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1.发明授权Method and apparatus for creating time-resolved emission images of integrated circuits using a single-point single-photon detector and a scanning system 失效使用单点单光子检测器和扫描系统创建集成电路的时间分辨发射图像的方法和装置公开(公告)号：US08115170B2
公开(公告)日：2012-02-14
申请号：US11621217
申请日：2007-01-09
申请人： Franco Stellari , Alberto Tosi , Franco Zappa , Peilin Song
发明人： Franco Stellari , Alberto Tosi , Franco Zappa , Peilin Song
CPC分类号： G02B21/0084 , G01J3/2803 , G01J3/2889 , G01J3/443 , G01R31/307 , G02B21/0028
摘要： A Scanning Time-Resolved Emission (S-TRE) microscope or system includes an optical system configured to collect light from emissions of light generated by a device under test (DUT). A scanning system is configured to permit the emissions of light to be collected from positions across the DUT in accordance with a scan pattern. A timing photodetector is configured to detect a single photon or photons of the emissions of light from the particular positions across the DUT such that the emissions of light are correlated to the positions to create a time-dependent map of the emissions of light across the DUT.
摘要翻译： 扫描时间分辨发射（S-TRE）显微镜或系统包括被配置为从被测设备（DUT）产生的光的发射中收集光的光学系统。 扫描系统被配置为允许根据扫描模式从穿过DUT的位置收集光的发射。 定时光电检测器被配置为检测来自DUT的特定位置的光发射的单个光子或光子，使得光的发射与位置相关，以产生穿过DUT的光发射的时间依赖的映射 。
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2.发明授权公开(公告)号：US08193009B2
公开(公告)日：2012-06-05
申请号：US12534592
申请日：2009-08-03
申请人： Alberto Tosi , Franco Stellari , Peilin Song
发明人： Alberto Tosi , Franco Stellari , Peilin Song
IPC分类号： H01L21/66
CPC分类号： G01R31/311 , G01R1/0408 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要： Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
摘要翻译： 提供了用于封装IC（集成电路）芯片的装置和方法，以使得能够对IC芯片的背侧进行光学接入和对IC芯片的前侧的电接入。
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3.发明申请公开(公告)号：US20090286353A1
公开(公告)日：2009-11-19
申请号：US12534592
申请日：2009-08-03
申请人： Alberto Tosi , Franco Stellari , Peilin Song
发明人： Alberto Tosi , Franco Stellari , Peilin Song
IPC分类号： H01L21/52
CPC分类号： G01R31/311 , G01R1/0408 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要： Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
摘要翻译： 提供了用于封装IC（集成电路）芯片的装置和方法，以使得能够对IC芯片的背侧进行光学接入和对IC芯片的前侧的电接入。
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4.发明授权公开(公告)号：US07635904B2
公开(公告)日：2009-12-22
申请号：US11085734
申请日：2005-03-21
申请人： Alberto Tosi , Franco Stellari , Peilin Song
发明人： Alberto Tosi , Franco Stellari , Peilin Song
IPC分类号： H01L31/0203
CPC分类号： G01R31/311 , G01R1/0408 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要： Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
摘要翻译： 提供了用于封装IC（集成电路）芯片的装置和方法，以使得能够对IC芯片的背侧进行光学接入和对IC芯片的前侧的电接入。
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5.发明申请SYSTEM AND METHOD FOR ESTIMATION OF INTEGRATED CIRCUIT SIGNAL CHARACTERISTICS USING OPTICAL MEASUREMENTS 有权使用光学测量估计集成电路信号特性的系统和方法公开(公告)号：US20080204057A1
公开(公告)日：2008-08-28
申请号：US12115658
申请日：2008-05-06
申请人： Franco Stellari , Alberto Tosi , Peilin Song
发明人： Franco Stellari , Alberto Tosi , Peilin Song
IPC分类号： G01R31/00
CPC分类号： G01R31/311 , Y10T29/49004
摘要： Systems and methods for making electrical measurements using optical emissions include positioning a sensor/photodetector to measure radiation emissions from devices to be tested. Radiation emission information is collected from the device to be tested during electrical operation. Characteristic features of the radiation emission information are determined, and differences between the characteristic features are deciphered. Based on the differences, models are employed to determine electrical properties of the device, especially operational characteristics.
摘要翻译： 使用光学发射进行电气测量的系统和方法包括定位传感器/光电检测器以测量待测装置的辐射发射。 在电气操作期间，从要测试的设备收集辐射发射信息。 确定辐射发射信息的特征，特征特征之间的差异被解密。 基于差异，使用模型来确定装置的电气特性，特别是操作特性。
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6.发明授权System and method for estimation of integrated circuit signal characteristics using optical measurements 有权使用光学测量估计集成电路信号特性的系统和方法公开(公告)号：US07378859B2
公开(公告)日：2008-05-27
申请号：US11049324
申请日：2005-02-02
申请人： Franco Stellari , Alberto Tosi , Peilin Song
发明人： Franco Stellari , Alberto Tosi , Peilin Song
IPC分类号： G01R31/00
CPC分类号： G01R31/311 , Y10T29/49004
摘要： Systems and methods for making electrical measurements using optical emissions include positioning a sensor/photodetector to measure radiation emissions from devices to be tested. Radiation emission information is collected from the device to be tested during electrical operation. Characteristic features of the radiation emission information are determined, and differences between the characteristic features are deciphered. Based on the differences, models are employed to determine electrical properties of the device, especially operational characteristics.
摘要翻译： 使用光学发射进行电气测量的系统和方法包括定位传感器/光电检测器以测量待测装置的辐射发射。 在电气操作期间，从要测试的设备收集辐射发射信息。 确定辐射发射信息的特征，并对特征特征之间的差异进行解密。 基于差异，使用模型来确定装置的电气特性，特别是操作特性。
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公开(公告)号：US20090284736A1
公开(公告)日：2009-11-19
申请号：US12534556
申请日：2009-08-03
申请人： Alberto Tosi , Franco Stellari , Peilin Song
发明人： Alberto Tosi , Franco Stellari , Peilin Song
IPC分类号： G01N21/88
CPC分类号： G01R31/311 , G01R1/0408 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要： Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
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8.发明授权公开(公告)号：US07927898B2
公开(公告)日：2011-04-19
申请号：US12534556
申请日：2009-08-03
申请人： Alberto Tosi , Franco Stellari , Peilin Song
发明人： Alberto Tosi , Franco Stellari , Peilin Song
IPC分类号： H01L21/00
CPC分类号： G01R31/311 , G01R1/0408 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要： Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
摘要翻译： 提供了用于封装IC（集成电路）芯片的装置和方法，以使得能够对IC芯片的背侧进行光学接入和对IC芯片的前侧的电接入。
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9.发明授权System and method for estimation of integrated circuit signal characteristics using optical measurements 有权使用光学测量估计集成电路信号特性的系统和方法公开(公告)号：US07612571B2
公开(公告)日：2009-11-03
申请号：US12115658
申请日：2008-05-06
申请人： Franco Stellari , Alberto Tosi , Peilin Song
发明人： Franco Stellari , Alberto Tosi , Peilin Song
IPC分类号： G01R31/00
CPC分类号： G01R31/311 , Y10T29/49004
摘要： Systems and methods for making electrical measurements using optical emissions include positioning a sensor/photodetector to measure radiation emissions from devices to be tested. Radiation emission information is collected from the device to be tested during electrical operation. Characteristic features of the radiation emission information are determined, and differences between the characteristic features are deciphered. Based on the differences, models are employed to determine electrical properties of the device, especially operational characteristics.
摘要翻译： 使用光学发射进行电气测量的系统和方法包括定位传感器/光电检测器以测量待测装置的辐射发射。 在电气操作期间，从要测试的设备收集辐射发射信息。 确定辐射发射信息的特征，特征特征之间的差异被解密。 基于差异，使用模型来确定装置的电气特性，特别是操作特性。
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公开(公告)号：US20060208753A1
公开(公告)日：2006-09-21
申请号：US11085734
申请日：2005-03-21
申请人： Alberto Tosi , Franco Stellari , Peilin Song
发明人： Alberto Tosi , Franco Stellari , Peilin Song
CPC分类号： G01R31/311 , G01R1/0408 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要： Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
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