公开(公告)号：US3810300A

公开(公告)日：1974-05-14

申请号：US27399472

申请日：1972-07-21

Applicant: FERRANTI LTD

Inventor： HULMES H ,  PICKIN J

IPC: H01L23/495 ,  H05K1/18 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  B01J17/00

CPC classification number: H01L23/49558 ,  H01L23/49575 ,  H01L2924/0002 ,  H05K1/187 ,  H05K3/202 ,  H05K3/32 ,  H05K3/3447 ,  H05K2201/09118 ,  H05K2201/10424 ,  H05K2201/10651 ,  H05K2203/1316 ,  H05K2203/175 ,  Y10T29/49004 ,  Y10T29/49121 ,  H01L2924/00

Abstract: An electrical circuit assembly having a plurality of components and including at least one semiconductor device is formed, without employing a printed circuit board as is conventional with such arrangements, by mounting the semiconductor device on a lead frame, encapsulating the semiconductor device to form together with conductors associated with the semiconductor device a unitary construction, and providing a completed assembly of sufficient strength, after all the conductors of the lead frame have been rendered electrically discrete, by connecting the remainder of the assembly to the unitary construction and/or by encapsulating at least another part of the assembly; it being possible thereby also to test the different components either individually or in appropriate combinations during the manufacture of the assembly.

Abstract translation: 形成具有多个部件并且包括至少一个半导体器件的电路组件，不采用常规的这种布置的印刷电路板，通过将半导体器件安装在引线框架上，封装半导体器件与 与半导体器件相关联的导体是单一结构的，并且在引线框架的所有导体已经变得电离散之后，通过将组件的其余部分连接到单一构造和/或通过封装在 装配的另一部分; 因此，也可以在组装的制造期间单独地或以适当的组合来测试不同的部件。