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公开(公告)号：US20180064318A1
公开(公告)日：2018-03-08
申请号：US15666582
申请日：2017-08-02
Applicant: FUJIFILM Corporation
Inventor： Ryo KITANO
CPC classification number: A61B1/051 , A61B1/00009 , A61B1/00096 , A61B1/00114 , A61B1/00124 , A61B1/00126 , A61B1/0057 , A61B1/01 , A61B1/045 , A61B1/05 , A61B1/06 , A61B1/0661 , A61B1/128
Abstract: An endoscope includes an imaging device that is provided in a tip portion of an insertion part. The imaging device includes an image-sensor that an image receiving surface thereof is disposed crossing a longitudinal direction of the insertion part, a substrate folded once or more that includes a sensor connecting portion which faces a surface of the image-sensor on which connection terminals are provided and is connected to the connection terminals and a wire connecting portion which extends from an outer end of the sensor connecting portion toward a base end side of the insertion part and a center of the image receiving surface, and a composite wire of which a plurality of cables connected to a cable connection surface of the wire connecting portion facing the base end of the insertion part are bundled. The composite wire includes a first shield conductor provided around the plurality of cables that are bundled.
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公开(公告)号：US20170248780A1
公开(公告)日：2017-08-31
申请号：US15433976
申请日：2017-02-15
Applicant: FUJIFILM Corporation
Inventor： Ryo KITANO
IPC: G02B23/24
CPC classification number: G02B23/2484 , A61B1/051 , G02B23/2423 , G02B23/2446 , G02B23/2469
Abstract: An endoscope has an imaging unit at a tip portion of an insertion unit to be inserted into a body cavity, the imaging unit includes: a solid-state imaging device which performs photoelectric conversion on an optical image formed on a photodetecting surface thereof; a circuit board having a connection surface which is opposed to a surface, opposite to the photodetecting surface and formed with terminals, of the imaging device and which serves for electrical connection to the terminals; and a case member which covers part of the imaging device and part of the circuit board, the circuit board has a wide portion and a narrow portion that are different in length in a width direction perpendicular to a longitudinal direction of the insertion unit, and the case member is formed with first cuts in such a range as to correspond to the wide portion in the longitudinal direction.
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公开(公告)号：US20170108691A1
公开(公告)日：2017-04-20
申请号：US15293301
申请日：2016-10-14
Applicant: FUJIFILM Corporation
Inventor： Ryo KITANO
CPC classification number: G02B23/2484 , A61B1/00096 , A61B1/05 , A61B1/051 , A61B1/0669 , A61B1/07 , H04N5/2253 , H04N5/2256 , H04N2005/2255
Abstract: An endoscope includes an image sensor that is disposed at a front end portion of an insertion portion of the endoscope; a circuit board that is mounted with the image sensor; a plurality of electric wires that are electrically connected to the circuit board; and a retention member that has a retention portion tying up the electric wires; and the retention portion is disposed in a narrowed section that is provided in the insertion portion and inside a part adjacent to the front end portion in an axial direction of the insertion portion and narrowed in a narrowing direction perpendicular to the axial direction so that the electric wires are tied up to be longer in a direction perpendicular to the narrowing direction and the axial direction than in the narrowing direction.
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Patent Agency Ranking
公开(公告)号：US20180008133A1
公开(公告)日：2018-01-11
申请号：US15614621
申请日：2017-06-06
Applicant: FUJIFILM Corporation
Inventor： Ryo KITANO , Shinichiro SONODA , Takashi YANO , Eiji SUZUKI
Abstract: The endoscope includes an imaging device that is provided in a tip portion of an insertion part capable of being inserted into a body cavity. The imaging device includes an image sensor that photoelectrically converts imaging light incident on an image receiving surface thereof through an imaging lens provided in a lens barrel, and a circuit substrate including a connecting surface facing a terminal face that is a surface opposite to the image receiving surface of the image sensor. A plurality of terminals are uniformly arranged longitudinally and laterally in a two-dimensional matrix form on the terminal face of the image sensor, and the connecting surface of the circuit substrate and the terminal face of the image sensor are connected to each other through the plurality of terminals. The total area of the plurality of terminals on the terminal face occupies 10% or more of the area of an imaging area of the image receiving surface.
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公开(公告)号：US20170108692A1
公开(公告)日：2017-04-20
申请号：US15293302
申请日：2016-10-14
Applicant: FUJIFILM Corporation
Inventor： Ryo KITANO , Takashi YASHIRO
CPC classification number: G02B23/2484 , G02B23/2469 , H04N5/2253 , H04N5/2256 , H04N2005/2255
Abstract: An endoscope includes an image sensor that is provided at a front end portion of an insertion portion of the endoscope so that an image receiving surface of the image sensor is disposed to cross a longitudinal axis of the insertion portion; a sensor holder that surrounds an outer circumference of the image sensor and holds the image sensor; and a circuit board including a sensor connection portion and an electric wire connection portion as defined herein; the image sensor is held by the sensor holder as defined herein; the sensor connection portion and the electric wire connection portion are connected to each other as defined herein; and an outside edge of a connection site between the sensor connection portion and the electric wire connection portion is located as defined herein.
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公开(公告)号：US20200120288A1
公开(公告)日：2020-04-16
申请号：US16598337
申请日：2019-10-10
Applicant: FUJIFILM Corporation
Inventor： Ryo KITANO
Abstract: A direct-viewing observation image is displayed on a monitor, and a side-viewing observation image is not displayed on the monitor. A region of interest is detected using the side-viewing observation image. A display region for observation, which displays the direct-viewing observation image, of the monitor is maintained regardless of whether or not the region of interest is detected.
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公开(公告)号：US20180344132A1
公开(公告)日：2018-12-06
申请号：US15973531
申请日：2018-05-08
Applicant: FUJIFILM Corporation
Inventor： Ryo KITANO
Abstract: There are provided an endoscope in which adhesion strength between two optical members can be enhanced and an endoscope apparatus including the endoscope. An endoscope includes an insertion part that is to be inserted into a subject, a first unit that is built in a distal end portion of the insertion part and includes a prism, a second unit that is built in the distal end portion and includes a cover glass, an adhesive layer that is formed between the light-emitting surface of the prism and the surface of the cover glass and adheres the prism to the cover glass, and a resin layer that fills a gap larger than the thickness of the adhesive layer formed between the first unit and the second unit. The thermal expansion coefficient of the resin layer is set to 1/10 or less of the thermal expansion coefficient of the adhesive layer.
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公开(公告)号：US20170251914A1
公开(公告)日：2017-09-07
申请号：US15428147
申请日：2017-02-08
Applicant: FUJIFILM Corporation
Inventor： Ryo KITANO
CPC classification number: A61B1/051 , A61B1/00018 , A61B1/00114 , A61B1/018 , A61B1/128 , G02B23/2469 , G02B23/2484 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N2005/2255
Abstract: An endoscope has an imaging unit at a tip portion of an insertion unit to be inserted into a body cavity, and the imaging unit includes: a solid-state imaging device which is disposed in such a manner that a photodetecting surface thereof crosses a longitudinal direction of the insertion unit and which performs photoelectric conversion on an optical image formed on the photodetecting surface; a circuit board having a connection surface which is opposed to a surface, opposite to the photodetecting surface and formed with connection terminals, of the solid-state imaging device and which serves for electrical connection to the connection terminals of the solid-state imaging device, wherein the circuit board is a rigid board that is L-shaped as defined herein; and a first leg and a second leg that constitute the L-shaped circuit board and are perpendicular to each other are provided as defined herein.
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