公开(公告)号：US20220311209A1

公开(公告)日：2022-09-29

申请号：US17411821

申请日：2021-08-25

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takashi KONDO ,  Michiaki MURATA ,  Kenichi ONO ,  Junichiro HAYAKAWA ,  Takafumi HIGUCHI ,  Takashi FUJIMOTO ,  Manabu AKAMATSU

IPC: H01S5/042 ,  H01S5/42 ,  G01S17/08

Abstract: A light-emitting device includes: a substrate; a light-emitting unit including plural light-emitting elements; a transfer unit configured to output a signal that controls a light-emitting state of the light-emitting elements; and an electrode unit configured to input and output a signal that drives the transfer unit, the substrate has a rectangular shape having a long side and a short side, and the electrode unit is disposed along the short side of the substrate with the transfer unit interposed between a part of the electrode unit and other part of the electrode unit.

公开(公告)号：US20230080701A1

公开(公告)日：2023-03-16

申请号：US17712547

申请日：2022-04-04

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Takashi KONDO ,  Michiaki MURATA ,  Seiji ONO

IPC: H01L27/15 ,  G01S17/10 ,  G09G3/32 ,  H01L33/62 ,  H01L25/075

Abstract: A light emitting device, includes: a semiconductor substrate; a light-emitting-element section formed on the semiconductor substrate and including plural light emitting elements that radiate light; a signal line that is formed on the semiconductor substrate and that transmits a signal to the light emitting elements; and an oxide film formed between the signal line and the semiconductor substrate along an extension direction of the signal line.

公开(公告)号：US20210305771A1

公开(公告)日：2021-09-30

申请号：US17128175

申请日：2020-12-20

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takashi KONDO ,  Michiaki MURATA ,  Kenichi ONO ,  Masahiro YOSHIKAWA ,  Takehito HIKICHI ,  Yuji SHIRAI

IPC: H01S5/042 ,  H01S5/42 ,  H01S5/183

Abstract: A light-emitting component includes: a substrate; plural light-emitting elements that are disposed on the substrate and that emit light in a direction intersecting with a surface of the substrate; and plural thyristors that are stacked on the plural light-emitting elements and that are turned ON to drive the corresponding light-emitting elements so that the light-emitting elements emit light or an amount of light emitted from the light-emitting elements is increased. Each of the plural light-emitting elements includes a current confinement region which is oxidized via a hole provided in a multilayer structure. The multilayer structure is constituted by a corresponding light-emitting element and a corresponding thyristor.

公开(公告)号：US20210293966A1

公开(公告)日：2021-09-23

申请号：US17341595

申请日：2021-06-08

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kazuhiro SAKAI ,  Daisuke IGUCHI ,  Yoshinori SHIRAKAWA ,  Tomoaki SAKITA ,  Michiaki MURATA

IPC: G01S17/894 ,  G01S7/481 ,  G06F21/32

Abstract: A light emitting device includes: a substrate; a light emitting element array provided on the substrate, the light emitting element array having first and second side surfaces facing each other, and third and fourth side surfaces facing each other and connecting the first and second side surfaces; a driving element provided on the substrate at a side of the first side surface and driving the light emitting element array; a light receiving element provided on the substrate at a side of the second side surface and receiving light emitted from the light emitting element array; and a wiring member provided at a side of the third side surface and at a side of the fourth side surface and extending from an upper surface electrode of the light emitting element array toward an outside of the light emitting element array.

公开(公告)号：US20220344908A1

公开(公告)日：2022-10-27

申请号：US17411337

申请日：2021-08-25

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takashi KONDO ,  Michiaki MURATA ,  Junichiro HAYAKAWA ,  Takafumi HIGUCHI

IPC: H01S5/42 ,  G01S7/4863 ,  G01S17/894 ,  H01S5/042

Abstract: A light-emitting component includes a substrate, plural light-emitting elements that are disposed on the substrate and emit light in a direction intersecting with a surface of the substrate, and a gate electrode that is electrically connected to each of the plural light-emitting elements and performs control so that the plural light-emitting elements are switched ON/OFF together. Plural holes are disposed around each of the plural light-emitting elements.

公开(公告)号：US20210320479A1

公开(公告)日：2021-10-14

申请号：US17355270

申请日：2021-06-23

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Takashi KONDO ,  Satoshi INADA ,  Takeshi MINAMIRU ,  Daisuke IGUCHI ,  Kazuhiro SAKAI ,  Tomoaki SAKITA ,  Michiaki MURATA

IPC: H01S5/42 ,  H01S5/026 ,  H01S5/183 ,  H01S5/02257 ,  H01S5/343 ,  H01S5/0236 ,  G06K9/00 ,  G06K9/20 ,  G01B11/24

Abstract: A light-emitting element array chip includes: a first light-emitting element array that includes a first light-emitting element including a first substrate, a light-emitting element layer formed on the first substrate, and a first cathode electrode electrically connected to the light-emitting element layer; and a second light-emitting element array that includes a second light-emitting element including a second substrate, a non-p-type lower reflector formed on the second substrate, and a second cathode electrode electrically connected to the non-p-type lower reflector, in which the first light-emitting element array is provided on an emission surface side of the second light-emitting element array.

公开(公告)号：US20240105882A1

公开(公告)日：2024-03-28

申请号：US18324994

申请日：2023-05-28

Applicant: FUJIFILM Business Innovation Corp. ,  FUJIFILM Corporation

Inventor： Takashi KONDO ,  Michiaki MURATA ,  Saori NISHIZAKI ,  Takafumi HIGUCHI

IPC: H01L33/46 ,  H01L33/00 ,  H01L33/06

CPC classification number: H01L33/465 ,  H01L33/0016 ,  H01L33/06

Abstract: A semiconductor-laminated substrate includes: a substrate; and a laminated structure that includes a first semiconductor laminate which is provided on the substrate and processed into a light emitting element and a second semiconductor laminate which is provided on the first semiconductor laminate and processed into at least one thyristor, in which the laminated structure is adjusted such that two resonant wavelengths due to an effect of the thyristor are located on both sides of a resonant wavelength of the light emitting element.

公开(公告)号：US20230378370A1

公开(公告)日：2023-11-23

申请号：US18362003

申请日：2023-07-31

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takashi KONDO ,  Michiaki MURATA ,  Junichiro HAYAKAWA ,  Takafumi HIGUCHI

IPC: H01L29/786 ,  B41J2/45 ,  H01L27/15

CPC classification number: H01L29/7869 ,  B41J2/451 ,  H01L27/156

Abstract: A light-emitting component includes a substrate and a light-emitting element provided on the substrate and configured to emit light in a direction intersecting a surface of the substrate. The light-emitting element includes a thyristor having an opening through which light is emitted, and an inner surface of the opening is covered with a light shield that suppresses transmission of light.

公开(公告)号：US20230033889A1

公开(公告)日：2023-02-02

申请号：US17727798

申请日：2022-04-24

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takashi KONDO ,  Michiaki MURATA ,  Junichiro HAYAKAWA ,  Takafumi HIGUCHI

IPC: G01S7/481 ,  H01S5/42 ,  H01S5/02326

Abstract: A light-emitting element array includes a substrate, plural light-emitting elements arranged on the substrate, plural constriction grooves being provided in a periphery of each of the plural light-emitting elements, and forming a current constriction layer that constricts a current flowing through a light-emitting layer by oxidizing the light-emitting layer, and a block separation portion that is formed so as to overlap a part of the plural constriction grooves in plan view, and separates the plural light-emitting elements into plural blocks.

公开(公告)号：US20210313776A1

公开(公告)日：2021-10-07

申请号：US17354098

申请日：2021-06-22

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Takeshi MINAMIRU ,  Kenichi ONO ,  Satoshi INADA ,  Michiaki MURATA

IPC: H01S5/40 ,  G06F21/32 ,  G06F21/84 ,  G06K9/00

Abstract: A light-emission device includes: a first light emitting element chip; a second light emitting element chip having a light output higher than a light output of the first light emitting element chip, the second light emitting element chip being configured to be driven independently from the first light emitting element chip and arranged side by side with the first light emitting element chip; and a light diffusion member including a first region provided on an emission path of the first light emitting element chip and a second region provided on an emission path of the second light emitting element chip, and having a diffusion angle at the second region larger than a diffusion angle at the first region.