PATTERN FORMING METHOD, MANUFACTURING METHOD OF CIRCUIT BOARD, AND LAMINATE

    公开(公告)号:US20230305403A1

    公开(公告)日:2023-09-28

    申请号:US18057495

    申请日:2022-11-21

    CPC classification number: G03F7/095 G03F7/26 G03F7/2022

    Abstract: Provided are a pattern forming method which includes a step of preparing a laminate having a first photosensitive layer, a substrate having a region transparent to an exposure wavelength, and a second photosensitive layer in this order, a step of exposing the first photosensitive layer, a step of exposing the second photosensitive layer, a step of developing the exposed first photosensitive layer to form a first resin pattern, and a step of developing the exposed second photosensitive layer to form a second resin pattern, and in which a dominant wavelength λ1 of an exposure wavelength in the step of exposing the first photosensitive layer and a dominant wavelength λ2 of an exposure wavelength in the step of exposing the second photosensitive layer satisfy a relation of λ1 ≠ λ2, a laminate, and applications of these.

    MANUFACTURING METHOD FOR SUBSTRATE HAVING CONDUCTIVE PATTERN, MANUFACTURING METHOD FOR ELECTRONIC DEVICE, SUBSTRATE HAVING CONDUCTIVE PATTERN, AND PROTECTIVE FILM FOR METAL NANOBODY

    公开(公告)号:US20220400553A1

    公开(公告)日:2022-12-15

    申请号:US17751817

    申请日:2022-05-24

    Abstract: There are provided a manufacturing method for a substrate having a conductive pattern, a manufacturing method for an electronic device, and a substrate having a conductive pattern, which are excellent in the dimensional stability of the conductive pattern after applying an electric current, as well as a protective film for a metal nanobody.
    Provided are the manufacturing method for a substrate having a conductive pattern, comprising a step 1a of forming a conductive layer a containing a metal nanobody and a resin 1 on a substrate; a step 1b of forming a resin layer b containing a resin 2 on the conductive layer a; a step 2a of forming a photosensitive resin layer c on the resin layer b; a step 3 of obtaining a resin pattern c′ of the photosensitive resin layer by exposure and development treatment on the photosensitive resin layer c; a step 4 of removing the metal nanobody in the conductive layer a by etching to form a conductive pattern d; and a step 5a of softening or swelling at least one of the resin 1 or the resin 2, the manufacturing method for an electronic device, the substrate having a conductive pattern, and the protective film for a metal nanobody.

Patent Agency Ranking