专利检索 ap:("Feras Eid" OR "Shrenik Kothari" OR "Chandra M. Jha" OR "Johanna M. Swan" OR "Michael J. Baker" OR "Shawna M. Liff" OR "Thomas L. Sounart" OR "Betsegaw K. Gebrehiwot" OR "Shankar Devasenathipathy" OR "Taylor Gaines" OR "Digvijay Ashokkumar Raorane") AND inv:"Betsegaw K. Gebrehiwot" 第 1 页

1.

发明申请
STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT 审中-公开

公开(公告)号：US20190214328A1

公开(公告)日：2019-07-11

申请号：US15866793

申请日：2018-01-10

申请人： Feras Eid , Shrenik Kothari , Chandra M. Jha , Johanna M. Swan , Michael J. Baker , Shawna M. Liff , Thomas L. Sounart , Betsegaw K. Gebrehiwot , Shankar Devasenathipathy , Taylor Gaines , Digvijay Ashokkumar Raorane

发明人： Feras Eid , Shrenik Kothari , Chandra M. Jha , Johanna M. Swan , Michael J. Baker , Shawna M. Liff , Thomas L. Sounart , Betsegaw K. Gebrehiwot , Shankar Devasenathipathy , Taylor Gaines , Digvijay Ashokkumar Raorane

IPC分类号： H01L23/433 , H01L25/00 , H01L21/56 , H01L23/29 , H01L25/18

CPC分类号： H01L23/4334 , H01L21/56 , H01L23/04 , H01L23/16 , H01L23/295 , H01L23/367 , H01L23/42 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2225/06513 , H01L2225/06517 , H01L2225/06568 , H01L2225/06582 , H01L2225/06589

摘要： A semiconductor device that has a semiconductor die coupled to a substrate. A mold compound encapsulates the semiconductor die, and at least one thermal conductive material section extends from adjacent the semiconductor die through the mold compound. The at least one conductive material section thus conveys heat from the semiconductor die through the mold compound.