA卡的金属盖通常在其接缝处进行定位焊接提供了一种廉价且高精度的焊接技术来执行该焊接操作。 可以使用本发明的焊接技术而不会对高度敏感的电子部件造成损害的风险。 使用这些技术形成的搭接接缝具有使焊接接缝尺寸最小化的强度和刚度特性,从而也降低了在制造过程中烧穿或其他损坏卡片的危险。
-
公开(公告)号:US5394609A
公开(公告)日:1995-03-07
申请号:US142997
申请日:1993-10-26
申请人: Mark E. Ferguson , Kenneth J. Guskie , Leon S. Nguyen , Joseph D. Poole , Stuart L. Young , Simon Yu
发明人: Mark E. Ferguson , Kenneth J. Guskie , Leon S. Nguyen , Joseph D. Poole , Stuart L. Young , Simon Yu
CPC分类号: H01R43/205 , H05K3/34 , B23K2201/36 , H05K1/182 , H05K2203/0165 , H05K2203/1572 , H05K3/0097 , H05K3/341 , Y10T29/49144
摘要: Disclosed is a method of populating printed circuit boards with surface mount technology devices in a multi-board work board holder. The method includes the steps placing the printed circuit boards into a multi-board work board holder having a plurality of apertures corresponding to the individual printed circuit boards. The multi-board work board holder is placed onto a surface mount technology production line, and solder paste is selectively applied onto contact pads on surfaces of the printed circuit boards. Integrated circuit chips are next placed onto the solder paste bearing surface of the printed circuit boards, with the contact leads of the integrated circuit chips bearing on deposited solder paste. The printed circuit boards and the work board holder are heated to the reflow temperature of the solder. The x-y plane and z axis coefficients of thermal expansion of the multi-board work board holder are matched to the x-y plane and z-axis coefficients of thermal expansion of the printed circuit boards to avoid warpage and misalignment of the printed circuit boards.
摘要翻译: 公开了一种在多板工作板固定器中用表面贴装技术装置填充印刷电路板的方法。 该方法包括将印刷电路板放置到具有对应于各个印刷电路板的多个孔的多板工作板保持器中的步骤。 将多板工作板固定器放置在表面安装技术生产线上,并且将焊膏选择性地施加到印刷电路板表面上的接触焊盘上。 集成电路芯片接下来放置在印刷电路板的焊膏支撑表面上,集成电路芯片的接触引线承载沉积的焊膏。 印刷电路板和工作板支架被加热到焊料的回流温度。 多板工作板支架的x-y平面和z轴热膨胀系数与印刷电路板的x-y平面和z轴热膨胀系数匹配,以避免印刷电路板的翘曲和不对准。
-
公开(公告)号:US07863222B2
公开(公告)日:2011-01-04
申请号:US12221325
申请日:2008-08-01
申请人: Donald G. Payan , Mary Shen , Simon Yu , Todd M. Kinsella , Yasumichi Hitoshi
发明人: Donald G. Payan , Mary Shen , Simon Yu , Todd M. Kinsella , Yasumichi Hitoshi
CPC分类号: C12N15/1093 , C12N15/66 , C12P19/34 , C40B40/08 , C40B50/06
摘要: As noted above, certain aspects of this disclosure relate to a library of nucleic acid vectors, as well as a method for making the same. In certain embodiments, the library of nucleic acid vectors comprises: a plurality of nucleic acid molecules of the following formula: S1—R—S2 wherein, in each nucleic acid of the plurality: S1 and S2 are each at least 15 nucleotides in length; S1 and S2 are complementary to each other along their entire length; either S1 or S2 is complementary along its entire length to a sequence in eukaryotic mRNA; and R is a six base recognition site for a restriction endonuclease; and wherein S1 and S2 vary in nucleotide sequence between different members of the plurality. A method for amplifying a circular nucleic acid is also provided.
摘要翻译: 如上所述,本公开的某些方面涉及核酸载体文库以及其制备方法。 在某些实施方案中,核酸载体文库包含:多个下式的核酸分子:S1-R-S2,其中在多个的每个核酸中,S1和S2的长度各自为至少15个核苷酸; S1和S2沿其整个长度彼此互补; S1或S2在其整个长度上与真核mRNA中的序列互补; R是限制性内切核酸酶的六碱基识别位点; 并且其中S1和S2在多个不同成员之间的核苷酸序列变化。 还提供了扩增环状核酸的方法。
-
-
-
-
-
-
-
-
-