公开(公告)号：US20170252890A1

公开(公告)日：2017-09-07

申请号：US15504772

申请日：2015-07-30

Applicant: FUJIMI INCORPORATED

Inventor： Yutaka NIWANO ,  Hitoshi MORINAGA ,  Keigo OHASHI ,  Kazusei TAMAI

IPC: B24B37/22 ,  B24B37/26 ,  B24B37/24

CPC classification number: B24B37/22 ,  B24B29/00 ,  B24B37/00 ,  B24B37/11 ,  B24B37/245 ,  B24B37/26 ,  B24D11/00

Abstract: A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.

公开(公告)号：US20170252892A1

公开(公告)日：2017-09-07

申请号：US15504793

申请日：2015-07-30

Applicant: FUJIMI INCORPORATED

Inventor： Koji KATAYAMA ,  Keigo OHASHI ,  Eiichi YAMADA ,  Hitoshi MORINAGA

IPC: B24B37/24 ,  B24B37/26 ,  B24B37/22

CPC classification number: B24B37/245 ,  B24B37/11 ,  B24B37/22 ,  B24B37/26

Abstract: A polishing pad capable of removing waviness of a surface of a polishing target having a curved surface is provided. A polishing pad (10) includes a structure (40, 50) including a polishing surface (30) formed of a hard resin layer (40), the structure (40, 50) allowing the polishing surface (30) to follow a curved surface of a polishing target (90).