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公开(公告)号：US20250122407A1
公开(公告)日：2025-04-17
申请号：US18688101
申请日：2022-08-19
Applicant: FUJIMI INCORPORATED
Inventor： Yoshiyuki TANABE , Maki ASADA , Kohsuke TSUCHIYA
Abstract: A polishing composition having excellent bump cancellation ability at a periphery of an HLM and being able to improve a polishing removal rate is provided. This polishing composition contains an abrasive, a basic compound, and water. The polishing composition contains a globular abrasive as the abrasive and further contains an alkali metal salt.
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