公开(公告)号：US08203168B2

公开(公告)日：2012-06-19

申请号：US12888174

申请日：2010-09-22

申请人： Felix Schinner ,  Christian Joos ,  Wolfgang Hauser ,  Michael Schmidt ,  Thomas Burke

发明人： Felix Schinner ,  Christian Joos ,  Wolfgang Hauser ,  Michael Schmidt ,  Thomas Burke

IPC分类号： H01L33/00

CPC分类号： H05K3/3442 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49589 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/202 ,  H05K2201/10636 ,  H05K2201/10787 ,  H05K2201/10924 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.

摘要翻译： 本发明涉及具有半导体元件，特别是半导体芯片的电子部件，以及至少一个SMD元件，具有支撑平台的芯片载体和连接引线。 由此通过芯片连接电连接到连接引线的键指的半导体部件安装在支撑平台上，并且SMD部件通过布置在其上的接触表面将支撑平台连接到连接引线，壳体包围半导体 组件，SMD组件，并且至少部分地是芯片载体。 在SMD部件的区域中的支撑平台和连接引线被成型以形成阻挡层，使得自由流动的材料从连接到芯片载体的SMD部件的接触表面流到支撑平台上， 阻止连接引线。