公开(公告)号：US20110140284A1

公开(公告)日：2011-06-16

申请号：US13000390

申请日：2009-08-04

申请人： Ewald K.M. Günther ,  Siegfried Herrmann ,  Ulrich Zehnder ,  Herbert Brunner

发明人： Ewald K.M. Günther ,  Siegfried Herrmann ,  Ulrich Zehnder ,  Herbert Brunner

IPC分类号： H01L23/52

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/645 ,  H01L2924/0002 ,  H05B33/0803 ,  H01L2924/00

摘要： An optoelectronic component includes a carrier with a mounting side and having at least one functional element, at least one substrateless optoelectronic semiconductor chip with a top and an opposed bottom and is electrically conductive by way of the top and the bottom, wherein the bottom faces the mounting side and the semiconductor chip is mounted on the mounting side, and at least one structured electrical contact film located on the top.

摘要翻译： 光电子部件包括具有安装侧并具有至少一个功能元件的载体，至少一个具有顶部和相对底部的无基底光电半导体芯片，并且通过顶部和底部导电，其中底部面向 安装侧，半导体芯片安装在安装侧，并且至少一个结构化电接触膜位于顶部。