公开(公告)号：US20110291132A1

公开(公告)日：2011-12-01

申请号：US12790496

申请日：2010-05-28

申请人： Fang-Chang LIU ,  Kuan-Ping Lee

发明人： Fang-Chang LIU ,  Kuan-Ping Lee

IPC分类号： H01L33/50

CPC分类号： H01L33/50 ,  H01L33/44 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light-emitting device (LED) is disclosed. The LED includes a carrier substrate having a blue light emitter thereon. A layer containing a fluorescent material is on the blue light emitter. An encapsulant is disposed around the blue light emitter. Pigments are suspended between an outer surface of the encapsulant and the blue light emitter.

摘要翻译： 公开了一种发光器件（LED）。 LED包括其上具有蓝光发射器的载体衬底。 含有荧光材料的层在蓝光发射器上。 密封剂设置在蓝光发射器周围。 颜料悬浮在密封剂的外表面和蓝光发射体之间。

公开(公告)号：US20090263927A1

公开(公告)日：2009-10-22

申请号：US12493758

申请日：2009-06-29

申请人： Tzu-Han LIN ,  Tzy-Ying LIN ,  Fang-Chang LIU ,  Kai-Chih WANG

发明人： Tzu-Han LIN ,  Tzy-Ying LIN ,  Fang-Chang LIU ,  Kai-Chih WANG

IPC分类号： H01L21/00 ,  H01L21/78 ,  H01L31/02 ,  H01L21/762

CPC分类号： H01L27/14618 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01078 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

摘要： Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge.

摘要翻译： CMOS图像传感器芯片级封装的隔离结构及其制造方法。 CMOS图像传感器芯片级封装包括被配置为用于封装的支撑结构的透明衬底。 透明基板包括第一切削刃和第二切削刃。 具有裸片电路的CMOS图像传感器芯片安装在透明基板上。 密封剂设置在封装有CMOS图像传感器芯片的基板上。 连接从管芯电路延伸到密封剂上的封装的多个端子触头，其中连接由第一切削刃暴露。 隔离结构设置在第一切削刃上，钝化暴露的连接并与第二切削刃共同设计。