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公开(公告)号：US10266402B2
公开(公告)日：2019-04-23
申请号：US13681967
申请日：2012-11-20
Applicant: FormFactor, Inc.
Inventor： Onnik Yaglioglu , Benjamin N. Eldridge , Alexander Slocum
Abstract: Electrically conductive columns of intertwined carbon nanotubes embedded in a mass of material flexible, resilient electrically insulating material can be used as electrically conductive contact probes. The columns can extend between opposing sides of the mass of material. Terminals of a wiring substrate can extend into the columns and be electrically connected to an electrical interface to a tester that controls testing of a device under test. A pair of physically interlocked structures can coupling the mass of material to the wiring substrate. The pair can include a receptacle and a protrusion.
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公开(公告)号：US10132833B2
公开(公告)日：2018-11-20
申请号：US14327254
申请日：2014-07-09
Applicant: FormFactor, Inc.
Inventor： Benjamin N. Eldridge
Abstract: A multiple conduction path probe can provide an electrically conductive signal path from a first contact end to a second contact end. The probe can also include an electrically conductive secondary path and an electrically insulated gap between the signal path and the secondary path. A probe assembly can comprise multiple such probes disposed in passages in substantially parallel electrically conductive guide plates. In some configurations, the probe assembly can include one or more secondary probes disposed in passages of the conductive guide plates and electrically connected to one or both of the guide plates. Some of the probes can be electrically insulated from the guide plates and thus provide signal paths, and others of the probes can be electrically connected to the guide plates and thus provide secondary paths.
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公开(公告)号：US11460485B2
公开(公告)日：2022-10-04
申请号：US16164326
申请日：2018-10-18
Applicant: FormFactor, Inc.
Inventor： Jason William Cosman , Benjamin N. Eldridge , Eric Hill , John Ebner , Edin Sijercic
Abstract: Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.
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公开(公告)号：US10527647B2
公开(公告)日：2020-01-07
申请号：US16016141
申请日：2018-06-22
Applicant: FormFactor, Inc.
Inventor： Benjamin N. Eldridge , Edin Sijercic , Eric Hill , John Ebner
Abstract: Improved impedance matching is provided in vertical probe arrays having conductive guide plates by providing ground pins connecting the guide plates that do not mechanically touch the device under test or the input test apparatus. Such ground pins can be disposed in predetermined patterns around corresponding signal probes to improve an impedance match between the probes and the test apparatus and/or the device under test. Preferably all impedances are matched to 50Ω as is customary for high frequency work.
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公开(公告)号：US20180196086A1
公开(公告)日：2018-07-12
申请号：US15868737
申请日：2018-01-11
Applicant: FormFactor, Inc.
Inventor： Benjamin N. Eldridge
IPC: G01R1/073
Abstract: Crosstalk between probes in a vertical probe array is reduced by providing a grounded metal carrier disposed between the guide plates of the probe array. The metal carrier includes pockets that are laterally separated from each other by the metal carrier. Probes in different pockets are thereby electrically shielded from each other.
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Patent Agency Ranking
公开(公告)号：US09958476B2
公开(公告)日：2018-05-01
申请号：US15359245
申请日：2016-11-22
Applicant: FormFactor, Inc.
Inventor： Benjamin N. Eldridge
CPC classification number: G01R1/0441
Abstract: A test socket for facilitating testing of a device under test (DUT) includes a holder comprising a mounting structure for attaching the holder to other components of the socket and a floating nest structure in which the DUT can be disposed. The floating nest structure can have a seat cavity sized and shaped to receive and hold the DUT such that at least some of the DUT terminals are in contact with corresponding contacts of a test board while the test socket is attached to the test board. A flexure located laterally between the mounting structure and the floating nest structure and can allow the nest structure to move relative to the mounting structure and thus float.
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公开(公告)号：US20170146566A1
公开(公告)日：2017-05-25
申请号：US15359245
申请日：2016-11-22
Applicant: FormFactor, Inc.
Inventor： Benjamin N. Eldridge
IPC: G01R1/04
CPC classification number: G01R1/0441
Abstract: A test socket for facilitating testing of a device under test (DUT) includes a holder comprising a mounting structure for attaching the holder to other components of the socket and a floating nest structure in which the DUT can be disposed. The floating nest structure can have a seat cavity sized and shaped to receive and hold the DUT such that at least some of the DUT terminals are in contact with corresponding contacts of a test board while the test socket is attached to the test board. A flexure located laterally between the mounting structure and the floating nest structure and can allow the nest structure to move relative to the mounting structure and thus float.
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公开(公告)号：US20180299486A1
公开(公告)日：2018-10-18
申请号：US16016141
申请日：2018-06-22
Applicant: FormFactor, Inc.
Inventor： Benjamin N. Eldridge , Edin Sijercic , Eric Hill , John Ebner
CPC classification number: G01R1/06733 , G01R1/07314 , G01R1/07371
Abstract: Improved impedance matching is provided in vertical probe arrays having conductive guide plates by providing ground pins connecting the guide plates that do not mechanically touch the device under test or the input test apparatus. Such ground pins can be disposed in predetermined patterns around corresponding signal probes to improve an impedance match between the probes and the test apparatus and/or the device under test. Preferably all impedances are matched to 50Ω as is customary for high frequency work.
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公开(公告)号：US10598697B2
公开(公告)日：2020-03-24
申请号：US15868737
申请日：2018-01-11
Applicant: FormFactor, Inc.
Inventor： Benjamin N. Eldridge
IPC: G01R1/073
Abstract: Crosstalk between probes in a vertical probe array is reduced by providing a grounded metal carrier disposed between the guide plates of the probe array. The metal carrier includes pockets that are laterally separated from each other by the metal carrier. Probes in different pockets are thereby electrically shielded from each other.
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10.发明申请Multipath Electrical Probe And Probe Assemblies With Signal Paths Through Secondary Paths Between Electrically Conductive Guide Plates 审中-公开多通道电探头和探头组件，其通过导电导板之间的次级路径的信号路径公开(公告)号：US20150015289A1
公开(公告)日：2015-01-15
申请号：US14327254
申请日：2014-07-09
Applicant: FormFactor, Inc.
Inventor： Benjamin N. Eldridge
CPC classification number: G01R1/06733 , G01R1/06772 , G01R1/07357
Abstract: A multiple conduction path probe can provide an electrically conductive signal path from a first contact end to a second contact end. The probe can also include an electrically conductive secondary path and an electrically insulated gap between the signal path and the secondary path. The gap can be relatively small and thus provide the probe with a low loop inductance. A probe assembly can comprise multiple such probes disposed in passages in substantially parallel electrically conductive guide plates. The signal path of each of the probes can be electrically insulated from both guide plates, but the secondary path of each probe can be electrically connected to one or both of the guide plates. In some configurations, the probe assembly can include one or more secondary probes disposed in passages of the conductive guide plates and electrically connected to one or both of the guide plates. In some configurations, a probe assembly can comprise probes that are substantially the same shape and/or configuration all of which are disposed in passages through substantially parallel guide plates. Some of the probes can be electrically insulated from the guide plates and thus provide signal paths, and others of the probes can be electrically connected to the guide plates and thus provide secondary paths. Any of the foregoing types of probe assemblies can be part of a test contactor such as a probe card assembly, a load board, or the like.
Abstract translation: 多导电路径探针可以提供从第一接触端到第二接触端的导电信号路径。 探针还可以包括导电次级路径和信号路径与次路径之间的电绝缘间隙。 间隙可以相对较小，从而为探头提供低回路电感。 探针组件可以包括多个这样的探针，其布置在基本上平行的导电导板中的通道中。 每个探针的信号路径可以与两个导向板电绝缘，但是每个探针的次级路径可以电连接到一个或两个导向板。 在一些构造中，探针组件可以包括设置在导电导板的通道中并电连接到一个或两个导板的一个或多个辅助探针。 在一些构造中，探针组件可以包括基本上相同的形状和/或构造的探针，所有探针组件都设置在通过基本平行的引导板的通路中。 一些探针可以与引导板电绝缘，从而提供信号路径，并且其它探针可以电连接到引导板，从而提供辅助路径。 任何上述类型的探针组件可以是测试接触器的一部分，例如探针卡组件，负载板等。
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