公开(公告)号：US20220407290A1

公开(公告)日：2022-12-22

申请号：US17722384

申请日：2022-04-17

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Junichiro HAYAKAWA ,  Akemi MURAKAMI ,  Kazuhiro SAKAI ,  Tsutomu HAMADA

IPC: H01S5/02315 ,  H01S5/024 ,  H01S5/042

Abstract: A semiconductor light emitter includes a substrate, a semiconductor multilayer structure including a light emission unit that emits light in an oblique direction with respect to the substrate, a base on which the substrate is disposed, a holding member that holds the substrate at an angle set in advance with respect to the base, a temperature control unit disposed parallel to the substrate to adjust a temperature of the substrate, and a shaping optical system held against the substrate to shape a luminous flux emitted from the semiconductor multilayer structure.

公开(公告)号：US20210265814A1

公开(公告)日：2021-08-26

申请号：US17109067

申请日：2020-12-01

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Daisuke IGUCHI ,  Kazuhiro SAKAI

IPC: H01S5/042 ,  G01S17/894 ,  G01S7/481

Abstract: A light-emitting device includes a laser unit; and a first capacitive element and a second capacitive element that supply a driving electric current to the laser unit; wherein the first capacitive element has a smaller capacity and smaller equivalent series inductance than the second capacitive element, and a length of a first electric current path along which the driving electric current output from the first capacitive element returns to the first capacitive element is shorter than a length of a second electric current path along which the driving electric current output from the second capacitive element returns to the second capacitive element.

公开(公告)号：US20210265809A1

公开(公告)日：2021-08-26

申请号：US17141183

申请日：2021-01-04

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Daisuke IGUCHI ,  Kazuhiro SAKAI

IPC: H01S5/026 ,  H01S5/183

Abstract: A light-emitting device includes a laser unit; and a first capacitive element and a second capacitive element that supply a driving electric current to the laser unit; wherein the first capacitive element has smaller equivalent series inductance than the second capacitive element, and the second capacitive element has a larger capacity and a smaller mount area than the first capacitive element.

公开(公告)号：US20210320479A1

公开(公告)日：2021-10-14

申请号：US17355270

申请日：2021-06-23

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Takashi KONDO ,  Satoshi INADA ,  Takeshi MINAMIRU ,  Daisuke IGUCHI ,  Kazuhiro SAKAI ,  Tomoaki SAKITA ,  Michiaki MURATA

IPC: H01S5/42 ,  H01S5/026 ,  H01S5/183 ,  H01S5/02257 ,  H01S5/343 ,  H01S5/0236 ,  G06K9/00 ,  G06K9/20 ,  G01B11/24

Abstract: A light-emitting element array chip includes: a first light-emitting element array that includes a first light-emitting element including a first substrate, a light-emitting element layer formed on the first substrate, and a first cathode electrode electrically connected to the light-emitting element layer; and a second light-emitting element array that includes a second light-emitting element including a second substrate, a non-p-type lower reflector formed on the second substrate, and a second cathode electrode electrically connected to the non-p-type lower reflector, in which the first light-emitting element array is provided on an emission surface side of the second light-emitting element array.

公开(公告)号：US20210305774A1

公开(公告)日：2021-09-30

申请号：US17109728

申请日：2020-12-02

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Daisuke IGUCHI ,  Kazuhiro SAKAI ,  Takeshi MINAMIRU

IPC: H01S5/042 ,  G06K9/00 ,  H01S5/00 ,  G01S7/481

Abstract: A light-emitting device includes a laser element array having a quadrangular planar shape, a pair of capacitors that supply an electric current for light emission of the laser element array, and a driving unit that drives the laser element array by turning on and off the electric current for light emission of the laser element array. The pair of capacitors are disposed beside two sides of the laser element array that face each other so as to sandwich the laser element array, and the driving unit is disposed beside another side of the laser element array.

公开(公告)号：US20210313762A1

公开(公告)日：2021-10-07

申请号：US17353480

申请日：2021-06-21

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Takeshi MINAMIRU ,  Kazuhiro SAKAI ,  Daisuke IGUCHI

IPC: H01S5/042 ,  G01B11/24 ,  G01S7/484 ,  G01S17/894 ,  H01S5/0225 ,  H01S5/42 ,  G06K9/00

Abstract: A light-emitting device includes: a wiring substrate; a base member that is mounted on the wiring substrate; a light source that is mounted on the base member; a drive unit that is mounted on the wiring substrate and drives the light source; a wiring pattern that is on the wiring substrate, is connected to the light source and extends from a back surface side of the base member toward the drive unit; and a circuit element that is provided in a region on the base member between the light source and the drive unit, the region overlapping the wiring pattern in a plan view.

公开(公告)号：US20230307894A1

公开(公告)日：2023-09-28

申请号：US18326981

申请日：2023-05-31

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kazuhiro SAKAI ,  Daisuke IGUCHI ,  Takeshi MINAMIRU ,  Yoshinori SHIRAKAWA ,  Tomoaki SAKITA ,  Tsutomu OTSUKA

IPC: H01S5/068 ,  H01S5/0687 ,  H01S5/02255 ,  H01S5/02325 ,  G06V20/64 ,  G02B27/42 ,  G06V40/16 ,  H01S5/42 ,  G02B5/02 ,  G06V10/145

CPC classification number: H01S5/423 ,  G02B5/0278 ,  G02B27/4205 ,  G06V10/145 ,  G06V20/64 ,  G06V40/166 ,  H01S5/02255 ,  H01S5/02325 ,  H01S5/06804 ,  H01S5/0687 ,  H01S5/04254

Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.

公开(公告)号：US20220077659A1

公开(公告)日：2022-03-10

申请号：US17528177

申请日：2021-11-16

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kazuhiro SAKAI ,  Daisuke IGUCHI ,  Takeshi MINAMIRU ,  Yoshinori SHIRAKAWA ,  Tomoaki SAKITA ,  Tsutomu OTSUKA

IPC: H01S5/42 ,  H01S5/068 ,  H01S5/0687 ,  G02B27/42 ,  G02B5/02 ,  G06K9/00 ,  G06K9/20 ,  H01S5/02255 ,  H01S5/02325

Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.

公开(公告)号：US20210293966A1

公开(公告)日：2021-09-23

申请号：US17341595

申请日：2021-06-08

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kazuhiro SAKAI ,  Daisuke IGUCHI ,  Yoshinori SHIRAKAWA ,  Tomoaki SAKITA ,  Michiaki MURATA

IPC: G01S17/894 ,  G01S7/481 ,  G06F21/32

Abstract: A light emitting device includes: a substrate; a light emitting element array provided on the substrate, the light emitting element array having first and second side surfaces facing each other, and third and fourth side surfaces facing each other and connecting the first and second side surfaces; a driving element provided on the substrate at a side of the first side surface and driving the light emitting element array; a light receiving element provided on the substrate at a side of the second side surface and receiving light emitted from the light emitting element array; and a wiring member provided at a side of the third side surface and at a side of the fourth side surface and extending from an upper surface electrode of the light emitting element array toward an outside of the light emitting element array.

公开(公告)号：US20230411558A1

公开(公告)日：2023-12-21

申请号：US17978330

申请日：2022-11-01

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Shigetoshi NAKAMURA ,  Kazuhiro SAKAI ,  Hiroyuki HOTTA ,  Kei TAKEYAMA ,  Yoshihiro YAMAMOTO ,  Junichiro HAYAKAWA

IPC: H01L33/08 ,  H01L33/58 ,  G02B3/06 ,  G02B9/12

CPC classification number: H01L33/08 ,  H01L33/58 ,  G02B3/06 ,  G02B9/12

Abstract: A light emitting device includes: a light emitting part having multiple light emitting regions arranged along a first direction; and an optical system that is disposed on a light-exit side of the light emitting part and that deflects light emitted from the multiple light emitting regions in different directions, the optical system being configured such that a light exit angle in a second direction, which intersects the first direction, is smaller than the light exit angle in the first direction.