公开(公告)号：US20070148814A1

公开(公告)日：2007-06-28

申请号：US11317622

申请日：2005-12-22

申请人： Fabio Pellizzer ,  Roberto Bez ,  Maria Marangon ,  Roberta Piva ,  Laura Aina

发明人： Fabio Pellizzer ,  Roberto Bez ,  Maria Marangon ,  Roberta Piva ,  Laura Aina

IPC分类号： H01L21/06

CPC分类号： H01L45/1691 ,  H01L27/2445 ,  H01L27/2463 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/126 ,  H01L45/144

摘要： A process for manufacturing a phase change memory array includes the steps of: forming a plurality of phase change memory cells in an array region of a semiconductor wafer, the phase change memory cells arranged in rows and columns according to a row direction and to a column direction, respectively; forming a control circuit in a control region of the semiconductor wafer; forming a plurality of first bit line portions for mutually connecting phase change memory cells arranged on a same column; forming first level electrical interconnection structures; and forming second level electrical interconnection structures above the first level electrical interconnection structures. The first level electrical interconnection structures include second bit line portions laying on and in contact with the first bit line portions and projecting from the first bit line portions in the column direction for connecting the first bit line portions to the control circuit.

摘要翻译： 一种相变存储器阵列的制造方法包括以下步骤：在半导体晶片的阵列区域中形成多个相变存储单元，根据行方向排列成行和列的相变存储单元和列 方向; 在所述半导体晶片的控制区域中形成控制电路; 形成多个第一位线部分，用于相互连接布置在同一列上的相变存储器单元; 形成一级电互连结构; 以及在所述第一级电互连结构之上形成第二级电互连结构。 第一级电互连结构包括布置在第一位线部分上并与第一位线部分接触的第二位线部分，并且在列方向上从第一位线部分突出以将第一位线部分连接到控制电路。

公开(公告)号：US07606056B2

公开(公告)日：2009-10-20

申请号：US11317622

申请日：2005-12-22

申请人： Fabio Pellizzer ,  Roberto Bez ,  Maria Santina Marangon ,  Roberta Piva ,  Laura Aina

发明人： Fabio Pellizzer ,  Roberto Bez ,  Maria Santina Marangon ,  Roberta Piva ,  Laura Aina

IPC分类号： G11C5/06

CPC分类号： H01L45/1691 ,  H01L27/2445 ,  H01L27/2463 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/126 ,  H01L45/144

摘要： A process for manufacturing a phase change memory array includes the steps of: forming a plurality of phase change memory cells in an array region of a semiconductor wafer, the phase change memory cells arranged in rows and columns according to a row direction and to a column direction, respectively; forming a control circuit in a control region of the semiconductor wafer; forming a plurality of first bit line portions for mutually connecting phase change memory cells arranged on a same column; forming first level electrical interconnection structures; and forming second level electrical interconnection structures above the first level electrical interconnection structures. The first level electrical interconnection structures include second bit line portions laying on and in contact with the first bit line portions and projecting from the first bit line portions in the column direction for connecting the first bit line portions to the control circuit.

摘要翻译： 一种相变存储器阵列的制造方法包括以下步骤：在半导体晶片的阵列区域中形成多个相变存储单元，根据行方向排列成行和列的相变存储单元和列 方向; 在所述半导体晶片的控制区域中形成控制电路; 形成多个第一位线部分，用于相互连接布置在同一列上的相变存储器单元; 形成一级电互连结构; 以及在所述第一级电互连结构之上形成第二级电互连结构。 第一级电互连结构包括布置在第一位线部分上并与第一位线部分接触的第二位线部分，并且在列方向上从第一位线部分突出以将第一位线部分连接到控制电路。