公开(公告)号：US20140246770A1

公开(公告)日：2014-09-04

申请号：US13782893

申请日：2013-03-01

申请人： Chandra M. Jha ,  Feras Eid ,  Johanna M. Swan ,  Ashish Gupta

发明人： Chandra M. Jha ,  Feras Eid ,  Johanna M. Swan ,  Ashish Gupta

IPC分类号： H01L23/373

CPC分类号： H01L23/3733 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/433 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/1133 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11826 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13078 ,  H01L2224/13147 ,  H01L2224/13193 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2745 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/16724 ,  H01L2924/16747 ,  H01L2924/3511 ,  Y10T428/249921 ,  Y10T428/26 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014

摘要： A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.

摘要翻译： 描述了铜纳米棒热界面材料（TIM）。 铜纳米棒TIM包括多个铜纳米棒，其具有与第一表面热耦合的第一端和朝向第二表面延伸的第二端。 在第二端形成多个铜纳米棒分支。 铜纳米棒分支冶金结合到第二表面。 第一表面可以是模具的背面。 第二表面可以是热扩散或第二模具。 TIM可以包括围绕铜纳米棒的基质材料。 在一个实施方案中，铜纳米棒以簇形成。

公开(公告)号：US09601406B2

公开(公告)日：2017-03-21

申请号：US13782893

申请日：2013-03-01

申请人： Chandra M. Jha ,  Feras Eid ,  Johanna M. Swan ,  Ashish Gupta

发明人： Chandra M. Jha ,  Feras Eid ,  Johanna M. Swan ,  Ashish Gupta

IPC分类号： H01L23/34 ,  H01L21/8238 ,  H01L23/373 ,  H01L23/00 ,  H01L23/433

CPC分类号： H01L23/3733 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/433 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/1133 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11826 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13078 ,  H01L2224/13147 ,  H01L2224/13193 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2745 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/16724 ,  H01L2924/16747 ,  H01L2924/3511 ,  Y10T428/249921 ,  Y10T428/26 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014

摘要： A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.

公开(公告)号：US09530718B2

公开(公告)日：2016-12-27

申请号：US13727409

申请日：2012-12-26

申请人： Hitesh Arora ,  Mihir A. Oka ,  Chandra M. Jha

发明人： Hitesh Arora ,  Mihir A. Oka ,  Chandra M. Jha

IPC分类号： H01L23/373 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/3737 ,  H01L23/3142 ,  H01L23/3157 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.

摘要翻译： 包含基质材料的模具背面薄膜; 以及一定量的填料颗粒使模具背面膜导热，其中填料颗粒的热导率大于二氧化硅颗粒的热导率。 一种包括在模具的背面上引入模具背面薄膜的方法，所述模具背面薄膜包括具有弹性体的基体材料，所述基体材料具有使所述模具背面薄膜导热的填充剂颗粒的量，其中所述填充剂的热导率 颗粒大于二氧化硅颗粒的热导率; 并将模具设置在包装中。

公开(公告)号：US20140177194A1

公开(公告)日：2014-06-26

申请号：US13727409

申请日：2012-12-26

申请人： Hitesh Arora ,  Mihir A. Oka ,  Chandra M. Jha

发明人： Hitesh Arora ,  Mihir A. Oka ,  Chandra M. Jha

IPC分类号： H05K1/18 ,  H01L21/50

CPC分类号： H01L23/3737 ,  H01L23/3142 ,  H01L23/3157 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.

摘要翻译： 包含基质材料的模具背面薄膜; 以及一定量的填料颗粒使模具背面膜导热，其中填料颗粒的热导率大于二氧化硅颗粒的热导率。 一种包括在模具的背面上引入模具背面薄膜的方法，所述模具背面薄膜包括具有弹性体的基体材料，所述基体材料具有使所述模具背面薄膜导热的填充剂颗粒的量，其中所述填充剂的热导率 颗粒大于二氧化硅颗粒的热导率; 并将模具设置在包装中。

公开(公告)号：US20190214328A1

公开(公告)日：2019-07-11

申请号：US15866793

申请日：2018-01-10

申请人： Feras Eid ,  Shrenik Kothari ,  Chandra M. Jha ,  Johanna M. Swan ,  Michael J. Baker ,  Shawna M. Liff ,  Thomas L. Sounart ,  Betsegaw K. Gebrehiwot ,  Shankar Devasenathipathy ,  Taylor Gaines ,  Digvijay Ashokkumar Raorane

发明人： Feras Eid ,  Shrenik Kothari ,  Chandra M. Jha ,  Johanna M. Swan ,  Michael J. Baker ,  Shawna M. Liff ,  Thomas L. Sounart ,  Betsegaw K. Gebrehiwot ,  Shankar Devasenathipathy ,  Taylor Gaines ,  Digvijay Ashokkumar Raorane

IPC分类号： H01L23/433 ,  H01L25/00 ,  H01L21/56 ,  H01L23/29 ,  H01L25/18

CPC分类号： H01L23/4334 ,  H01L21/56 ,  H01L23/04 ,  H01L23/16 ,  H01L23/295 ,  H01L23/367 ,  H01L23/42 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/06589

摘要： A semiconductor device that has a semiconductor die coupled to a substrate. A mold compound encapsulates the semiconductor die, and at least one thermal conductive material section extends from adjacent the semiconductor die through the mold compound. The at least one conductive material section thus conveys heat from the semiconductor die through the mold compound.