公开(公告)号：US20140291311A1

公开(公告)日：2014-10-02

申请号：US14038039

申请日：2013-09-26

申请人： FM INDUSTRIES, INC.

发明人： Jae Yong Cho ,  Kevin Argabright ,  James E. LaRoche, III ,  Mahmood Naim ,  David R. Hammerich ,  John R. Miller

IPC分类号： H01L21/683

CPC分类号： H01L21/6833 ,  H01L21/67103 ,  Y10T29/49083

摘要： A heated electrostatic chuck is provided, including a base having an upper surface and peripheral side surfaces, a thermal barrier coating formed by plasma deposition directly on at least the upper surface of the base, at least one heating element formed on portions of the thermal barrier coating, an electrically insulating layer formed on the heating element and exposed portions of the thermal barrier coating, at least one chucking electrode formed on at least a portion of the electrically insulating layer, and a protective layer formed on the chucking electrode.

摘要翻译： 提供了一种加热的静电卡盘，其包括具有上表面和外周侧表面的基座，通过直接在基底的上表面上等离子体沉积形成的热障涂层，形成在热障壁的部分上的至少一个加热元件 涂覆，形成在所述加热元件上的电绝缘层和所述热障涂层的暴露部分，形成在所述电绝缘层的至少一部分上的至少一个夹持电极和形成在所述夹持电极上的保护层。

公开(公告)号：US09543183B2

公开(公告)日：2017-01-10

申请号：US14038039

申请日：2013-09-26

申请人： FM INDUSTRIES, INC.

发明人： Jae Yong Cho ,  Kevin Argabright ,  James E. LaRoche, III ,  Mahmood Naim ,  David R. Hammerich ,  John R. Miller

IPC分类号： H05B11/00 ,  H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6833 ,  H01L21/67103 ,  Y10T29/49083

摘要： A heated electrostatic chuck is provided, including a base having an upper surface and peripheral side surfaces, a thermal barrier coating formed by plasma deposition directly on at least the upper surface of the base, at least one heating element formed on portions of the thermal barrier coating, an electrically insulating layer formed on the heating element and exposed portions of the thermal barrier coating, at least one chucking electrode formed on at least a portion of the electrically insulating layer, and a protective layer formed on the chucking electrode.

摘要翻译： 提供了一种加热的静电卡盘，其包括具有上表面和外周侧表面的基座，通过直接在基底的上表面上等离子体沉积形成的热障涂层，形成在热障壁的部分上的至少一个加热元件 涂覆，形成在所述加热元件上的电绝缘层和所述热障涂层的暴露部分，形成在所述电绝缘层的至少一部分上的至少一个夹持电极和形成在所述夹持电极上的保护层。

公开(公告)号：US10388492B2

公开(公告)日：2019-08-20

申请号：US15248496

申请日：2016-08-26

申请人： FM Industries, Inc.

发明人： Mahmood Naim ,  David Hammerich

IPC分类号： H01J37/32 ,  C23C4/134 ,  C23C4/11 ,  C23C4/02

摘要： A semiconductor processing member is provided, including a body and a plasma spray coating provided on the body. The coating is an ABO or ABCO complex oxide solid solution composition, where A, B and C are selected from the group consisting of La, Zr, Ce, Gd, Y, Yb and Si, and O is an oxide. The coating imparts both chlorine and fluorine plasma erosion resistance, reduces particle generation during plasma etching, and prevents spalling of the coating during wet cleaning of the semiconductor processing member.

公开(公告)号：US09790581B2

公开(公告)日：2017-10-17

申请号：US14562810

申请日：2014-12-08

申请人： FM Industries, Inc.

发明人： Mahmood Naim ,  David Hammerich

IPC分类号： C23C4/12 ,  C04B35/505 ,  C09K5/14 ,  C01F17/00 ,  C23C4/02 ,  C23C28/04 ,  C23C4/11 ,  C04B35/486

CPC分类号： C23C4/134 ,  C01F17/0018 ,  C01F17/0043 ,  C01P2006/32 ,  C04B35/486 ,  C04B35/505 ,  C04B2235/3225 ,  C04B2235/3244 ,  C09K5/14 ,  C23C4/02 ,  C23C4/11 ,  C23C28/042 ,  C23C28/048 ,  C04B41/009 ,  C04B35/581 ,  C04B35/111 ,  C04B35/565 ,  C04B35/52

摘要： A component for a semiconductor processing chamber, the component including a substrate and a coating layer provided on a surface of the substrate, wherein the coating layer includes at least a first coating layer having a thermal emissivity of more than 0.98 to 1, having plasma resistance, and having a color value L in a range of 35 to 40 through a thickness direction thereof.