公开(公告)号：US09276138B2

公开(公告)日：2016-03-01

申请号：US13812880

申请日：2011-07-13

申请人： Siegfried Herrmann

发明人： Siegfried Herrmann

IPC分类号： H01L31/02 ,  H01L27/15 ,  H01L33/62 ,  H01L21/66 ,  H01L33/00

CPC分类号： H01L31/02 ,  H01L22/14 ,  H01L27/153 ,  H01L33/0079 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of producing an optoelectronic semiconductor component includes arranging a semiconductor layer stack with a pn-junction on a substrate, lateral patterning of the semiconductor layer sack into a plurality of pairs of first semiconductor bodies and second semiconductor bodies spaced from one another in a lateral direction, detaching the substrate from the pairs of first semiconductor bodies and second semiconductor bodies, applying at least one pair of first semiconductor bodies and second semiconductor bodies to a connection carrier including electrical connection points and/or at least one conductor track, and electrically connecting the semiconductor bodies of a pair of first semiconductor bodies and second semiconductor bodies by the connection points and/or the at least one conductor track such that the pn-junction of the first semiconductor body connects in antiparallel to the pn-junction of the second semiconductor body.

摘要翻译： 一种制造光电子半导体部件的方法包括在衬底上布置具有pn结的半导体层堆叠，将半导体层袋横向图案化成多对第一半导体本体和第二半导体本体，所述第一半导体本体和第二半导体本体在侧向 将所述基板从所述第一半导体体和第二半导体体对分离，将至少一对第一半导体体和第二半导体体施加到包括电连接点和/或至少一个导体轨道的连接载体上，并电连接 通过连接点和/或至少一个导体轨道的一对第一半导体本体和第二半导体本体的半导体本体，使得第一半导体本体的pn结与第二半导体的pn结反向连接 身体。

公开(公告)号：US09041020B2

公开(公告)日：2015-05-26

申请号：US13823726

申请日：2011-07-27

申请人： Siegfried Herrmann ,  Helmut Fischer

发明人： Siegfried Herrmann ,  Helmut Fischer

IPC分类号： H01L33/62 ,  H01L21/00 ,  H01L33/00 ,  H01L33/64 ,  H01S5/02 ,  H01S5/022 ,  H01L33/38 ,  H01L33/48

CPC分类号： H01L33/62 ,  H01L33/0079 ,  H01L33/38 ,  H01L33/48 ,  H01L33/486 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01068 ,  H01L2933/0016 ,  H01S5/0217 ,  H01S5/02256 ,  H01L2924/00014

摘要： The invention relates to an optoelectronic semiconductor component, comprising a substrate-free optoelectronic semiconductor chip (1), which has a first main surface (1a) on an upper face and a second main surface (1b) on a lower face, and a metal carrier (2), which is arranged on the lower face of the optoelectronic semiconductor chip (1), wherein the metal carrier (2) protrudes over the optoelectronic semiconductor chip (1) in at least one lateral direction (1) and the metal carrier (2) is deposited on the second main surface (1b) of the optoelectronic semiconductor chip (1) using a galvanic or electroless plating method.

摘要翻译： 本发明涉及一种光电子半导体元件，它包括一个无衬底的光电半导体芯片（1），它在上表面上具有第一主表面（1a），在下表面上具有第二主表面（1b） 载体（2），其布置在光电半导体芯片（1）的下表面上，其中金属载体（2）在至少一个横向方向（1）上突出在光电半导体芯片（1）上方，并且金属载体 （2）使用电镀或无电镀方法沉积在光电半导体芯片（1）的第二主表面（1b）上。

公开(公告)号：US08796115B2

公开(公告)日：2014-08-05

申请号：US13440472

申请日：2012-04-05

申请人： Jörg Erich Sorg ,  Stefan Gruber ,  Siegfried Herrmann ,  Berthold Hahn

发明人： Jörg Erich Sorg ,  Stefan Gruber ,  Siegfried Herrmann ,  Berthold Hahn

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/00 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0079 ,  H01L33/508 ,  H01L33/62 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/48091 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side and which are fixed by their rear side—opposite the front side—on a first main face of a common carrier body, wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.

摘要翻译： 一种发光二极管装置，包括多个半导体芯片，所述多个半导体芯片被设置用于从其前侧发射电磁辐射并且通过它们的正面侧的后侧固定在公共载体主体的第一主面上，其中， 半导体芯片由相应的无基板的半导体层堆叠构成，并且在没有辅助载体的情况下固定到公共载体主体，以及制造这种发光二极管装置的方法。

公开(公告)号：US08733950B2

公开(公告)日：2014-05-27

申请号：US13062792

申请日：2009-09-09

申请人： Stefan Grötsch ,  Ewald Karl Michael Günther ,  Alexander Wilm ,  Siegfried Herrmann

发明人： Stefan Grötsch ,  Ewald Karl Michael Günther ,  Alexander Wilm ,  Siegfried Herrmann

IPC分类号： G03B21/26 ,  H01J1/62 ,  H01J63/04

CPC分类号： G03B21/2033

摘要： An LED projector includes a plurality of light sources; and an image generator which includes an arrangement of pixels, each pixel including at least one light source; wherein the LEDs are stacked epi-LEDs which include layers arranged above one another for different colors, or each pixel includes an emission surface and at least two LEDs are arranged adjacent one another in the emission surface.

摘要翻译： LED投影仪包括多个光源; 以及图像生成器，其包括像素的排列，每个像素包括至少一个光源; 其中所述LED是层叠的epi-LED，其包括不同颜色彼此排列的层，或者每个像素包括发射表面，并且至少两个LED在发射表面中彼此相邻地布置。

公开(公告)号：US08393748B2

公开(公告)日：2013-03-12

申请号：US12528960

申请日：2008-01-23

申请人： Siegfried Herrmann ,  Berthold Hahn ,  Joerg Sorg ,  Stefan Gruber

发明人： Siegfried Herrmann ,  Berthold Hahn ,  Joerg Sorg ,  Stefan Gruber

IPC分类号： F21V33/00

CPC分类号： G02B6/0055 ,  G02B6/0018 ,  G02B6/0051 ,  G02B6/0073 ,  G02B6/0076

摘要： An arrangement includes a semiconductor chip, which is designed to emit light during operation, and a cover layer, which lies across from the light-emitting surface of the semiconductor chip, such that light emitted from the semiconductor chip penetrates into the cover layer. In an area of the cover layer, overlapping with the chip, a light deflecting structure is provided by means of which light penetrating into the cover layer is deflected. The cover layer acts as an optical waveguide and is designed to emit the light such that it is distributed over the upper surface of cover layer.

摘要翻译： 一种装置，其包括：半导体芯片，其被设计为在操作期间发光;以及覆盖层，其覆盖半导体芯片的发光表面，使得从半导体芯片发射的光穿透到覆盖层。 在覆盖层的与芯片重叠的区域中，提供光偏转结构，通过该偏转结构，穿透到覆盖层中的光被偏转。 覆盖层用作光波导，并被设计成发射光，使得其分布在覆盖层的上表面上。

公开(公告)号：US08273588B2

公开(公告)日：2012-09-25

申请号：US12838075

申请日：2010-07-16

申请人： Berthold Hahn ,  Markus Maute ,  Siegfried Herrmann

发明人： Berthold Hahn ,  Markus Maute ,  Siegfried Herrmann

IPC分类号： H01L21/00

CPC分类号： H01L25/167 ,  H01L2224/16225 ,  H01L2924/13091 ,  H01L2924/00

摘要： A method for producing a luminous device is specified. A number of light emitting diodes each have a radiation-transmissive carrier and at least two semiconductor bodies spatially separated from one another. Each semiconductor body is provided for generating electromagnetic radiation. The semiconductor bodies can be driven separately from one another and the semiconductor bodies are arranged at the top side of the radiation-transmissive carrier on the radiation-transmissive carrier. A chip assemblage is composed of CMOS chips each of which has at least two connection locations at its top side. At least one of the light emitting diodes is connected to one of the CMOS chips. The light emitting diode is arranged, at the top side of the radiation-transmissive carrier, at the top side of the CMOS chip and each semiconductor body of the light emitting diode is connected to a connection location of the CMOS chip.

摘要翻译： 规定了发光装置的制造方法。 多个发光二极管各自具有辐射透射载体和在空间上彼此分离的至少两个半导体体。 每个半导体本体被提供用于产生电磁辐射。 半导体本体可以彼此分开地驱动，并且半导体本体被布置在辐射透射载体上的辐射透射性载体的顶侧。 芯片组合由CMOS芯片组成，每个芯片在其顶侧具有至少两个连接位置。 至少一个发光二极管连接到CMOS芯片之一。 发光二极管在辐射透射载体的顶侧设置在CMOS芯片的顶侧，并且发光二极管的每个半导体本体连接到CMOS芯片的连接位置。

公开(公告)号：US20120223416A1

公开(公告)日：2012-09-06

申请号：US13497979

申请日：2010-11-11

申请人： Manfred Scheubeck ,  Siegfried Herrmann

发明人： Manfred Scheubeck ,  Siegfried Herrmann

IPC分类号： H01L29/861 ,  H01L21/02

CPC分类号： H01L25/167 ,  H01L33/0079 ,  H01L33/382 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thin-film semiconductor component includes a carrier and a semiconductor body with a semiconductor layer sequence including an active region provided to generate radiation. The semiconductor body is externally electrically contactable by a first contact and a second contact. The carrier includes a protection diode structure connected electrically in parallel to the semiconductor body. The protection diode structure includes a first diode and a second diode. The first diode and the second diode are electrically connected in series in mutually opposing directions with regard to their forward direction.

摘要翻译： 薄膜半导体部件包括载体和具有半导体层序列的半导体本体，半导体层序列包括提供用于产生辐射的有源区。 半导体本体可以通过第一接触和第二接触从外部电接触。 载体包括与半导体本体并联电连接的保护二极管结构。 保护二极管结构包括第一二极管和第二二极管。 第一二极管和第二二极管相对于它们的正向以相互相反的方向串联电连接。

公开(公告)号：US08217566B2

公开(公告)日：2012-07-10

申请号：US12922180

申请日：2009-06-17

申请人： Siegfried Herrmann

发明人： Siegfried Herrmann

IPC分类号： H05B33/00

CPC分类号： H01L33/62 ,  H01L33/32 ,  H01L33/385 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

摘要： An electroluminescent device includes an inorganic luminescence diode chip having a radiation exit area, a plurality of contact webs provided to spread current and arranged on the radiation exit area, and a contact structure arranged outside the radiation exit area and electrically conductively connected to contact webs.

摘要翻译： 电致发光器件包括具有辐射出射区域的无机发光二极管芯片，设置用于扩散电流并布置在辐射出射区域上的多个接触腹板，以及布置在辐射出口区域外部并且电连接到接触腹板的接触结构。

公开(公告)号：US20120025219A1

公开(公告)日：2012-02-02

申请号：US13201954

申请日：2010-03-08

申请人： Siegfried Herrmann

发明人： Siegfried Herrmann

IPC分类号： H01L27/15

CPC分类号： H05K1/183 ,  H01L25/0756 ,  H01L2924/0002 ,  H05K1/14 ,  H05K2201/09481 ,  H05K2201/10106 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10727 ,  H01L2924/00

摘要： An arrangement includes at least two optoelectronic individual elements. At least two of the individual elements overlap partially in a lateral direction. Indirect or direct electrical contacting between the at least two laterally overlapping individual elements is brought about by at least one conductor track on a carrier top of the one individual element and by at least one conductor track on a carrier bottom of the other individual element.

摘要翻译： 一种装置包括至少两个光电单独元件。 单个元件中的至少两个在横向方向上部分重叠。 所述至少两个横向重叠的单独元件之间的间接或直接的电接触由所述一个单独元件的载体顶部上的至少一个导体轨道和另一个单独元件的载体底部上的至少一个导体轨道引起。

公开(公告)号：US20110227103A1

公开(公告)日：2011-09-22

申请号：US13121017

申请日：2009-08-26

申请人： Georg Bogner ,  Berthold Hahn ,  Siegfried Herrmann

发明人： Georg Bogner ,  Berthold Hahn ,  Siegfried Herrmann

IPC分类号： H01L27/15 ,  H01L33/62 ,  H01L33/48 ,  H01L33/00

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L25/0756 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/3442 ,  H01L2924/00

摘要： An LED module includes a layer stack of a substrateless LED, an emission area of the layer stack, the emission area being provided for light emission, a substrate having a top side on which the substrateless LED is arranged, contact areas arranged at a side area of the substrate, wherein the side area is perpendicular to the emission area, and/or including a base body which has contact areas at a side area and on which the substrate is mounted in such a way that the side area is perpendicular to the emission area, a first connection line between the LED and one of the contact area, and a second connection line between the LED and another of the contact areas.

摘要翻译： LED模块包括无衬底LED的层叠层，层堆叠的发射区域，用于发光的发射区域，具有布置无衬底LED的顶侧的衬底，布置在侧面区域的接触区域 ，其中所述侧面区域垂直于所述发射区域，和/或包括在侧面区域具有接触区域并且所述基板安装在所述基底上的基体，使得所述侧面区域垂直于所述发射 所述LED与所述接触区域中的一个之间的第一连接线以及所述LED与所述接触区域中的另一个之间的第二连接线。