-
-
公开(公告)号：USD530660S1
公开(公告)日：2006-10-24
申请号：US29251633
申请日：2006-01-10
Applicant: Johnathan Norman , Patrick J. Hebert , Simon Yu
Designer： Johnathan Norman , Patrick J. Hebert , Simon Yu
-
公开(公告)号：USD529850S1
公开(公告)日：2006-10-10
申请号：US29251631
申请日：2006-01-10
Applicant: Simon Yu , Jesse Lessard
Designer： Simon Yu , Jesse Lessard
-
公开(公告)号：US5861602A
公开(公告)日：1999-01-19
申请号：US506240
申请日：1995-07-24
Applicant: Wilton Louis Cox , Charles David Fieselman , Leonard Douglas Hobgood , Paul Gilbert Watson, Jr. , Simon Yu
Inventor： Wilton Louis Cox , Charles David Fieselman , Leonard Douglas Hobgood , Paul Gilbert Watson, Jr. , Simon Yu
CPC classification number: H05K5/0269 , B23K26/10 , B23K26/12 , B23K26/123 , B23K26/127 , B23K26/24 , B23K26/244
Abstract: The present invention features an improvement in the construction and manufacturing of small peripheral cartridges which plug into exterior slots of computer systems such as PCMCIA cards. The metal cover of a snap-together PCMCIA card is typically tack welded at its seams An inexpensive and highly accurate welding technique is presented for performing this welding operation. The inventive welding technique may be used without risk of damage to highly sensitive electronic components. The lap joint seam formed using the techniques exhibits the strength and stiffness characteristics that allow the size of welded seams to be minimized thereby also reducing the risk of burn-through or other damage to the cards during manufacturing.
Abstract translation: 本发明的特征在于，在诸如PCMCIA卡之类的计算机系统的外部插槽中的小外围盒的结构和制造方面的改进。 卡扣式PCMCIA卡的金属盖通常在其接缝处进行定位焊接提供了一种廉价且高精度的焊接技术来执行该焊接操作。 可以使用本发明的焊接技术而不会对高度敏感的电子部件造成损害的风险。 使用这些技术形成的搭接接缝具有使焊接接缝尺寸最小化的强度和刚度特性，从而也降低了在制造过程中烧穿或其他损坏卡片的危险。
-
公开(公告)号：US5394609A
公开(公告)日：1995-03-07
申请号：US142997
申请日：1993-10-26
Applicant: Mark E. Ferguson , Kenneth J. Guskie , Leon S. Nguyen , Joseph D. Poole , Stuart L. Young , Simon Yu
Inventor： Mark E. Ferguson , Kenneth J. Guskie , Leon S. Nguyen , Joseph D. Poole , Stuart L. Young , Simon Yu
CPC classification number: H01R43/205 , H05K3/34 , B23K2201/36 , H05K1/182 , H05K2203/0165 , H05K2203/1572 , H05K3/0097 , H05K3/341 , Y10T29/49144
Abstract: Disclosed is a method of populating printed circuit boards with surface mount technology devices in a multi-board work board holder. The method includes the steps placing the printed circuit boards into a multi-board work board holder having a plurality of apertures corresponding to the individual printed circuit boards. The multi-board work board holder is placed onto a surface mount technology production line, and solder paste is selectively applied onto contact pads on surfaces of the printed circuit boards. Integrated circuit chips are next placed onto the solder paste bearing surface of the printed circuit boards, with the contact leads of the integrated circuit chips bearing on deposited solder paste. The printed circuit boards and the work board holder are heated to the reflow temperature of the solder. The x-y plane and z axis coefficients of thermal expansion of the multi-board work board holder are matched to the x-y plane and z-axis coefficients of thermal expansion of the printed circuit boards to avoid warpage and misalignment of the printed circuit boards.
Abstract translation: 公开了一种在多板工作板固定器中用表面贴装技术装置填充印刷电路板的方法。 该方法包括将印刷电路板放置到具有对应于各个印刷电路板的多个孔的多板工作板保持器中的步骤。 将多板工作板固定器放置在表面安装技术生产线上，并且将焊膏选择性地施加到印刷电路板表面上的接触焊盘上。 集成电路芯片接下来放置在印刷电路板的焊膏支撑表面上，集成电路芯片的接触引线承载沉积的焊膏。 印刷电路板和工作板支架被加热到焊料的回流温度。 多板工作板支架的x-y平面和z轴热膨胀系数与印刷电路板的x-y平面和z轴热膨胀系数匹配，以避免印刷电路板的翘曲和不对准。
-
Patent Agency Ranking
公开(公告)号：USD1028973S1
公开(公告)日：2024-05-28
申请号：US29794932
申请日：2021-06-16
Applicant: Simon Yu
Designer： Simon Yu
Abstract: FIG. 1 is a perspective view of an intelligent touch integrated machine shell showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines throughout the drawing figures depict portions of the intelligent touch integrated machine shell that form no part of the claimed design.-
-
公开(公告)号：USD561074S1
公开(公告)日：2008-02-05
申请号：US29245498
申请日：2005-12-27
Applicant: Fernando Montijo , Simon Yu
Designer： Fernando Montijo , Simon Yu
-
公开(公告)号：USD534465S1
公开(公告)日：2007-01-02
申请号：US29245492
申请日：2005-12-27
Applicant: Michael Wiedeman , Simon Yu
Designer： Michael Wiedeman , Simon Yu
-
公开(公告)号：USD531101S1
公开(公告)日：2006-10-31
申请号：US29251632
申请日：2006-01-10
Applicant: Simon Yu , Cameron Mauldin
Designer： Simon Yu , Cameron Mauldin
-
-
-
-
-
-
-
-
-
Search Results
34
records
(took 0.027 seconds)
