Apparatus for preparing a microelement for soldering
    1.
    发明授权
    Apparatus for preparing a microelement for soldering 失效
    用于制备用于焊接的微量元素的装置

    公开(公告)号:US3657789A

    公开(公告)日:1972-04-25

    申请号:US3657789D

    申请日:1970-06-16

    Inventor: ANGLADE FRANCIS

    Abstract: Apparatus for preparing the conductors projecting from a flatpack for soldering comprises an anvil supporting the conductors and a soldering wire transversely of the conductors, a reciprocable plunger mounted above the anvil for exerting a predetermined pressure against a soldering wire placed transversely over the conductors, and cooperating side walls of the plunger and the anvil forming a scissors for severing the soldering wire upon downward movement of the plunger.

    Abstract translation: 用于制备从用于焊接的扁平组件突出的导体的装置包括支撑导体的砧和横向于导体的焊丝;安置在砧座上方的可往复运动的柱塞,用于对横向放置在导体上的导线施加预定的压力, 并且柱塞和砧座的配合侧壁形成剪刀,用于在柱塞向下运动时切断焊丝。

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