公开(公告)号：US20190244939A1

公开(公告)日：2019-08-08

申请号：US16340150

申请日：2017-10-17

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

Inventor： Chuanbiao LIU ,  Xiaofeng LIU ,  Feng GU ,  Kuai QIN

IPC: H01L25/075

Abstract: A Chip-on-Board (COB) display module is provided, which includes a Printed Circuit Board (PCB) a plurality of Light-Emitting Diode (LED) luminous units, a packaging adhesive layer and a light shielding layer wherein the plurality of LED luminous units are mounted and fixed on the PCB, the packaging adhesive layer covers the PCB and wraps the LED luminous units thereon, a liquid passage is provided in the packaging adhesive layer between every two adjacent LED luminous units, and the light shielding layer fills the liquid passage. The COB display module further includes a reflecting layer, and the reflecting layer covers two sidewalls of the liquid passage, and is positioned between the packaging adhesive layer and the light shielding layer. A manufacturing method for the COB display module is also disclosed.

公开(公告)号：US20180083171A1

公开(公告)日：2018-03-22

申请号：US15711057

申请日：2017-09-21

Applicant: Foshan NationStar Optoelectronics Co., Ltd.

Inventor： Chuanbiao LIU ,  Xiaofeng LIU ,  Zongxian XIE ,  Qiang ZHAO ,  Kailiang FAN ,  Kuai QIN ,  Lu YANG

IPC: H01L33/60 ,  H01L33/52 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/62

Abstract: An LED bracket, an LED device and an LED display screen are disclosed. The LED bracket includes a metal bracket and a cup cover wrapping the metal bracket. The metal bracket includes a first metal pin embedded into the cup cover and a second metal pin exposed from the cup cover. A part, located on a top of the second metal pin, in the cup cover is a reflection cup. A light absorbing layer is disposed on a part of an outer side face of the reflection cup.