PATTERN FORMING METHOD, MANUFACTURING METHOD OF CIRCUIT BOARD, AND LAMINATE

    公开(公告)号:US20230305403A1

    公开(公告)日:2023-09-28

    申请号:US18057495

    申请日:2022-11-21

    CPC classification number: G03F7/095 G03F7/26 G03F7/2022

    Abstract: Provided are a pattern forming method which includes a step of preparing a laminate having a first photosensitive layer, a substrate having a region transparent to an exposure wavelength, and a second photosensitive layer in this order, a step of exposing the first photosensitive layer, a step of exposing the second photosensitive layer, a step of developing the exposed first photosensitive layer to form a first resin pattern, and a step of developing the exposed second photosensitive layer to form a second resin pattern, and in which a dominant wavelength λ1 of an exposure wavelength in the step of exposing the first photosensitive layer and a dominant wavelength λ2 of an exposure wavelength in the step of exposing the second photosensitive layer satisfy a relation of λ1 ≠ λ2, a laminate, and applications of these.

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