公开(公告)号：US20180012787A1

公开(公告)日：2018-01-11

申请号：US15702021

申请日：2017-09-12

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yoshifumi OKA ,  Masami AOYAMA

IPC: H01L21/683 ,  H01L21/78 ,  H01L21/3065 ,  H01L23/00 ,  H01L21/302

CPC classification number: H01L21/6836 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/78 ,  H01L24/27

Abstract: A method of processing a semiconductor wafer, in which a mask is formed: by cutting, with CO2 laser, a portion corresponding to a street, out of a temporary-adhesive of a surface protective tape to protect on a patterned face; carrying out dicing with SF6 plasma; and carrying out ashing, by removing a layer of the temporary-adhesive, with O2 plasma; a semiconductor chip; and a surface protective tape.

公开(公告)号：US20160020423A1

公开(公告)日：2016-01-21

申请号：US14868001

申请日：2015-09-28

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Keiji SAITO ,  Masami AOYAMA ,  Kunihiko ISHIGURO ,  Naoaki MIHARA ,  Tetsuya MIEDA

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/00

CPC classification number: H01L51/5246 ,  C08K5/0091 ,  C08L23/22 ,  H01L27/3241 ,  H01L51/0036 ,  H01L51/004 ,  H01L51/0077 ,  H01L51/5253 ,  H01L51/5259

Abstract: Provided are a resin composition for element encapsulation for organic electronic devices and other things, which have excellent long-term reliability and excellent visibility by capturing not only the moisture on the front surface or lateral surfaces of the resin composition for element encapsulation for organic electronic devices, but also the moisture permeating through the interior of the resin composition for element encapsulation for organic electronic devices. The resin composition includes a polyisobutylene resin (A) containing a polyisobutylene skeleton in a main chain or in a side chain and having a weight average molecular weight (Mw) of 300,000 or more; and a tackifying agent (B) as main components, includes an organometallic compound (C) having hygroscopic properties, and has a water content of 1000 ppm or less.

Abstract translation: 提供一种用于有机电子器件等的元件封装用树脂组合物，其具有优异的长期可靠性和优异的可见性，不仅捕获用于有机电子器件的元件封装用树脂组合物的前表面或侧面的水分 ，而且透过用于有机电子器件的元件封装的树脂组合物的内部的水分。 树脂组合物包含在主链或侧链中含有聚异丁烯骨架的重均分子量（Mw）为30万以上的聚异丁烯树脂（A） 和增粘剂（B）作为主要成分，具有吸湿性的有机金属化合物（C），水分含量为1000ppm以下。

公开(公告)号：US20160017197A1

公开(公告)日：2016-01-21

申请号：US14866802

申请日：2015-09-25

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Tetsuya MIEDA ,  Toshimitsu NAKAMURA ,  Kunihiko ISHIGURO ,  Masami AOYAMA

IPC: C09K3/10 ,  H01L51/00

CPC classification number: C09K3/10 ,  C08L23/22 ,  C09K2200/0239 ,  C09K2200/0247 ,  C09K2200/04 ,  C09K2200/0617 ,  H01L51/004 ,  H01L51/5237 ,  H01L51/524 ,  H01L51/5259 ,  H01L2251/5369 ,  C08L57/02

Abstract: Provided are an element sealing resin composition for organic electronic devices, which promotes a balance between the water vapor barrier properties and adhesiveness, decreases the water content, and sufficiently suppresses the generation of outgases, so that consequently the service life of an element for organic electronic devices can be lengthened, and which gives a satisfactory external appearance when used to seal an organic electronic device; an element sealing resin sheet for organic electronic devices; an organic electroluminescent element; and an image display apparatus. Disclosed is an element sealing resin composition for organic electronic devices, comprising a polyisobutylene resin (A) having a weight average molecular weight (Mw) of 10,000 to 300,000 and a hydrogenated cyclic olefin-based polymer (B), and having a water content according to the Karl-Fischer method of 500 ppm or less and an amount of outgas generation of 500 ppm or less when heated at 85° C. for 1 hour.

Abstract translation: 提供一种有机电子器件的元件密封用树脂组合物，其促进水蒸汽阻隔性和粘合性之间的平衡，降低含水量，并充分抑制残留物的产生，从而有机电子元件的使用寿命 可以延长装置，并且当用于密封有机电子装置时，其具有令人满意的外观; 用于有机电子器件的元件密封树脂片; 有机电致发光元件; 和图像显示装置。 公开了一种有机电子器件的元件密封用树脂组合物，其包含重均分子量（Mw）为10,000〜300,000的聚异丁烯树脂（A）和氢化环状烯烃系聚合物（B），并且其含水量为 至500ppm以下的卡尔费休法，并且在85℃下加热1小时时的排气量为500ppm以下。

公开(公告)号：US20170152411A1

公开(公告)日：2017-06-01

申请号：US15428580

申请日：2017-02-09

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Naoaki MIHARA ,  Noriyuki KIRIKAE ,  Jirou SUGIYAMA ,  Masami AOYAMA

IPC: C09J9/02 ,  H01L21/78 ,  H01L21/683 ,  C09J183/04

CPC classification number: C09J9/02 ,  C08K3/08 ,  C08K2003/085 ,  C09J7/00 ,  C09J11/04 ,  C09J11/06 ,  C09J183/04 ,  H01L21/52 ,  H01L21/6836 ,  H01L21/78

Abstract: An adhesive film that shows excellent heat resistance while showing excellent stress relaxation property, which further shows high conductivity that enables application to rear-side electrodes for power semiconductors without the use of expensive precious metals such as silver, which also shows sufficient adhesive strength without protruding from the device, and a method for processing semiconductors using the same, are provided. In particular, a conductive adhesive film, which includes two or more types of metal particles including at least Cu and a polymer that has a polydimethylsiloxane structure, is provided. Further, a dicing die bonding film, which is obtained by laminating a dicing tape on the conductive adhesive film, as well as a method for processing semiconductor wafers using said adhesive film and the dicing die bonding film, are provided.

公开(公告)号：US20170152410A1

公开(公告)日：2017-06-01

申请号：US15428384

申请日：2017-02-09

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Masami AOYAMA ,  Noriyuki KIRIKAE

IPC: C09J9/02 ,  C09J7/02 ,  H01L21/52 ,  H01L21/683 ,  H01L21/78 ,  C09J11/06 ,  C09J179/08

Abstract: A conductive adhesive that does not contain toxic substances such as solder (lead) and shows excellent adhesiveness. Specifically, it is a conductive adhesive composition, which includes: (A) a thermosetting resin; (C) a filler that contains a metal element; and (D) at least one catalyst or curing agent, wherein the reaction initiation temperature for the (A) thermosetting resin and the (D) at least one catalyst or curing agent is 180° C. or higher. More preferably, the reaction initiation temperature is 200° C. or higher. More preferably, it is a conductive adhesive composition that further includes (B) a flux and (E) a polymer component.

公开(公告)号：US20140034532A1

公开(公告)日：2014-02-06

申请号：US14052614

申请日：2013-10-11

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Masami AOYAMA

IPC: B65D71/50

CPC classification number: B65D71/50 ,  B65D81/058 ,  B65D85/672 ,  B65D2581/057 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68377

Abstract: A roll has a structure in which a film is wound around a hollow core. The film is a dicing die bonding film having a surface where depressions and protrusions are formed. The roll is placed in a storage bag. Side plates are provided to both end portions of the roll being placed in the storage bag. Protruded portions of the side plates are attached by being inserted into both end portions of a follow portion of the core. With a pair of the side plates being attached to top and bottom ends of the roll, the side plates and the roll are secured with two to four bands. The bands are provided all around the outer portions of the side plates and the roll (storage bag) such that at least two bands cross, whereby the side plates and the roll are secured.

Abstract translation: 卷具有将膜卷绕在中空芯上的结构。 该膜是具有形成凹部和突起的表面的切割芯片接合膜。 将卷放在存放袋中。 侧板设置在放置在储存袋中的辊的两端部。 侧板的突出部分通过插入到芯的跟随部分的两个端部中而附接。 当一对侧板被连接到辊的顶端和底端时，侧板和辊用两至四个带固定。 所述带全部设置在侧板和卷（存储袋）的外侧部分周围，使得至少两个带交叉，由此侧板和卷被固定。

公开(公告)号：US20160362587A1

公开(公告)日：2016-12-15

申请号：US15248366

申请日：2016-08-26

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Masami AOYAMA ,  Takumi Asanuma ,  Yasushi Ishizaka

IPC: C09J119/00 ,  H01L51/52 ,  H01L23/29 ,  H01L51/00 ,  H01L31/048

CPC classification number: C09J119/006 ,  C08F299/00 ,  C09K3/1006 ,  C09K2200/0617 ,  H01L23/293 ,  H01L31/0481 ,  H01L51/004 ,  H01L51/448 ,  H01L51/5246 ,  H01L2924/0002 ,  Y02E10/549 ,  C08K5/50 ,  C08K5/07 ,  H01L2924/00

Abstract: A resin composition for sealing an electronic device and other things being capable of sealing an electronic device without trapping air and being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth) acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C═C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted, non-N-containing divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group; l and m each represent 0 or 1; n represents an integer from 15 to 150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.

Abstract translation: 其中R 1和R 2各自表示羟基或H 2C≡C（R 7）-COO-; R3和R4各自表示C1-C16取代或未取代的，非含N的二价有机基团; R5，R6和R7各自表示氢原子或C1-C10烷基; l和m各自表示0或1; n表示15〜150的整数， x：y = 0〜100：100〜0; R1和R2不能都是羟基。

公开(公告)号：US20150017375A1

公开(公告)日：2015-01-15

申请号：US14505352

申请日：2014-10-02

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Masami AOYAMA ,  Hiromitsu Maruyama

IPC: C09J7/02 ,  C09J133/08

CPC classification number: C09J7/0217 ,  B32B2405/00 ,  C09J7/38 ,  C09J7/385 ,  C09J133/08 ,  C09J2203/326 ,  C09J2433/00 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  Y10T428/1476

Abstract: The adhesive sheet wound into a roll includes: a long release film; an adhesive layer provided in a label form on the release film; and a pressure-sensitive adhesive film having a label part covering the adhesive layer and provided so as to be in contact with the release film around the adhesive layer and a peripheral part surrounding an outside of the label part, wherein a through hole penetrating the pressure-sensitive adhesive film is provided outside a portion corresponding to a part of the adhesive layer intended to be attached to an adherend and inside the label part, and wherein outer circumference of the adhesive layer×1/43≦maximum width of the through hole×number of the through holes per label part of the pressure-sensitive adhesive film≦outer circumference of the adhesive layer is satisfied.

Abstract translation: 卷绕成卷的粘合片包括：长释放膜; 在剥离膜上以标签形式提供的粘合剂层; 以及粘合剂膜，其具有覆盖所述粘合剂层并且设置成与所述粘合剂层周围的剥离膜接触的标签部分和围绕所述标签部分的外部的周边部分，其中贯穿所述压力的通孔 敏感性粘合剂膜设置在与粘合剂层的一部分相对应的部分的外侧，粘合层的一部分将附着于被粘物和标签部分内，并且其中粘合层的外周×1/43＆lt;通孔的最大宽度× 粘合剂膜的每个标签部分的通孔数量＆nlE;满足粘合剂层的外周。

公开(公告)号：US20150017373A1

公开(公告)日：2015-01-15

申请号：US14505143

申请日：2014-10-02

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Masami AOYAMA ,  Hiromitsu Maruyama

IPC: C09J7/02 ,  C09J133/08

CPC classification number: C09J133/08 ,  C09J7/20 ,  C09J2201/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/00 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68377 ,  Y10T428/1476

Abstract: The adhesive sheet 10 wound into a roll includes: a long release film 11; an adhesive layer 12 provided in a label form on the release film 11; and a pressure-sensitive adhesive film 13 having a label part 13a covering the adhesive layer 12 and provided so as to be in contact with the release film 11 around the adhesive layer 12 and a peripheral part 13b surrounding an outside of the label part 13a, wherein a through hole 14 penetrating the pressure-sensitive adhesive film 12 is provided in a place that is outside a portion corresponding to a part c of the adhesive layer 12 intended to be attached to an adherend and inside the label part 13a and that includes a part R of the pressure-sensitive adhesive film 13 intended to be attached to an adherend.

Abstract translation: 卷绕成卷的粘合片10包括：长释放膜11; 在剥离膜11上以标签形式设置的粘合剂层12; 以及具有覆盖粘合剂层12并且设置成与粘合剂层12周围的脱模膜11接触的标签部分13a和围绕标签部分13a外围的周边部分13b的压敏粘合膜13， 其中穿透粘合剂膜12的通孔14设置在与粘合剂层12的部分c相对应的部分的外侧，该粘合剂层12旨在附着于被粘物和标签部分13a的内部，并且包括 要粘附在被粘物上的压敏粘合膜13的部分R。

公开(公告)号：US20180012788A1

公开(公告)日：2018-01-11

申请号：US15702455

申请日：2017-09-12

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yoshifumi OKA ,  Masami AOYAMA

IPC: H01L21/683 ,  H01L21/3065 ,  C09J7/02

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J2201/602 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2205/302 ,  C09J2423/046 ,  C09J2433/006 ,  H01L21/3065 ,  H01L21/31138 ,  H01L21/6831 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834

Abstract: A wafer-fixing tape, having: an temporary-adhesive layer provided on a substrate film, wherein the substrate film contains an ionomer resin comprising a terpolymer crosslinked by a metal ion, and wherein an arithmetic average roughness Ra of a surface of the substrate film opposite to the temporary-adhesive layer 5b is from 0.1 to 3.0 μm; a processing method of a semiconductor wafer; and a semiconductor chip.