摘要:
The device has a printed-circuit board (5), on one side of which at least one antenna (1) is located and, on the other side of which electrical circuits (3) are located. An electromagnetic shield between the antenna (1) and the electrical circuits (3) is realized in a manner that is simple with regard for production engineering by locating a feeder network (13, 15)—developed using a coplanar circuit technique and with which the at least one antenna (1) is contacted—on the antenna-side surface of the printed-circuit board (5), and by covering the antenna-side surface of the printed-circuit board (5) with the connected-to-ground outer conductor (45) of the coplanar circuit to such an extent that the required shield between the antenna (1) and the electrical circuits (3) is produced as a result.
摘要:
It is provided that the semiconductor component is a component of a semiconductor circuit (10) comprising a first silicon layer (12), an adjoining silicon dioxide layer (insulating layer (14)) and a subsequent further silicon layer (structured layer (16)) (SOI wafer), and the semiconductor component comprises an IMPATT oscillator (30), having a resonator (24) which includes a metallized cylinder (18) of silicon, disposed in the structured layer (16); a coupling disk (28) covering the cylinder (18) in the region of the first layer (12); and an IMPATT diode (32), communicating with the cylinder (18) of the resonator (24) via a recess (38) in the coupling disk (28); and a reference oscillator (46) of lower frequency, having a resonator (24) which includes a metal cylinder (18) of silicon, disposed in the structured layer (16), and coupling disk (28) covering the cylinder in the region of the first layer (12); and a microwave conductor, communicating with the cylinder (18) of the resonator (24) via a recess (38) in the coupling disk (28), and the reference oscillator, via an active oscillator circuit (58), serves the purpose of frequency stabilization of the IMPATT oscillator (30); with integrated Schottky diodes; and a transmitting and receiving antenna (49).
摘要:
A compact radar device that can be produced with little complication has at least one cavity (3) with a radiation element (10) disposed therein and a shielded chamber (2) for electrical circuits (4). A housing (1) is designed in such a manner that it defines both the shielded chamber (2) for the electrical circuits (4) and the at least one cavity (3) for the at least one antenna radiation element (10). A printed board (5) carries the electrical circuits (4) and is inserted into the housing (1) between the two chambers (2, 3) as a shielding partition. The antenna radiation element (10) is electrically coupled to the two conductor arms to a feed network on the printed board (5) via contact pins (16, 19).
摘要:
The invention relates to a compact radar device that can be produced with little complication and that comprises at least one cavity (3) with a radiation element (10) disposed therein and a shielded chamber (2) for electrical circuits (4). A housing (1) is designed in such a manner that it defines both the shielded chamber (2) for the electrical circuits (4) and the at least one cavity (3) for the at least one antenna radiation element (10). A printed board (5) carries the electrical circuits (4) and is inserted into the housing (1) between the two chambers (2, 3) as a shielding partition. The antenna radiation element (10) is electrically coupled to the two conductor arms to a feed network on the printed board (5) via contact pins (16, 19).
摘要:
The invention relates to an integrated semiconductor component for high-frequency measurements and to the use thereof. It is provided that the semiconductor component is a component of a semiconductor circuit (10) comprising a first silicon layer (12), an adjoining silicon dioxide layer (insulating layer (14)) and a subsequent further silicon layer (structured layer (16)) (SOI wafer), and the semiconductor component comprises an IMPATT oscillator (30), having a resonator (24) which includes a metallized cylinder (18) of silicon, disposed in the structured layer (16); a coupling disk (28) covering the cylinder (18) in the region of the first layer (12); and an IMPATT diode (32), communicating with the cylinder (18) of the resonator (24) via a recess (38) in the coupling disk (28); and a reference oscillator (46) of lower frequency, having a resonator (24) which includes a metal cylinder (18) of silicon, disposed in the structured layer (16), and coupling disk (28) covering the cylinder in the region of the first layer (12); and a microwave conductor, communicating with the cylinder (18) of the resonator (24) via a recess (38) in the coupling disk (28), and the reference oscillator, via an active oscillator circuit (58), serves the purpose of frequency stabilization of the IMPATT oscillator (30); with integrated Schottky diodes; and a transmitting and receiving antenna (49).
摘要:
The invention relates to a micromechanical resonator having a bondable resonance body and a method for fabricating a micromechanical resonator for semiconductor components.The invention provides that the resonator (26) is composed successively of a first layer (16) of silicon for coupling the resonator (26) in terms of a circuit, an insulating layer (14) of silicon dioxide, a cylindrical base layer (cylinder 18), and a metal layer (20) completely surrounding the cylinder (18).The method provides that a cylindrical structure (18) (cylinder) is etched (trench etching process) in a base layer (12) of p−-doped silicon (SOI wafer) separated from a layer (16) of silicon by an insulating layer (14), and the cylindrical structure (18) is coated with a metal layer (20).
摘要:
The invention relates to a locator, in particular a handheld locator for detecting inclusions in walls, ceilings and/or floors, having a capacitive sensor device disposed in a housing, having means for generating a detection sensor of the at least one capacitive sensor device, having a control and evaluation unit, communicating with the sensor device, for ascertaining measurement values from the detection sensor, and having an output unit for reproducing measurement values of the capacitive sensor device.According to the invention, it is proposed that a measuring capacitor (16) of the capacitive sensor device (10) has a first electrode (21), which includes one face of the housing (14) of the sensor device (10).
摘要:
A radar device, particularly for measuring a speed above ground, includes a high-frequency circuit and an antenna. It is provided that the high-frequency circuit is arranged as a high-frequency chip, which has a plurality of antenna outputs, which are connected to the horn antennas via the antenna lines.
摘要:
A modular unit for a radar antenna array having an integrated HF chip, at least one antenna element that has a microwave structure, a focusing element situated in the ray path of the radar antenna array upstream of the at least one antenna element, using which an amplified illumination of the HF chip is achieved, has, in particular, an addition-to-structure device, using which focusing elements of different antenna characteristics can be attached to the modular unit. The addition-to-structure device is preferably formed by fasteners such as clamping devices and plug-in devices. Positioning devices can additionally be provided, using which the focusing element can be attached to the modular unit with precision.
摘要:
An antenna array for radar transceivers, in particular for ascertaining distance and/or speed in the surroundings of vehicles, a first antenna part being situated on a carrier and a second antenna part being situated on another carrier situated at a distance from the first. The first antenna part has two generally rectangular primary exciter patches which adjoin each other on one edge, where they are short-circuited toward ground, two primary exciter patches have two separate supply lines, and the second antenna part comprises two mutually separated rectangular secondary exciter patches, which partially cover the primary exciter patches and which have, in the region of the ground short-circuit of the primary exciter patches, in the beam direction, a distance from each other that at least exposes the ground short-circuit.