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公开(公告)号:US20040129688A1
公开(公告)日:2004-07-08
申请号:US10715124
申请日:2003-11-18
申请人: Fanuc Ltd.
发明人: Atsushi Mori
IPC分类号: B23K026/00 , G06F019/00
CPC分类号: G05B19/404 , B23K26/0344 , B23K26/06 , B23K26/0626 , B23K26/08 , B23K26/0884 , G05B19/41 , G05B2219/45041 , G05B2219/45165 , G05B2219/49353 , Y02P90/265
摘要: A laser machining apparatus capable of changing a laser output condition at a desired machining position and time without regard to an interpolation period. When the remaining motion command amount Pa in the former of successive blocks, used for the interpolation period Q0 between these blocks, is less than a motion command amount corresponding to a command speed in the interpolation period ITP, such deficiency Pb is supplemented by a motion command for the latter block, thus maintaining a moving speed unchanged. The laser output condition is changed between the blocks. A time period t1nullITPnullPa/(PanullPb) from when the interpolation period Q0 between the blocks starts to when a change from the former block to the latter is completed is determined. In an interpolation period Qnull1, a CNC sets the time period t1 and the laser output condition in laser output control signal generating means which changes the laser output condition when the time period t1 has elapsed from the start of the interpolation period Q0, making it possible to change the laser output condition at an arbitrary time without being limited by the interpolation period, whereby a highly accurate laser machining can be achieved.
摘要翻译: 一种激光加工装置,其能够在不考虑内插周期的情况下在期望的加工位置和时间改变激光输出状态。 当用于这些块之间的插值周期Q0的前一个连续块中的剩余运动指令量Pa小于与插值周期ITP中的指令速度相对应的运动指令量时,这种缺陷Pb被补充运动 命令为后一个块,从而保持移动速度不变。 激光输出条件在块之间变化。 确定当从前一个块到后一个块的改变完成时从块开始到插入周期Q0之间的时间段t1 = ITP×Pa /(Pa + Pb)。 在插补期间Q-1中,CNC设定激光输出控制信号发生装置中的时间段t1和激光输出条件,该激光输出控制信号发生装置在从插补期间Q0的开始经过时间t1之后改变激光输出条件, 可以在任意时间改变激光输出条件而不受插值周期的限制,从而可以实现高精度的激光加工。
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公开(公告)号:US20030234240A1
公开(公告)日:2003-12-25
申请号:US10426651
申请日:2003-05-01
申请人: Fanuc Ltd.
发明人: Etsuo Yamazaki , Atsushi Mori , Motohiko Sato
IPC分类号: B23K026/00
CPC分类号: B23K26/702 , H01S3/1022 , H01S3/1305 , H01S5/06825 , H01S5/06835
摘要: A laser machining apparatus capable of effecting a feedback control of a laser output from an early stage of operation and detecting an abnormality of the laser output quickly and precisely. A laser output command issued from a laser output commanding section is subjected to a feedback control and inputted to a laser pumping power supply for a laser oscillator. An output of a laser power sensor is amplified by an amplifier and compared with an output of a measurement simulating section for estimating the measured value of the laser output. A difference of the measured value and the simulated value of the laser output is inputted to the feedback control section and also to an output abnormality detecting section. A measurement input estimating section calculates an average power which should be outputted in a normal condition of the laser machining based on data of the laser output command. A fist order delay system can be adopted as the measurement simulating section. The laser output abnormality detecting section determines whether or not the difference of the measured value and the simulated value is within an allowable range for the detection of an abnormality of the laser machining.
摘要翻译: 一种激光加工设备,其能够从早期操作实现激光输出的反馈控制,并且快速且精确地检测激光输出的异常。 从激光输出指令部发出的激光输出指令经受反馈控制,并输入激光振荡器的激光泵浦电源。 激光功率传感器的输出由放大器放大,并与用于估计激光输出的测量值的测量模拟部分的输出进行比较。 将测量值和激光输出的模拟值的差异输入到反馈控制部分,以及输出异常检测部分。 测量输入估计部分基于激光输出命令的数据来计算应在激光加工的正常状态下输出的平均功率。 作为测量模拟部分,可采用第一阶延迟系统。 激光输出异常检测部判定测定值和模拟值的差是否在检测激光加工异常的容许范围内。
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公开(公告)号:US20020053556A1
公开(公告)日:2002-05-09
申请号:US09987602
申请日:2001-11-15
申请人: FANUC LTD.
发明人: Yoshinori Nakata , Atsushi Mori , Tadashi Kurosawa
IPC分类号: B23K026/38 , B23K026/14
CPC分类号: B23K26/1482 , B23K26/0665 , B23K26/14 , B23K26/142 , B23K26/1436 , B23K26/1476 , B23K26/382 , B23K26/40 , B23K2103/04 , B23K2103/50
摘要: A piercing nozzle (2) having a nozzle hole (2a) larger than the diameter of a converged laser beam (10) and smaller than the diameter of a hole (1a) of a cutting nozzle (1) is in use. Further, an underlay (3) having a hole (3a) at a position corresponding to the nozzle hole (2a) is placed under the piercing nozzle (2) through a clearance (5). Piercing is carried out by irradiating the laser beam (10) to a machining target (6) through nozzle holes (1a, 2a) and (3a) on condition that a laser oscillator is set to output high power. The diameter of a hole machined by the piercing is small, and less scattered dross is produced. The scattered dross is cooled down within the clearance (5) and is then dropped down to the underlay (3), so that the adhesion of the scattered dross to the machining target does not occur. Since a small hole is machined with the high power, the machining time for piercing is remarkably shortened.
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