公开(公告)号：US20190070707A1

公开(公告)日：2019-03-07

申请号：US16074668

申请日：2017-02-20

Applicant: FUJIMI INCORPORATED

Inventor： Toru KAMADA ,  Koji KATAYAMA ,  Hitoshi MORINAGA ,  Takashi HORIBE

IPC: B24B37/22 ,  B24D13/14 ,  B24B29/02 ,  B24B37/24 ,  B24B37/26

Abstract: A disc-shaped polishing pad (1) is used for a polishing method of the present invention. The polishing pad (1) has a peripheral surface (111) on a polishing surface (10) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (10). An angle formed by the peripheral surface (111) and the polishing surface (10) is 125° or more and less than 180°. The polishing pad (1) has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (10). The polishing surface (10) is pressed against the polished surface and the polishing pad (1) is moved to polish the polished surface.

公开(公告)号：US20170252892A1

公开(公告)日：2017-09-07

申请号：US15504793

申请日：2015-07-30

Applicant: FUJIMI INCORPORATED

Inventor： Koji KATAYAMA ,  Keigo OHASHI ,  Eiichi YAMADA ,  Hitoshi MORINAGA

IPC: B24B37/24 ,  B24B37/26 ,  B24B37/22

CPC classification number: B24B37/245 ,  B24B37/11 ,  B24B37/22 ,  B24B37/26

Abstract: A polishing pad capable of removing waviness of a surface of a polishing target having a curved surface is provided. A polishing pad (10) includes a structure (40, 50) including a polishing surface (30) formed of a hard resin layer (40), the structure (40, 50) allowing the polishing surface (30) to follow a curved surface of a polishing target (90).