LED DISPLAY UNIT GROUP AND DISPLAY PANEL
    1.
    发明申请

    公开(公告)号:US20200083420A1

    公开(公告)日:2020-03-12

    申请号:US16502101

    申请日:2019-07-03

    Abstract: Provided is a light-emitting diode (LED) display unit group and a display panel. The LED display unit group includes a circuit board, and a pixel unit array located on the circuit board. The pixel unit array includes a plurality of pixel units arranged in n rows and m columns, n and m are both positive integers and greater than or equal to 2. Each of the pixel units includes multiple LED light-emitting chips of at least two colors, each of the LED light-emitting chips includes an electrode A and an electrode B of opposite polarities. The LED light-emitting chip of each of the pixel units includes at least one dual-electrode chip, the dual-electrode chip has the electrode A and the electrode B located on a same side of the dual-electrode chip. All dual-electrode chips in the plurality of pixel units of a same color have connecting lines from the electrode A to the electrode B directed in a same direction.

    LED DISPLAY UNIT GROUP, MANUFACTURING METHOD OF LED DISPLAY UNIT GROUP, AND DISPLAY PANEL

    公开(公告)号:US20240006572A1

    公开(公告)日:2024-01-04

    申请号:US18215980

    申请日:2023-06-29

    CPC classification number: H01L33/62 H01L25/0753 H01L2933/0066

    Abstract: A LED display unit group includes a substrate and an electronic device, where the substrate includes a pad layer, an ink layer and an identification structure, the pad layer is disposed on a first surface of a side of the substrate adjacent to the electronic device; the pad layer includes pad regions and a non-pad region, each of the pad regions includes multiple pads, and the non-pad region includes metal traces; and the ink layer is disposed above the pad layer; each of the multiple pads is configured to secure the electronic device and is electrically connected to the electronic device; the metal traces are configured to connect the multiple pads via the metal traces; and an orthographic projection of the identification structure on the substrate is partially overlapped or staggered with an orthographic projection of the pad regions on the substrate.

    LED DISPLAY DEVICE ARRAY, LED DISPLAY DEVICE, AND DISPLAY PANEL

    公开(公告)号:US20240363821A1

    公开(公告)日:2024-10-31

    申请号:US18648434

    申请日:2024-04-28

    CPC classification number: H01L33/62 H01L25/0753

    Abstract: An LED display device array includes a substrate, at least two display units disposed on the upper surface of the substrate, and pin assemblies disposed on the lower surface of the substrate and in one-to-one correspondence with the at least two display units, a cutting line is disposed on the substrate between any two adjacent pin assemblies. Each of the pin assemblies includes at least two pins, and the at least two pins are a first pin and a second pin separately. A first pin in a pin assembly is misaligned with a second pin in an adjacent pin assembly, and the first pin and the second pin are connected to each other by a connecting wire. The connecting wire has a linear connecting segment, and the connecting segment of the connecting wire intersects with the cutting line and is perpendicular to the cutting line.

    Light-Emitting Device and Displayer

    公开(公告)号:US20220231206A1

    公开(公告)日:2022-07-21

    申请号:US17574586

    申请日:2022-01-13

    Abstract: The disclosure provides a light-emitting device and a displayer. Herein, the light-emitting device includes a substrate, a light-emitting chip, a first light-transmitting layer, a second light-transmitting layer and a nano coating. The light transmittance of the second light-transmitting layer is greater than the light transmittance of the first light-transmitting layer. A reference surface corresponding to the light-emitting chip is arranged above the substrate, and the reference surface is higher than the bottom surface of the light-emitting chip and not higher than the top surface of the light-emitting chip. The first light-transmitting layer covers the surface of the light-emitting chip below the reference surface, and the second light-transmitting layer covers the surface of the light-emitting chip above the reference surface. The nano coating covers the outer surface of the first light-transmitting layer, the outer surface of the second light-transmitting layer and the side surface of the substrate.

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