公开(公告)号：US20170252892A1

公开(公告)日：2017-09-07

申请号：US15504793

申请日：2015-07-30

Applicant: FUJIMI INCORPORATED

Inventor： Koji KATAYAMA ,  Keigo OHASHI ,  Eiichi YAMADA ,  Hitoshi MORINAGA

IPC: B24B37/24 ,  B24B37/26 ,  B24B37/22

CPC classification number: B24B37/245 ,  B24B37/11 ,  B24B37/22 ,  B24B37/26

Abstract: A polishing pad capable of removing waviness of a surface of a polishing target having a curved surface is provided. A polishing pad (10) includes a structure (40, 50) including a polishing surface (30) formed of a hard resin layer (40), the structure (40, 50) allowing the polishing surface (30) to follow a curved surface of a polishing target (90).

公开(公告)号：US20170260436A1

公开(公告)日：2017-09-14

申请号：US15504779

申请日：2015-09-10

Applicant: FUJIMI INCORPORATED

Inventor： Eiichi YAMADA ,  Kazusei TAMAI

IPC: C09K3/14 ,  B24B37/00

Abstract: Abrasives, a polishing composition, and a polishing method that can reduce undulation of an outer surface of a resin coating by polishing with reduced occurrence of polishing flaws. The polishing composition includes abrasives of aluminium oxide particles having a specific surface area of 5 m2/g or more and 50 m2/g or less and an average secondary particle diameter of 0.05 μm or more and 4.8 μm or less. This polishing composition can be used for polishing an outer surface of the resin coating.